Multilayer chip ferrite beads FH CBM160808U400T providing noise suppression in electrical circuits
Price:
Negotiable
MOQ:
Negotiable
Delivery Time:
Negotiable
Product Description
Multilayer Chip Ferrite Ultra-High Current Beads
These multilayer chip ferrite beads offer high impedance and effective EMI/RFI suppression over a wide frequency range, suitable for automatic SMT equipment mounting. They are designed for noise suppression in power lines or extra-large current signal lines of electrical equipment such as communication devices, computers, and LCD TVs.
- Product Code: CBM
- Product Type: Multilayer Chip Ferrite Ultra-High Current Beads
- Material: Ferrite
- Packaging Styles: Tape & Reel (T), Bulk (B)
| Part Number | Dimensions (LWT mm) | Impedance () | Tolerance | Test Frequency (MHz) | DCR () Max | Rated Current Ir (mA) Max |
| 0603 Type | ||||||
| CBM060303X220T | 0.60.30.3 | 22 | 25% | 100 | 0.040 | 1800 |
| CBM060303X330T | 0.60.30.3 | 33 | 25% | 100 | 0.055 | 1500 |
| CBM060303X800T | 0.60.30.3 | 80 | 25% | 100 | 0.130 | 1000 |
| CBM060303X121T | 0.60.30.3 | 120 | 25% | 100 | 0.160 | 900 |
| 1005 Type | ||||||
| CBM100505U000T | 1.00.50.5 | 0 | 015 | 100 | 0.02 | 2000 |
| CBM100505U050T | 1.00.50.5 | 5 | 015 | 100 | 0.02 | 2000 |
| CBM100505U101T | 1.00.50.5 | 100 | 25% | 100 | 0.15 | 1000 |
| CBM100505U102T | 1.00.50.5 | 1000 | 25% | 100 | 0.65 | 300 |
| 1608 Type | ||||||
| CBM160808U000T | 1.60.80.8 | 0 | 015 | 100 | 0.01 | 6000 |
| CBM160808U050T | 1.60.80.8 | 5 | 015 | 100 | 0.01 | 6000 |
| CBM160808U101T | 1.60.80.8 | 100 | 25% | 100 | 0.06 | 2500 |
| CBM160808U102T | 1.60.80.8 | 1000 | 25% | 100 | 0.35 | 700 |
| 2012 Type | ||||||
| CBM201209U000T | 2.01.20.9 | 0 | 015 | 100 | 0.01 | 6000 |
| CBM201209U050T | 2.01.20.9 | 5 | 015 | 100 | 0.01 | 6000 |
| CBM201209U101T | 2.01.20.9 | 100 | 25% | 100 | 0.045 | 4000 |
| CBM201209U102T | 2.01.20.9 | 1000 | 25% | 100 | 0.12 | 1500 |
| 3216 Type | ||||||
| CBM321609U000T | 3.21.60.9 | 0 | 015 | 100 | 0.01 | 6000 |
| CBM321609U050T | 3.21.60.9 | 5 | 015 | 100 | 0.01 | 6000 |
| CBM321609U101T | 3.21.60.9 | 100 | 25% | 100 | 0.035 | 4000 |
| CBM321609U102T | 3.21.60.9 | 1000 | 25% | 100 | 0.12 | 2100 |
| 3225 Type | ||||||
| CBM322513U110T | 3.22.51.3 | 11 | 715 | 100 | 0.02 | 6000 |
| CBM322513U150T | 3.22.51.3 | 15 | 921 | 100 | 0.02 | 6000 |
| CBM322513U121T | 3.22.51.3 | 120 | 25% | 100 | 0.03 | 5000 |
| CBM322513U102T | 3.22.51.3 | 1000 | 25% | 100 | 0.23 | 2500 |
| 4516 Type | ||||||
| CBM451616U190T | 4.51.61.6 | 19 | 1225 | 100 | 0.009 | 6000 |
| CBM451616U260T | 4.51.61.6 | 26 | 25% | 100 | 0.009 | 6000 |
| CBM451616U600T | 4.51.61.6 | 60 | 25% | 100 | 0.009 | 6000 |
| 4532 Type | ||||||
| CBM453215U190T | 4.53.21.5 | 19 | 1225 | 100 | 0.01 | 6000 |
| CBM453215U260T | 4.53.21.5 | 26 | 25% | 100 | 0.01 | 6000 |
| CBM453215U500T | 4.53.21.5 | 50 | 25% | 100 | 0.01 | 6000 |
| CBM453215U101T | 4.53.21.5 | 100 | 25% | 100 | 0.02 | 6000 |
| Item | Requirements | Test Methods and Remarks |
| Operating Temperature Range | -55+125 | Includes product surface temperature rise |
| Solder ability | No visible damage; 95% or more of electrode area shall be coated by new solder. | Preheating temperature: 120~150, Preheating time: 60s, Solder: 96.5%Sn/3.0%Ag/0.5%Cu, Solder temperature: 2455, Immersion tin depth: 10mm, Duration: 51s, Dip performance to a flux of about: 3~5 s |
| Resistance to Soldering Heat | At least 95% of terminal electrode should be covered with solder. No mechanical damage. Impedance change: within 30%. | Preheating temperature: 120~150, Preheating time: 60s, Solder: 96.5%Sn/3.0%Ag/0.5%Cu, Solder temperature: 2605, Immersion tin depth: 10mm, Duration: 101s, Dip performance to a flux of about: 3~5 s |
| Adhesion of electrode | The termination and body should be no damage. | Applied force: 5N for 1005 series; 7N for 1608 series; 10N for 2012, 3216 series; 15N for 3225, 4532 series. Keep time: 101S |
| Low temperature resistance | No mechanical damage. Impedance change: within 30%. | Temperature: -552, Testing time: 10000 +24 h |
| Bending strength | No mechanical damage | Testing board: glass epoxy-resin substrate. Forcing speed: 0.5mm/s, Deflection: 2mm, Holding time: 20s1s |
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina