Beijing Silk Road Enterprise Management Services Co., Ltd.
                                                                                                           
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Multilayer chip ferrite inductors FH CMI201209VR47KT with pure silver inner electrodes and Ni Sn plating

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Price: Negotiable
MOQ: Negotiable
Delivery Time: Negotiable
Product Description

Product Overview

The CMI2012 Series Multilayer Chip Ferrite Inductors are designed for various electronic applications. These inductors feature a ferrite or ceramic body with inner electrodes made of pure silver and terminal electrodes with silver and Ni/Sn plating. They are available in multiple specifications, offering inductance values from 0.047 H to 68 H with tight tolerances. The series is manufactured with advanced materials and processes to ensure reliability and performance.

Product Attributes

  • Product Type: Multilayer Chip Ferrite Inductors
  • Series: CMI2012 Series
  • Body Material: Ferrite (Ni-Cu-Zn system) or Ceramic
  • Inner Electrode Material: Pure Silver (Ag)
  • Terminal Electrode Material: Silver Layer (Ag Layer) with Ni/Sn Plating
  • Plating: Ni/Sn
  • Packaging: Tape & Reel
  • Certifications: RoHS compliant (if 'Unitary lead free' product)

Technical Specifications

Part Name / Model Size (L x W x T) (mm) Inductance (H) Tolerance (%) DC Resistance () max Test Frequency (MHz) Rated Current (mA) max Self-Resonant Frequency (MHz) min
CMI201209V47NKT 2.0 x 1.2 x 0.9 0.047 10 0.15 50 300 320
CMI201209V56NKT 2.0 x 1.2 x 0.9 0.056 10 0.15 50 300 320
CMI201209V68NKT 2.0 x 1.2 x 0.9 0.068 10 0.20 50 300 280
CMI201209V82NKT 2.0 x 1.2 x 0.9 0.082 10 0.20 50 300 280
CMI201209VR10KT 2.0 x 1.2 x 0.9 0.10 10 0.20 25 250 235
CMI201209VR12KT 2.0 x 1.2 x 0.9 0.12 10 0.25 25 250 220
CMI201209VR15KT 2.0 x 1.2 x 0.9 0.15 10 0.25 25 250 200
CMI201209VR18KT 2.0 x 1.2 x 0.9 0.18 10 0.30 25 250 185
CMI201209VR22KT 2.0 x 1.2 x 0.9 0.22 10 0.30 25 250 170
CMI201209VR27KT 2.0 x 1.2 x 0.9 0.27 10 0.40 25 250 150
CMI201209VR33KT 2.0 x 1.2 x 0.9 0.33 10 0.40 25 250 145
CMI201209VR39KT 2.0 x 1.2 x 0.9 0.39 10 0.50 25 200 135
CMI201209VR47KT 2.0 x 1.2 x 0.9 0.47 10 0.50 25 200 125
CMI201209VR56KT 2.0 x 1.2 x 0.9 0.56 10 0.60 25 150 115
CMI201209VR68KT 2.0 x 1.2 x 0.9 0.68 10 0.65 25 150 105
CMI201209VR82KT 2.0 x 1.2 x 0.9 0.82 10 0.70 25 150 100
CMI201209U1R0KT 2.0 x 1.2 x 0.9 1.0 10 0.40 10 50 75
CMI201209U1R2KT 2.0 x 1.2 x 0.9 1.2 10 0.40 10 50 65
CMI201209U1R5KT 2.0 x 1.2 x 0.9 1.5 10 0.40 10 50 60
CMI201209U1R8KT 2.0 x 1.2 x 0.9 1.8 10 0.40 10 50 55
CMI201209U2R2KT 2.0 x 1.2 x 0.9 2.2 10 0.60 10 50 50
CMI201209U2R7KT 2.0 x 1.2 x 0.9 2.7 10 0.60 10 50 45
CMI201209U3R3KT 2.0 x 1.2 x 0.9 3.3 10 0.60 10 50 41
CMI201209U3R9KT 2.0 x 1.2 x 0.9 3.9 10 0.80 10 50 38
CMI201209U4R7KT 2.0 x 1.2 x 0.9 4.7 10 0.90 10 30 35
CMI201209X5R6KT 2.0 x 1.2 x 0.9 5.6 10 1.00 4 15 32
CMI201209X6R8KT 2.0 x 1.2 x 0.9 6.8 10 1.05 4 15 29
CMI201209X8R2KT 2.0 x 1.2 x 0.9 8.2 10 1.05 4 15 26
CMI201209X100KT 2.0 x 1.2 x 0.9 10 10 1.15 2 15 24
CMI201209X100KT 2.0 x 1.2 x 0.9 10 10 1.15 2 15 24
CMI201209X120KT 2.0 x 1.2 x 0.9 12 10 1.15 2 15 22
CMI201209J150KT 2.0 x 1.2 x 0.9 15 10 1.15 1 5 19
CMI201209J180KT 2.0 x 1.2 x 0.9 18 10 1.20 1 5 18
CMI201209J220KT 2.0 x 1.2 x 0.9 22 10 1.20 1 5 16
CMI201209J270KT 2.0 x 1.2 x 0.9 27 10 1.50 1 5 16
CMI201209J330MT 2.0 x 1.2 x 0.9 33 20 1.50 1 5 16
CMI201212J390MT 2.0 x 1.2 x 1.2 39 20 1.50 1 5 16
CMI201212J470MT 2.0 x 1.2 x 1.2 47 20 1.70 1 5 15
CMI201212J560MT 2.0 x 1.2 x 1.2 56 20 2.60 1 5 10
CMI201212J680MT 2.0 x 1.2 x 1.2 68 20 2.60 1 5 10

