High Current Multilayer Chip Ferrite Beads FH CBM160808U751T for Communication Devices and Computers

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Product Description

Multilayer Chip Ferrite Ultra-High Current Beads

These multilayer chip ferrite beads offer high impedance and effective EMI/RFI suppression in a compact size. Designed for easy SMT mounting, they are ideal for noise suppression in power lines and ultra-high current signal lines of various electrical equipment, including communication devices, computers, and LCD TVs. Their unique terminal electrode structure allows for high permissible currents.

Product Attributes

Product Code: CBM
Material: Ferrite
Packaging Styles: Tape & Reel (T), Bulk (B)

Technical Specifications

Part Number	Dimensions (LWT mm)	Impedance ()	Tolerance	Test Frequency (MHz)	DCR () Max	Rated Current (mA) Max
CBM060303X220T	0.60.30.3	22	25%	100	0.040	1800
CBM060303X330T	0.60.30.3	33	25%	100	0.055	1500
CBM060303X800T	0.60.30.3	80	25%	100	0.130	1000
CBM060303X121T	0.60.30.3	120	25%	100	0.160	900
CBM100505U000T	1.00.50.5	0	015	100	0.02	2000
CBM100505U050T	1.00.50.5	5	015	100	0.02	2000
CBM100505U101T	1.00.50.5	100	25%	100	0.15	1000
CBM100505U102T	1.00.50.5	1000	25%	100	0.65	300
CBM160808U000T	1.60.80.8	0	015	100	0.01	6000
CBM160808U050T	1.60.80.8	5	015	100	0.01	6000
CBM160808U101T	1.60.80.8	100	25%	100	0.06	2500
CBM160808U102T	1.60.80.8	1000	25%	100	0.35	700
CBM201209U000T	2.01.20.9	0	015	100	0.01	6000
CBM201209U050T	2.01.20.9	5	015	100	0.01	6000
CBM201209U101T	2.01.20.9	100	25%	100	0.045	4000
CBM201209U102T	2.01.20.9	1000	25%	100	0.12	1500
CBM321609U000T	3.21.60.9	0	015	100	0.01	6000
CBM321609U050T	3.21.60.9	5	015	100	0.01	6000
CBM321609U101T	3.21.60.9	100	25%	100	0.035	4000
CBM321609U102T	3.21.60.9	1000	25%	100	0.12	2100
CBM322513U110T	3.22.51.3	11	715	100	0.02	6000
CBM322513U150T	3.22.51.3	15	921	100	0.02	6000
CBM322513U121T	3.22.51.3	120	25%	100	0.03	5000
CBM322513U102T	3.22.51.3	1000	25%	100	0.23	2500
CBM451616U190T	4.51.61.6	19	1225	100	0.009	6000
CBM451616U600T	4.51.61.6	60	25%	100	0.009	6000
CBM451616U800T	4.51.61.6	80	25%	100	0.025	3000
CBM453215U190T	4.53.21.5	19	1225	100	0.01	6000
CBM453215U300T	4.53.21.5	30	25%	100	0.01	6000
CBM453215U600T	4.53.21.5	60	25%	100	0.01	6000
CBM453215U101T	4.53.21.5	100	25%	100	0.02	6000
CBM453215U501T	4.53.21.5	500	25%	100	0.08	4000

Reliability Test Methods

No.	Item	Requirements	Test Methods and Remarks
1	Operating Temperature Range	-55+125	Includes product surface temperature rise
2	Solder ability	No visible damage; 95% or more of electrode area shall be coated by new solder.	Preheating temperature:120~150, Preheating time: 60s, Solder: 96.5%Sn/3.0%Ag/0.5%Cu, Solder temperature: 2455, Immersion tin depth:10mm, Duration: 51s, Dip performance to a flux of about:3 ~ 5 s
3	Resistance to Soldering Heat	At least 95% of terminal electrode should be covered with solder. No mechanical damage. Impedance change: within 30%.	Preheating temperature: 120~150, Preheating time: 60s, Solder: 96.5%Sn/3.0%Ag/0.5%Cu, Solder temperature: 2605, Immersion tin depth:10mm, Duration: 101s, Dip performance to a flux of about:35 s
4	Adhesion of electrode	The termination and body should be no damage.	Applied force: 5N for 1005 series; 7N for 1608 series; 10N for 2012, 3216 series; 15N for 3225, 4532 series. Keep time: 101S
5	Low temperature resistance	No mechanical damage. Impedance change: within 30%.	Temperature: -552, Testing time: 10000 +24 h
6	Bending strength	No mechanical damage.	Testing board: glass epoxy-resin substrate, Forcing speed: 0.5mm/s, Deflection: 2mm, Holding time: 20s1s