Beijing Silk Road Enterprise Management Services Co., Ltd.
                                                                                                           
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High Frequency Chip Inductor FH VHF160808H2N0ST with Ceramic Material and Silver Plated Electrodes

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Product Description

Product Overview

The VHF160808H Series Chip High Frequency Inductors are designed for high-frequency applications. Constructed with a ceramic body and internal silver electrodes, these inductors feature terminal electrodes with silver plating and Ni/Sn plating for reliable connectivity. They are suitable for various electronic circuits requiring precise inductance values and stable performance.

Product Attributes

  • Product Type: Chip high frequency inductors
  • Series: VHF160808H Series
  • Body Material: Ceramic (Al2O3)
  • Inner Electrode Material: Pure Silver (Ag)
  • Terminal Electrode Material: Silver Layer (Ag Layer) / Ni/Sn Plating
  • Packaging: Tape & Reel (T)
  • RoHS Compliance: Available (if marked 'Unitary lead free')

Technical Specifications

Dimensions

Size (LWT) Length (mm) Width (mm) Thickness (mm) Terminal Electrode Length (mm)
160808 1.6 0.20 (0.063 0.008) 0.8 0.20 (0.031 0.008) 0.8 0.20 (0.031 0.008) 0.3 0.2 (0.012 0.008)

Electrical Characteristics

Part NO. Inductance (nH) Q Value (min) DC Resistance () max Test Frequency (MHz) Test Voltage (mV) SRF (MHz) min Rated Current (mA) max
VHF160808H1N0T 1.0 8 0.05 100 50 10000 500
VHF160808H1N2T 1.2 8 0.05 100 50 10000 500
VHF160808H1N5T 1.5 8 0.10 100 50 6000 500
VHF160808H1N8T 1.8 8 0.10 100 50 6000 500
VHF160808H2N0T 2.0 8 0.10 100 50 6000 500
VHF160808H2N2T 2.2 8 0.10 100 50 6000 500
VHF160808H2N4T 2.4 8 0.12 100 50 6000 500
VHF160808H2N7T 2.7 10 0.12 100 50 6000 500
VHF160808H3N3T 3.3 10 0.15 100 50 6000 500
VHF160808H3N6T 3.6 10 0.16 100 50 6000 500
VHF160808H3N9T 3.9 10 0.16 100 50 6000 500
VHF160808H4N3T 4.3 10 0.18 100 50 6000 500
VHF160808H4N7T 4.7 10 0.20 100 50 6000 500
VHF160808H5N1T 5.1 10 0.25 100 50 5500 500
VHF160808H5N6T 5.6 10 0.25 100 50 5000 500
VHF160808H6N8T 6.8 10 0.30 100 50 5000 500
VHF160808H7N5T 7.5 10 0.35 100 50 4500 500
VHF160808H8N2T 8.2 10 0.35 100 50 4500 500
VHF160808H9N1T 9.1 10 0.40 100 50 3500 500
VHF160808H10NT 10 12 0.40 100 50 3500 300
VHF160808H12NT 12 12 0.45 100 50 3000 300
VHF160808H15NT 15 12 0.50 100 50 2300 300
VHF160808H18NT 18 12 0.55 100 50 2200 300
VHF160808H22NT 22 12 0.60 100 50 2000 300
VHF160808H24NT 24 12 0.60 100 50 2000 300
VHF160808H27NT 27 12 0.65 100 50 1700 300
VHF160808H33NT 33 12 0.70 100 50 1500 300
VHF160808H36NT 36 12 0.70 100 50 1400 300
VHF160808H39NT 39 12 0.70 100 50 1400 300
VHF160808H47NT 47 12 0.70 100 50 1200 300
VHF160808H56NT 56 12 0.75 100 50 1100 300
VHF160808H68NT 68 12 0.85 100 50 900 300
VHF160808H82NT 82 8 1.00 100 50 800 300
VHF160808HR10T 100 8 1.20 100 50 700 300
VHF160808HR12T 120 8 1.40 50 50 600 200
VHF160808HR15T 150 8 1.60 50 50 500 200
VHF160808HR18T 180 8 1.90 50 50 400 200
VHF160808HR22T 220 8 2.40 50 50 350 200
VHF160808HR27T 270 8 2.60 50 50 350 150
VHF160808HR33T 330 8 2.80 50 50 350 150
VHF160808HR39T 390 8 3.20 50 50 300 150
VHF160808HR43T 430 8 3.40 50 50 280 150
VHF160808HR47T 470 8 3.60 50 50 250 150

Inductance Tolerance: Ls

Note: VHF160808H series products have no compensation value; the product test center value equals the nominal value.