Reliability Testing Items

No. Items Requirements Test Methods and Remarks
1 Operating Temperature Range -40+85
2 Solder ability At least 95% of terminal electrode should be covered with solder Preheating temperature: 120 to 150; Preheating time: 60s; Solder: 96.5%Sn/3.0%Ag/0.5%Cu; Solder temperature: 2455; Immersion tin depth: 10mm; Duration: 51s; Dip performance to a flux of about: 3 ~ 5 s
3 Resistance to Soldering At least 95% of terminal electrode should be covered with solder. No mechanical damage. Inductance change within 20% (V, U), 25% (X), 30% (J). Q value change (ferrite) within 30%. Preheating temperature: 120 to 150; Preheating time: 60s; Solder: 96.5%Sn/3.0%Ag/0.5%Cu; Solder temperature: 2605; Immersion tin depth: 10mm; Duration: 101s; Dip performance to a flux of about: 3 ~ 5 s
4 Adhesion of electrode The termination and body should be no damage. Applied force: 10N for 2012 series. Keep time: 101S
5 Low temperature resistance No mechanical damage. Inductance change within 10%. Q value change (ferrite) within 30%. Temperature: -402; Testing time: 1000 +24/-0 h
6 Bending strength No mechanical damage. Testing board: glass epoxy-resin substrate; Curvature: 2mm; Hold time: 20s1s; Compression speed: 0.5 mm/s
7 Vibration No mechanical damage. Inductance change within 10%. Q value change (ferrite) within 30%. Amplitude: 1.5mm; Test time: 2h in each of 3 mutually perpendicular directions; Frequency range: 10Hz to 55Hz to 10Hz for 1min.
8 High temperature resistance No mechanical damage. Inductance change within 10%. Q value change (ferrite) within 30%. Temperature: 852; Testing time: 1000 +24/-0 h
9 Static Humidity No mechanical damage. Inductance change within 10%. Q value change (ferrite) within 30%. Humidity: 90% to 95% RH; Temperature: 602; Testing time: 1000 +24/-0 h
10 High temperature load No mechanical damage. Inductance change within 10%. Q value change (ferrite) within 30%. Imposed current: rated current; Temperature: 852; Testing time: 1000 +24/-0 h
11 Temperature Shock No mechanical damage. Inductance change within 10%. Q value change (ferrite) within 30%. Temperature: -40 for 303min +85 for 303min; Number of cycles: 32

Packaging

Taping & Reel Dimensions:

  • Reel Dimensions (mm): A=1782.0, B=22.02.0, C=12.51.5, N=572.0, G=8
  • Taping Dimensions (mm) for 201212 (Embossed tape): W=8.000.2, E=1.750.10, F=3.500.10, D0=1.500.10, D1=1.000.10, P0=4.000.10, P010=40.00.20, P1=4.000.10, P2=2.000.10, A0=1.520.10, B0=2.410.10, K0=1.350.10, t=0.230.20
  • Taping Dimensions (mm) for 201209: A0=1.500.2, B0=2.300.2, W=8.00.2, F=3.50.1, E=1.750.2, P1=4.00.2, P2=2.00.1, P0=4.00.2, D0=1.550.1, T=0.950.1
  • Peeling off Force: 0.1N0.7N (pulling in the direction of arrow), Speed: 300mm/min. Cover bond should not be damaged and bond the tape when it peeled off.
  • Packaging Quantity (Pcs):
    • 201212: REEL=3000, BOX=30000, CASE=180000
    • 201209: REEL=4000, BOX=40000, CASE=240000

Recommended Soldering Conditions

Reflow Soldering:

  • Temperature difference between solder and ferrite surface during pre-heating: max 150.
  • Temperature difference between product surface and solvent after soldering: max 100.
  • Soldering should be performed within the allowable range of the indicated curve.

Iron Soldering:

  • Soldering Iron Temperature: 350 (Max)
  • Power: 30W (Max)
  • Soldering Time: < 5S (Avoid touching the terminal electrodes with the soldering iron tip).

Cleaning

  • Cleaning Temperature: 60 (max)
  • Cleaning Time: 1 minute (min)
  • Ultrasonic Output Power: 200W (max)

Storage Requirements

  • Storage Period: Within 1 year from the inspection date at the inductor company. If exceeding 1 year, solder ability must be checked before use.
  • Storage Conditions:
    • Warehouse Temperature: -10 ~ +40, Relative Humidity: 30 ~ 70%.
    • Do not store in corrosive substances (sulfur, chlorine gas, acid) to prevent electrode oxidation.
    • Store on a pallet to prevent influence from humidity and dust.
    • Avoid heat shock, vibration, and direct sunlight.
    • Products should be stored in airtight packaging.

Usage Of ODS (Ozone Depleting Substances)

The company does not use ODS such as CCl4 (Carbon Tetrachloride) and HCFC in its production process.

Notes

  • If the product is designated as "Unitary lead free", it complies with RoHS directive requirements.
  • This specification guarantees the quality of the product as a single unit. Ensure your product has been evaluated and confirmed against your specifications when mounting our product.
  • The company does not warrant against failure caused by any use of the product that deviates from the intended use described in this specification.

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Beijing Silk Road Enterprise Management Services Co., Ltd.
Location 16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person Sellina

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