Multilayer Chip Ferrite Power Inductor FH CMH201209B2R2MT with Pure Silver Electrodes and NiSn Plating
Product Overview
The CMH201209B Series is a Multilayer Chip Ferrite Power Inductor designed for various electronic applications. These inductors are constructed with a ferrite or ceramic body, inner electrodes made of pure silver, and terminal electrodes with a silver layer and Ni/Sn plating. They offer a range of inductance values with a standard tolerance of 20% and are suitable for reflow soldering applications.
Product Attributes
- Product Type: Multilayer Chip Ferrite Power Inductor
- Series: CMH201209B Series
- Body Material: Ferrite (Ni-Cu-Zn system) or Ceramic
- Inner Electrode Material: Pure Silver (Ag)
- Terminal Electrode Material: Silver layer (Ag) with Ni/Sn plating
- Plating: Ni/Sn
- Certifications: RoHS compliant (if indicated as 'Unitary lead free')
Technical Specifications
| Part NO. | Size (LWT) | Inductance (H) | Tolerance (%) | RDC () max | Test Frequency (MHz) | Test Voltage (mV) | SRF (MHz) min | Rated Current (mA) max |
|---|---|---|---|---|---|---|---|---|
| CMH201209B1R0MT | 2.01.20.9 mm | 1.0 | 20 | 0.1125% | 1 | 50 | 1150 | 75 |
| CMH201209B2R2MT | 2.01.20.9 mm | 2.2 | 20 | 0.2025% | 1 | 50 | 950 | 50 |
| CMH201209B3R3MT | 2.01.20.9 mm | 3.3 | 20 | 0.2225% | 1 | 50 | 800 | 35 |
| CMH201209B4R7MT | 2.01.20.9 mm | 4.7 | 20 | 0.3025% | 1 | 50 | 750 | 25 |
| CMH201209B6R8MT | 2.01.20.9 mm | 6.8 | 20 | 0.3025% | 1 | 50 | 600 | 25 |
Reliability Testing Items
| No. | Items | Requirements | Test Methods and Remarks |
|---|---|---|---|
| 1 | Operating Temperature Range | -40+85 | |
| 2 | Solder ability | At least 95% of terminal electrode should be covered with solder | Preheating temperature: 120 to 150, Preheating time: 60s, Solder: 96.5%Sn/3.0%Ag/0.5%Cu, Solder temperature: 2455, Immersion tin depth: 10mm, Duration: 51s |
| 3 | Resistance to Soldering | At least 95% of terminal electrode should be covered with solder. No mechanical damage. Inductance change: within 30% | Preheating temperature: 120 to 150, Preheating time: 60s, Solder: 96.5%Sn/3.0%Ag/0.5%Cu, Solder temperature: 2605, Immersion tin depth: 10mm, Duration: 101s |
| 4 | Adhesion of electrode | The termination and body should be no damage. | Applied force: 10N for 2012 series. Keep time: 101S |
| 5 | Low temperature resistance | No mechanical damage. Inductance change: within 10% | Temperature: -402, Testing time: 1000 +240/-0 h |
| 6 | Bending strength | No mechanical damage. | Testing board: glass epoxy-resin substrate, For 0.5 mm/s compression speed, curvature: 2mm, hold time: 20s1s |
| 7 | Vibration | No mechanical damage. Inductance change: within 10% | Amplitude modulation: 1.5mm, Test time: 2h in each of 3 mutually perpendicular directions. Frequency range: 10Hz to 55Hz to 10Hz for 1min. |
| 8 | High temperature resistance | No mechanical damage. Inductance change: within 10% | Temperature: 852, Testing time: 1000 +240/-0 h |
| 9 | Static Humidity | No mechanical damage. Inductance change: within 10% | Humidity: 90% to 95% RH, Temperature: 602, Testing time: 1000 +240/-0 h |
| 10 | High temperature load | No mechanical damage. Inductance change: within 10% | Impose current: rated current, Temperature: 852, Testing time: 1000 +240/-0 h |
| 11 | Temperature Shock | No mechanical damage. Inductance change: within 10% | Temperature: -40 for 303min +85 for 303min, Number of cycles: 32 |
Product Packaging
Packaging Type: Tape & Reel
Packaging Quantity:
- 201209 Size: 4000 Pcs/Reel, 40000 Pcs/Box, 240000 Pcs/Case
Peeling Force: 0.1N0.7N (Cover tape peeling force)
Peeling Speed: 300mm/min
Recommended Soldering Conditions
Type: Reflow soldering
Soldering Conditions:
- Temperature difference between solder and ferrite surface during pre-heating: max 150.
- Temperature difference between product surface and solvent during cooling: max 100.
Iron Soldering:
- Soldering iron temperature: 350 max
- Power: 30W max
- Soldering iron dwell time: < 5S (Avoid direct contact with terminal electrodes)
Cleaning Conditions
- Cleaning temperature: 60 max
- Cleaning time: 1 minute min.
- Ultrasonic output power: 200W max
Storage Requirements
Storage Period: Within 1 year from the inductor company's factory inspection date. If exceeding 1 year, solderability must be checked before use.
Storage Conditions:
- Warehouse temperature: -10 to +40
- Relative humidity: 30% to 70%
- Avoid storage in corrosive substances (e.g., sulfur, chlorine gas, acid).
- Store on a palette to prevent influence from humidity and dust.
- Avoid heat shock, vibration, and direct sunlight.
- Products should be stored in airtight packaged condition.
Usage Of ODS (Ozone Depleting Substances)
The company does not use ODS such as CCl4 (Carbon Tetrachloride) and HCFC in the production process.
Notes
- If the product is recognized as 'Unitary lead free', it complies with RoHS directive requirements.
- This product specification guarantees the quality of our product as a single unit. Ensure your product has been evaluated and confirmed against your specifications when our product is mounted.
- The company does not warrant against failure caused by any use of our product that deviates from the intended use as described in this product specification.
Get in Touch
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