Multilayer chip ferrite beads FH CBM201209U501T suitable for automated SMT assembly and EMI RFI noise suppression
Price:
Negotiable
MOQ:
Negotiable
Delivery Time:
Negotiable
Product Description
Multilayer Chip Ferrite Ultra-High Current Beads
These multilayer chip ferrite beads offer high impedance and effective EMI/RFI suppression over a wide frequency range, suitable for various electronic equipment. Their compact, leadless design allows for simple SMT mounting, making them ideal for high-volume automated assembly. They are designed for noise suppression in power lines or ultra-high current signal lines.
Features & Applications
- Higher impedance compared to plug-in beads in the same size.
- Effective EMI and RFI suppression without leads, easily mounted on PCBs.
- Shape and size comply with EIA standards for SMT automatic mounting.
- Applications include noise suppression in power lines or ultra-high current signal lines of communication equipment, computers, LCD TVs, and other electrical devices.
Product Structure
The product structure consists of: a. Silver layer, b. Ni/Sn plating, c. Inner electrode, d. Ferrite body.
Technical Specifications
| Part Number | Dimensions (LWT) mm | Impedance () | Test Frequency (MHz) | DCR () Max | Rated Current (mA) Max |
| CBM060303X220T | 0.60.30.3 | 22 | 100 | 0.040 | 1800 |
| CBM060303X330T | 0.60.30.3 | 33 | 100 | 0.055 | 1500 |
| CBM060303X800T | 0.60.30.3 | 80 | 100 | 0.130 | 1000 |
| CBM060303X121T | 0.60.30.3 | 120 | 100 | 0.160 | 900 |
| CBM100505U000T | 1.00.50.5 | 0 | 100 | 0.02 | 2000 |
| CBM100505U050T | 1.00.50.5 | 5 | 100 | 0.02 | 2000 |
| CBM100505U101T | 1.00.50.5 | 100 | 100 | 0.15 | 1000 |
| CBM100505U102T | 1.00.50.5 | 1000 | 100 | 0.65 | 300 |
| CBM160808U000T | 1.60.80.8 | 0 | 100 | 0.01 | 6000 |
| CBM160808U050T | 1.60.80.8 | 5 | 100 | 0.01 | 6000 |
| CBM160808U101T | 1.60.80.8 | 100 | 100 | 0.06 | 2500 |
| CBM160808U102T | 1.60.80.8 | 1000 | 100 | 0.35 | 700 |
| CBM201209U000T | 2.01.20.9 | 0 | 100 | 0.01 | 6000 |
| CBM201209U050T | 2.01.20.9 | 5 | 100 | 0.01 | 6000 |
| CBM201209U101T | 2.01.20.9 | 100 | 100 | 0.045 | 4000 |
| CBM201209U102T | 2.01.20.9 | 1000 | 100 | 0.12 | 1500 |
| CBM321609U000T | 3.21.60.9 | 0 | 100 | 0.01 | 6000 |
| CBM321609U050T | 3.21.60.9 | 5 | 100 | 0.01 | 6000 |
| CBM321609U101T | 3.21.60.9 | 100 | 100 | 0.035 | 4000 |
| CBM321609U102T | 3.21.60.9 | 1000 | 100 | 0.12 | 2100 |
| CBM322513U110T | 3.22.51.3 | 11 | 100 | 0.02 | 6000 |
| CBM322513U150T | 3.22.51.3 | 15 | 100 | 0.02 | 6000 |
| CBM322513U121T | 3.22.51.3 | 120 | 100 | 0.03 | 5000 |
| CBM322513U102T | 3.22.51.3 | 1000 | 100 | 0.23 | 2500 |
| CBM451616U190T | 4.51.61.6 | 19 | 100 | 0.009 | 6000 |
| CBM451616U600T | 4.51.61.6 | 60 | 100 | 0.009 | 6000 |
| CBM453215U190T | 4.53.21.5 | 19 | 100 | 0.01 | 6000 |
| CBM453215U300T | 4.53.21.5 | 30 | 100 | 0.01 | 6000 |
| CBM453215U101T | 4.53.21.5 | 100 | 100 | 0.02 | 6000 |
| CBM453215U501T | 4.53.21.5 | 500 | 100 | 0.08 | 4000 |
Reliability Test Method
| No. | Items | Requirements | Test Methods and Remarks |
| 1 | Operating Temperature Range | -55+125 | Includes product surface temperature rise |
| 2 | Solder ability | No visible damage; 95% or more of electrode area shall be coated by new solder. | Preheating temperature:120~150, Preheating time: 60s, Solder: (96.5%Sn/3.0%Ag/0.5%Cu), Solder temperature: 2455, Immersion tin depth:10mm, Duration: 51s, Dip performance to a flux of about:3 ~ 5 s |
| 3 | Resistance to Soldering Heat | At least 95% of terminal electrode should be covered with solder. No mechanical damage. Impedance change: within 30%. | Preheating temperature: 120~150, Preheating time: 60s, Solder: (96.5%Sn/3.0%Ag/0.5%Cu), Solder temperature: 2605, Immersion tin depth:10mm, Duration: 101s, Dip performance to a flux of about:35 s |
| 4 | Adhesion of electrode | The termination and body should be no damage. | Applied force: 5N force for 1005 series; 7N force for 1608 series; 10N force for 2012, 3216 series; 15N force for 3225, 4532 series. Keep time: 101S |
| 5 | Low temperature resistance | No mechanical damage. Impedance change: within 30%. | Temperature:-552, Testing time: 10000 +24 h |
| 6 | Bending strength | No mechanical damage | Testing board: glass epoxy-resin substrate, For 0.5mm/s pressing speed, bending: 2mm, holding time: 20s1s |
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina