Multilayer chip ferrite beads FH CBM321609U320T with high impedance and ultra high current handling
Price:
Negotiable
MOQ:
Negotiable
Delivery Time:
Negotiable
Product Description
Multilayer Chip Ferrite Ultra-High Current Beads
These multilayer chip ferrite beads offer high impedance and effective EMI/RFI suppression over a wide frequency range, suitable for various electronic equipment. Their compact, leadless design allows for simple SMT mounting, making them ideal for high-current signal lines and power lines in communication equipment, computers, and LCD TVs. They provide higher impedance than conventional insertion beads in the same size, with a unique terminal electrode structure ensuring a permissible current of up to 6.0A (max).
Product Attributes
- Brand: CBM
- Material: Ferrite
- Packaging: Tape & Reel (T), Bulk (B)
Technical Specifications
| Part Number | Dimensions (mm) LWT | Impedance () | Packaging Style | DCR ()Max | Rated Current Ir (mA)Max |
| CBM060303X220T | 0.60.30.3 | 22 | T | 0.040 | 1800 |
| CBM060303X330T | 0.60.30.3 | 33 | T | 0.055 | 1500 |
| CBM060303X800T | 0.60.30.3 | 80 | T | 0.130 | 1000 |
| CBM060303X121T | 0.60.30.3 | 120 | T | 0.160 | 900 |
| CBM100505U000T | 1.00.50.5 | 0 | T | 0.02 | 2000 |
| CBM100505U050T | 1.00.50.5 | 5 | T | 0.02 | 2000 |
| CBM100505U101T | 1.00.50.5 | 100 | T | 0.15 | 1000 |
| CBM100505U102T | 1.00.50.5 | 1000 | T | 0.65 | 300 |
| CBM160808U000T | 1.60.80.8 | 0 | T | 0.01 | 6000 |
| CBM160808U050T | 1.60.80.8 | 5 | T | 0.01 | 6000 |
| CBM160808U101T | 1.60.80.8 | 100 | T | 0.06 | 2500 |
| CBM160808U102T | 1.60.80.8 | 1000 | T | 0.35 | 700 |
| CBM201209U000T | 2.01.20.9 | 0 | T | 0.01 | 6000 |
| CBM201209U050T | 2.01.20.9 | 5 | T | 0.01 | 6000 |
| CBM201209U101T | 2.01.20.9 | 100 | T | 0.045 | 4000 |
| CBM201209U102T | 2.01.20.9 | 1000 | T | 0.12 | 1500 |
| CBM321609U000T | 3.21.60.9 | 0 | T | 0.01 | 6000 |
| CBM321609U050T | 3.21.60.9 | 5 | T | 0.01 | 6000 |
| CBM321609U101T | 3.21.60.9 | 100 | T | 0.035 | 4000 |
| CBM321609U102T | 3.21.60.9 | 1000 | T | 0.12 | 2100 |
| CBM322513U110T | 3.22.51.3 | 11 | T | 0.02 | 6000 |
| CBM322513U150T | 3.22.51.3 | 15 | T | 0.02 | 6000 |
| CBM322513U121T | 3.22.51.3 | 120 | T | 0.03 | 5000 |
| CBM322513U102T | 3.22.51.3 | 1000 | T | 0.23 | 2500 |
| CBM451616U190T | 4.51.61.6 | 19 | T | 0.009 | 6000 |
| CBM451616U260T | 4.51.61.6 | 26 | T | 0.009 | 6000 |
| CBM451616U800T | 4.51.61.6 | 80 | T | 0.025 | 3000 |
| CBM453215U190T | 4.53.21.5 | 19 | T | 0.01 | 6000 |
| CBM453215U260T | 4.53.21.5 | 26 | T | 0.01 | 6000 |
| CBM453215U101T | 4.53.21.5 | 100 | T | 0.02 | 6000 |
| CBM453215U501T | 4.53.21.5 | 500 | T | 0.08 | 4000 |
Reliability Test Method
| No. | Items | Requirements | Test Methods and Remarks |
| 1 | Operating Temperature Range | -55+125 | Includes product surface temperature rise |
| 2 | Solder ability | No visible damage; 95% or more of electrode area shall be coated by new solder. | Preheating temperature:120~150, Preheating time: 60s, Solder: 96.5%Sn/3.0%Ag/0.5%Cu, Solder temperature: 2455, Immersion tin depth:10mm, Duration: 51s, Dip performance to a flux of about:3 ~ 5 s |
| 3 | Resistance to Soldering Heat | At least 95% of terminal electrode should be covered with solder. No mechanical damage. Impedance change: within 30%. | Preheating temperature: 120~150, Preheating time: 60s, Solder: 96.5%Sn/3.0%Ag/0.5%Cu, Solder temperature: 2605, Immersion tin depth:10mm, Duration: 101s, Dip performance to a flux of about:35 s |
| 4 | Adhesion of electrode | The termination and body should be no damage. | Applied force: 5N for 1005 series; 7N for 1608 series; 10N for 2012, 3216 series; 15N for 3225, 4532 series. Keep time: 101S |
| 5 | Low temperature resistance | No mechanical damage. Impedance change: within 30%. | Temperature: -552, Testing time: 10000 +24 h |
| 6 | Bending strength | No mechanical damage | Testing board: glass epoxy-resin substrate, For 0.5mm/s, bending: 2mm, duration: 20s1s |
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina