Multilayer chip ferrite power inductor FH CMH160808B4R7MT with pure silver inner electrodes and Ni Sn plating
Price:
Negotiable
MOQ:
Negotiable
Delivery Time:
Negotiable
Product Description
Product Overview
The CMH160808B Series is a multilayer chip ferrite power inductor designed for various electronic applications. These inductors are constructed with a ferrite or ceramic body, inner electrodes made of pure silver, and terminal electrodes with a silver layer plated with Ni/Sn. They offer precise inductance values with specified tolerances and are suitable for reflow soldering processes. The series is manufactured to meet stringent reliability standards, ensuring performance in diverse operating conditions.
Product Attributes
- Product Type: Multilayer Chip Ferrite Power Inductor
- Series: CMH160808B Series
- Body Material: Ferrite (Ni-Cu-Zn system) or Ceramic
- Inner Electrode Material: Pure Silver (Ag)
- Terminal Electrode Material: Silver layer (Ag) with Ni/Sn plating
- Plating: Ni/Sn
- Packaging: Tape & Reel (T)
- Certifications: Compliant with RoHS directive (if labeled "Unitary lead free")
Technical Specifications
| Part NO. | Custom er P/N | Tolerance (%) | Inductance (H) | RDC () | Test frequency (MHz) | Test voltage (mV) | SRF (MHz) min | Rated current (mA)max | Dimensions (LWT mm) |
|---|---|---|---|---|---|---|---|---|---|
| CMH160808BR47MT | 20 | 0.47 | 0.1030% | 1 | 50 | 100 | 1050 | 1.60.80.8 | |
| CMH160808BR56MT | 20 | 0.56 | 0.1230% | 1 | 50 | 100 | 1050 | 1.60.80.8 | |
| CMH160808B1R0MT | 20 | 1.0 | 0.2030% | 1 | 50 | 98 | 900 | 1.60.80.8 | |
| CMH160808B1R8MT | 20 | 1.8 | 0.2430% | 1 | 50 | 95 | 750 | 1.60.80.8 | |
| CMH160808B2R2MT | 20 | 2.2 | 0.2430% | 1 | 50 | 95 | 750 | 1.60.80.8 | |
| CMH160808B4R7MT | 20 | 4.7 | 0.5030% | 1 | 50 | 65 | 700 | 1.60.80.8 |
Reliability Testing Items
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Operating Temperature Range | -40+85 | |
| Solder ability | At least 95% of terminal electrode should be covered with solder | Preheating temperature:120 to 150; Preheating time: 60s; Solder: 96.5%Sn/3.0%Ag/0.5%Cu; Solder temperature: 2455; Immersion tin depth:10mm; Duration: 51s; Dip performance to a flux of about:3 ~ 5 s |
| Resistance to Soldering | At least 95% of terminal electrode should be covered with solder. No mechanical damage. Inductance change: B: 30%; A: 30% | Preheating temperature: 120 to 150; Preheating time: 60s; Solder: 96.5%Sn/3.0%Ag/0.5%Cu; Solder temperature: 2605; Immersion tin depth:10mm; Duration: 101s; Dip performance to a flux of about:3 ~ 5 s |
| Adhesion of electrode | The termination and body should be no damage. | Applied force: 7N for 1608 series. Keep time: 101S |
| Low temperature resistance | No mechanical damage. Inductance change: within 10% | Temperature: -402; Testing time: 1000 +240/-0 h |
| Bending strength | No mechanical damage. | Testing board: glass epoxy-resin substrate; Compression speed: 0.5 mm/s; Curvature: 2mm; Hold time: 20s1s |
| Vibration | No mechanical damage. Inductance change: within 10% | Amplitude: 1.5mm; Test time: 2h in each of 3 mutually perpendicular directions; Frequency range: 10Hz to 55Hz to 10Hz for 1min. |
| High temperature resistance | No mechanical damage. Inductance change: within 10% | Testing time: 1000 +240/-0 h; Temperature: 852 |
| Static Humidity | No mechanical damage. Inductance change: within 10% | Humidity: 90% to 95% RH; Temperature: 602; Testing time: 1000 +240/-0 h |
| High temperature load | No mechanical damage. Inductance change: within 10% | Impose current: rated current; Testing time: 1000 +240/-0 h; Temperature: 852 |
| Temperature Shock | No mechanical damage. Inductance change: within 10% | Temperature: -40 for 303min +85 for 303min; Number of cycles: 32 |
Packaging
| Size | Pieces per Reel | Pieces per Box | Pieces per Case |
|---|---|---|---|
| 160808 | 4000 | 40000 | 240000 |
Recommended Soldering Conditions
Products can be applied to reflow soldering.
- Reflow Soldering Profile: Products should be soldered within the allowable range indicated by the slanted line.
- Iron Soldering: Soldering temperature: 350; Power: 30W max; Duration: < 5S. Take care not to apply the tip of the soldering iron to the terminal electrodes.
Cleaning Conditions
- Cleaning temperature: 60 max
- Cleaning time: 1 minute min.
- Ultrasonic output power: 200W max
Storage Requirements
- Storage Period: Within 1 year from the factory inspection date. If exceeded, solder ability should be checked.
- Storage Conditions: Temperature: -10 to +40, Humidity: 30% to 70% relative humidity. Avoid corrosive substances, moisture, dust, heat shock, vibration, and direct sunlight. Products should be stored in airtight packaged condition.
Usage Of ODS (Ozone Depleting Substances)
The company does not use ODS such as CCl4, HCFC in its production process.
Notes
- If the product is labeled "Unitary lead free", it complies with RoHS directive requirements.
- This specification guarantees the quality of the product as a single unit. Ensure your product has been evaluated and confirmed when this product is mounted.
- The company cannot warrant against failure caused by any use of the product that deviates from the intended use described in this specification.
Similar Products
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina