High impedance multilayer chip ferrite beads FH CBM160808U700T for automatic surface mount technology

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Price: Negotiable

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Product Description

Multilayer Chip Ferrite Ultra-High Current Beads

These multilayer chip ferrite beads offer high impedance and effective EMI/RFI suppression over a wide frequency range, suitable for automatic SMT mounting. They are designed for noise suppression in power lines or extra-large current signal lines of electrical equipment such as communication devices, computers, and LCD TVs.

Product Attributes

Product Code: CBM
Description: Multilayer Chip Ferrite Ultra-High Current Beads
Packaging Styles: Tape & Reel (T), Bulk (B)

Technical Specifications

Part Number	Dimensions (LWT mm)	Impedance ()	Packaging Style	DCR ()Max	Rated Current Ir (mA)Max
CBM060303X220T	0.60.30.3	22	T	0.040	1800
CBM060303X330T	0.60.30.3	33	T	0.055	1500
CBM060303X800T	0.60.30.3	80	T	0.130	1000
CBM060303X121T	0.60.30.3	120	T	0.160	900
CBM100505U000T	1.00.50.5	0	T	0.02	2000
CBM100505U050T	1.00.50.5	5	T	0.02	2000
CBM100505U101T	1.00.50.5	100	T	0.15	1000
CBM100505U102T	1.00.50.5	1000	T	0.65	300
CBM160808U000T	1.60.80.8	0	T	0.01	6000
CBM160808U050T	1.60.80.8	5	T	0.01	6000
CBM160808U101T	1.60.80.8	100	T	0.06	2500
CBM160808U102T	1.60.80.8	1000	T	0.35	700
CBM201209U000T	2.01.20.9	0	T	0.01	6000
CBM201209U050T	2.01.20.9	5	T	0.01	6000
CBM201209U101T	2.01.20.9	100	T	0.045	4000
CBM201209U102T	2.01.20.9	1000	T	0.12	1500
CBM321609U000T	3.21.60.9	0	T	0.01	6000
CBM321609U050T	3.21.60.9	5	T	0.01	6000
CBM321609U101T	3.21.60.9	100	T	0.035	4000
CBM321609U102T	3.21.60.9	1000	T	0.12	2100
CBM322513U110T	3.22.51.3	11	T	0.02	6000
CBM322513U150T	3.22.51.3	15	T	0.02	6000
CBM322513U121T	3.22.51.3	120	T	0.03	5000
CBM322513U102T	3.22.51.3	1000	T	0.23	2500
CBM451616U190T	4.51.61.6	19	T	0.009	6000
CBM451616U260T	4.51.61.6	26	T	0.009	6000
CBM451616U800T	4.51.61.6	80	T	0.025	3000
CBM453215U190T	4.53.21.5	19	T	0.01	6000
CBM453215U260T	4.53.21.5	26	T	0.01	6000
CBM453215U101T	4.53.21.5	100	T	0.02	6000
CBM453215U501T	4.53.21.5	500	T	0.08	4000

Reliability Test Method

No.	Items	Requirements	Test Methods and Remarks
1	Operating Temperature Range	-55+125	Includes product surface temperature rise
2	Solder ability	No visible damage; 95% or more of electrode area shall be coated by new solder.	Preheating temperature:120~150, Preheating time: 60s, Solder: (96.5%Sn/3.0%Ag/0.5%Cu), Solder temperature: 2455, Immersion tin depth:10mm, Duration: 51s, Dip performance to a flux of about:3 ~ 5 s
3	Resistance to Soldering Heat	At least 95% of terminal electrode should be covered with solder. No mechanical damage. Impedance change: within 30%.	Preheating temperature: 120~150, Preheating time: 60s, Solder: (96.5%Sn/3.0%Ag/0.5%Cu), Solder temperature: 2605, Immersion tin depth:10mm, Duration: 101s, Dip performance to a flux of about:35 s
4	Adhesion of electrode	The termination and body should be no damage.	Applied force: 5N for 1005 series; 7N for 1608 series; 10N for 2012, 3216 series; 15N for 3225, 4532 series. Keep time: 101S
5	Low temperature resistance	No mechanical damage. Impedance change: within 30%.	Temperature: -552, Testing time: 10000 +24 h
6	Bending strength	No mechanical damage	Testing board: glass epoxy-resin substrate, Forcing speed: 0.5mm/s, Deflection: 2mm, Duration: 20s1s