Reliability Testing Items

No. Item Requirements Test Methods and Remarks
1 Operating Temperature Range -40+85
2 Solder ability At least 95% of terminal electrode should be covered with solder. Preheating temperature: 120~150, Preheating time: 60s, Solder: 96.5%Sn/3.0%Ag/0.5%Cu, Solder temperature: 2455, Immersion depth: 10mm, Duration: 51s, Dip to flux: 3 ~ 5 s
3 Resistance to Soldering Heat At least 95% of terminal electrode should be covered with solder. No mechanical damage. Inductance change: 10% (H series ceramic), Q value change: 20% (ceramic). Preheating temperature: 120~150, Preheating time: 60s, Solder: 96.5%Sn/3.0%Ag/0.5%Cu, Solder temperature: 2605, Immersion depth: 10mm, Duration: 101s, Dip to flux: 3 ~ 5 s
4 Adhesion of electrode The termination and body should be no damage. Applied force: 7N for 1608 series. Keep time: 101S
5 Low temperature resistance No mechanical damage. Inductance change: within 10%. Q value change (ceramic): within 20%. Temperature: -402, Testing time: 1000+240/-0 h
6 Bending strength No mechanical damage. Testing board: glass epoxy-resin substrate. Compression speed: 0.5mm/s, Curvature: 2mm, Hold time: 20s 1s
7 Vibration No mechanical damage. Inductance change: within 10%. Q value change (ceramic): within 20%. Amplitude: 1.5mm. Test time: 2h in each of 3 mutually perpendicular directions. Frequency range: 10Hz to 55Hz to 10Hz (1 minute).
8 High temperature resistance No mechanical damage. Inductance change: within 10%. Q value change (ceramic): within 20%. Testing time: 1000+240/-0 h. Temperature: 852.
9 Static Humidity No mechanical damage. Inductance change: within 10%. Q value change (ceramic): within 20%. Humidity: 90% to 95% RH, Temperature: 602. Testing time: 1000+240/-0 h.
10 High temperature load No mechanical damage. Inductance change: within 10%. Q value change (ceramic): within 20%. Imposed current: rated current. Testing time: 1000+240/-0 h. Temperature: 852.
11 Temperature Shock No mechanical damage. Inductance change: within 10%. Q value change (ceramic): within 20%. Temperature: -55 for 303min +125 for 303min. Number of cycles: 100.

Note: Measurements for electrical performance tests should be made after 242hrs of recovery under standard conditions.

Packaging

Size Pieces per Reel Pieces per Box Pieces per Case
160808 4000 40000 240000

Taping Dimensions (mm): Refer to document for detailed drawings.

Peeling Off Force: Cover tape peeling force: 0.1N0.7N. Peeling speed: 300mm/min.

Recommended Soldering Conditions

Suitable for reflow soldering.

  • Pre-heating: Temperature difference between solder and ferrite surface should be limited to 150 max. Cooling into solvent after soldering should be limited to 100 max.
  • Reflow Soldering Profile: Refer to document for curve.
  • Iron Soldering: Temperature: 350 (Max). Power: 30W (Max). Duration: < 5S. Avoid touching terminal electrodes.

Cleaning

  • Cleaning Temperature: 60 (Max)
  • Cleaning Time: 1 minute (Min)
  • Ultrasonic Power: 200W (Max)

Storage Requirements

  • Storage Period: Within 1 year from the factory inspection date. If over 1 year, check solderability before use.
  • Storage Conditions: Temperature: -10+40, Relative Humidity: 3070%. Avoid corrosive substances, moisture, dust, heat shock, vibration, and direct sunlight. Store in sealed packaging on a pallet.

Usage Of ODS (Ozone Depleting Substances)

The company does not use ODS such as CCl4 and HCFC in its production process.

Notes

  • If the product is marked 'Unitary lead free', it complies with RoHS directive requirements.
  • This specification guarantees the quality of the product as a single unit. Ensure your product has been evaluated and confirmed when our product is mounted.
  • The company does not warrant against failures caused by uses deviating from the intended use described in this specification.

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Beijing Silk Road Enterprise Management Services Co., Ltd.
Location 16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person Sellina

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