Beijing Silk Road Enterprise Management Services Co., Ltd.
                                                                                                           
Verified Supplier
17 Years
Since 2009
Menu

Multilayer Chip Ferrite Power Inductor FH CMH201209B2R2MT with Pure Silver Electrodes and NiSn Plating

Price Negotiable
Price: Negotiable
MOQ: Negotiable
Delivery Time: Negotiable
Product Description

Product Overview

The CMH201209B Series is a Multilayer Chip Ferrite Power Inductor designed for various electronic applications. These inductors are constructed with a ferrite or ceramic body, inner electrodes made of pure silver, and terminal electrodes with a silver layer and Ni/Sn plating. They offer a range of inductance values with a standard tolerance of 20% and are suitable for reflow soldering applications.

Product Attributes

  • Product Type: Multilayer Chip Ferrite Power Inductor
  • Series: CMH201209B Series
  • Body Material: Ferrite (Ni-Cu-Zn system) or Ceramic
  • Inner Electrode Material: Pure Silver (Ag)
  • Terminal Electrode Material: Silver layer (Ag) with Ni/Sn plating
  • Plating: Ni/Sn
  • Certifications: RoHS compliant (if indicated as 'Unitary lead free')

Technical Specifications

Part NO. Size (LWT) Inductance (H) Tolerance (%) RDC () max Test Frequency (MHz) Test Voltage (mV) SRF (MHz) min Rated Current (mA) max
CMH201209B1R0MT 2.01.20.9 mm 1.0 20 0.1125% 1 50 1150 75
CMH201209B2R2MT 2.01.20.9 mm 2.2 20 0.2025% 1 50 950 50
CMH201209B3R3MT 2.01.20.9 mm 3.3 20 0.2225% 1 50 800 35
CMH201209B4R7MT 2.01.20.9 mm 4.7 20 0.3025% 1 50 750 25
CMH201209B6R8MT 2.01.20.9 mm 6.8 20 0.3025% 1 50 600 25

Reliability Testing Items

No. Items Requirements Test Methods and Remarks
1 Operating Temperature Range -40+85
2 Solder ability At least 95% of terminal electrode should be covered with solder Preheating temperature: 120 to 150, Preheating time: 60s, Solder: 96.5%Sn/3.0%Ag/0.5%Cu, Solder temperature: 2455, Immersion tin depth: 10mm, Duration: 51s
3 Resistance to Soldering At least 95% of terminal electrode should be covered with solder. No mechanical damage. Inductance change: within 30% Preheating temperature: 120 to 150, Preheating time: 60s, Solder: 96.5%Sn/3.0%Ag/0.5%Cu, Solder temperature: 2605, Immersion tin depth: 10mm, Duration: 101s
4 Adhesion of electrode The termination and body should be no damage. Applied force: 10N for 2012 series. Keep time: 101S
5 Low temperature resistance No mechanical damage. Inductance change: within 10% Temperature: -402, Testing time: 1000 +240/-0 h
6 Bending strength No mechanical damage. Testing board: glass epoxy-resin substrate, For 0.5 mm/s compression speed, curvature: 2mm, hold time: 20s1s
7 Vibration No mechanical damage. Inductance change: within 10% Amplitude modulation: 1.5mm, Test time: 2h in each of 3 mutually perpendicular directions. Frequency range: 10Hz to 55Hz to 10Hz for 1min.
8 High temperature resistance No mechanical damage. Inductance change: within 10% Temperature: 852, Testing time: 1000 +240/-0 h
9 Static Humidity No mechanical damage. Inductance change: within 10% Humidity: 90% to 95% RH, Temperature: 602, Testing time: 1000 +240/-0 h
10 High temperature load No mechanical damage. Inductance change: within 10% Impose current: rated current, Temperature: 852, Testing time: 1000 +240/-0 h
11 Temperature Shock No mechanical damage. Inductance change: within 10% Temperature: -40 for 303min +85 for 303min, Number of cycles: 32

Product Packaging

Packaging Type: Tape & Reel

Packaging Quantity:

  • 201209 Size: 4000 Pcs/Reel, 40000 Pcs/Box, 240000 Pcs/Case

Peeling Force: 0.1N0.7N (Cover tape peeling force)

Peeling Speed: 300mm/min

Recommended Soldering Conditions

Type: Reflow soldering

Soldering Conditions:

  • Temperature difference between solder and ferrite surface during pre-heating: max 150.
  • Temperature difference between product surface and solvent during cooling: max 100.

Iron Soldering:

  • Soldering iron temperature: 350 max
  • Power: 30W max
  • Soldering iron dwell time: < 5S (Avoid direct contact with terminal electrodes)

Cleaning Conditions

  • Cleaning temperature: 60 max
  • Cleaning time: 1 minute min.
  • Ultrasonic output power: 200W max

Storage Requirements

Storage Period: Within 1 year from the inductor company's factory inspection date. If exceeding 1 year, solderability must be checked before use.

Storage Conditions:

  • Warehouse temperature: -10 to +40
  • Relative humidity: 30% to 70%
  • Avoid storage in corrosive substances (e.g., sulfur, chlorine gas, acid).
  • Store on a palette to prevent influence from humidity and dust.
  • Avoid heat shock, vibration, and direct sunlight.
  • Products should be stored in airtight packaged condition.

Usage Of ODS (Ozone Depleting Substances)

The company does not use ODS such as CCl4 (Carbon Tetrachloride) and HCFC in the production process.

Notes

  • If the product is recognized as 'Unitary lead free', it complies with RoHS directive requirements.
  • This product specification guarantees the quality of our product as a single unit. Ensure your product has been evaluated and confirmed against your specifications when our product is mounted.
  • The company does not warrant against failure caused by any use of our product that deviates from the intended use as described in this product specification.

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Beijing Silk Road Enterprise Management Services Co., Ltd.
Location 16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person Sellina

Request A Quote

Please check your email address.
Your message must be at least 20 characters.