Beijing Silk Road Enterprise Management Services Co., Ltd.
                                                                                                           
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Chip High Frequency Inductors FH VHF100505HQ1N0ST Featuring Ceramic Body and Ni Sn Plated Electrodes

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Product Description

Product Overview

The VHF100505HQ Series Chip High Frequency Inductors are designed for demanding electronic applications. These multilayer chip inductors are constructed with a ceramic body and silver inner electrodes, featuring Ni/Sn plating for reliable termination. They offer a wide range of inductance values with tight tolerances, suitable for high-frequency circuits. The series is engineered for robust performance, as evidenced by comprehensive reliability testing, and is supplied in tape & reel packaging for automated assembly.

Product Attributes

  • Product Type: Chip high frequency inductors
  • Series: VHF100505HQ
  • Material: Ceramic body (Al2O3), Silver (Ag) inner electrode and terminal electrode, Ni/Sn plating
  • Packaging: Tape & Reel
  • Certifications: RoHS compliant (for "Unitary lead free" products)

Technical Specifications

Part NO. Inductance (nH) Q Value (min) RDC () max Test Frequency (MHz) Test Voltage (mV) SRF (MHz) min Rated Current (mA)max
VHF100505HQ1N0T 1.0 8 0.06 100 50 10000 1000
VHF100505HQ1N1T 1.1 8 0.07 100 50 10000 1000
VHF100505HQ1N2T 1.2 8 0.07 100 50 10000 1000
VHF100505HQ1N3T 1.3 8 0.07 100 50 10000 1000
VHF100505HQ1N5T 1.5 8 0.08 100 50 6000 1000
VHF100505HQ1N6T 1.6 8 0.08 100 50 6000 1000
VHF100505HQ1N8T 1.8 8 0.08 100 50 6000 900
VHF100505HQ2N0T 2.0 8 0.09 100 50 6000 900
VHF100505HQ2N2T 2.2 8 0.09 100 50 6000 900
VHF100505HQ2N4T 2.4 8 0.10 100 50 6000 800
VHF100505HQ2N7T 2.7 8 0.12 100 50 6000 800
VHF100505HQ3N0T 3.0 8 0.12 100 50 6000 800
VHF100505HQ3N3T 3.3 8 0.13 100 50 6000 800
VHF100505HQ3N6T 3.6 8 0.15 100 50 4000 700
VHF100505HQ3N9T 3.9 8 0.16 100 50 4000 700
VHF100505HQ4N3T 4.3 8 0.16 100 50 4000 700
VHF100505HQ4N7T 4.7 8 0.16 100 50 4000 700
VHF100505HQ5N1T 5.1 8 0.16 100 50 4000 600
VHF100505HQ5N6T 5.6 8 0.20 100 50 4000 600
VHF100505HQ6N2T 6.2 8 0.20 100 50 3900 600
VHF100505HQ6N8T 6.8 8 0.20 100 50 3900 600
VHF100505HQ7N5T 7.5 8 0.24 100 50 3700 500
VHF100505HQ8N2T 8.2 8 0.24 100 50 3600 500
VHF100505HQ9N1T 9.1 8 0.26 100 50 3400 500
VHF100505HQ10NT 10 8 0.26 100 50 3200 500
VHF100505HQ12NT 12 8 0.50 100 50 2700 400
VHF100505HQ15NT 15 8 0.50 100 50 2300 400
VHF100505HQ18NT 18 8 0.60 100 50 2100 350
VHF100505HQ20NT 20 8 0.60 100 50 2000 350
VHF100505HQ22NT 22 8 0.60 100 50 1900 350
VHF100505HQ27NT 27 8 0.70 100 50 1600 300
VHF100505HQ33NT 33 8 0.80 100 50 1300 300
VHF100505HQ39NT 39 8 1.00 100 50 1200 250
VHF100505HQ43NT 43 8 1.10 100 50 1100 250
VHF100505HQ47NT 47 8 1.10 100 50 1000 250
VHF100505HQ56NT 56 8 1.20 100 50 750 200
VHF100505HQ68NT 68 8 1.40 100 50 750 200
VHF100505HQ82NT 82 8 1.60 100 50 750 200
VHF100505HQR10T 100 8 2.00 100 50 700 200
VHF100505HQR12T 120 8 2.50 100 50 600 150
VHF100505HQR15T 150 8 3.00 100 50 550 150
VHF100505HQR18T 180 8 3.50 100 50 500 150
VHF100505HQR22T 220 8 3.70 100 50 450 100
VHF100505HQR27T 270 8 4.50 100 50 400 100
VHF100505HQR33T 330 6 5.00 50 50 350 80
Dimension (Size) L (mm) W (mm) T (mm) L1 (mm) Terminal Width (mm)
100505 1.00.15 0.50.15 0.50.15 0.250.1 0.50.15
Item Requirements Test Methods and Remarks
Operating Temperature Range -55+125
Solder ability At least 95% of terminal electrode should be covered with solder. Preheating temperature: 120 to 150, Preheating time: 60s, Solder: 96.5%Sn/3.0%Ag/0.5%Cu, Solder temperature: 2455, Immersion tin depth: 10mm, Duration: 51s
Resistance to Soldering Heat At least 95% of terminal electrode should be covered with solder. No mechanical damage. Inductance: HQ: change within 10%, Q value change(ceramic): within 20% Preheating temperature: 120 to 150, Preheating time: 60s, Solder: 96.5%Sn/3.0%Ag/0.5%Cu, Solder temperature: 2605, Immersion tin depth: 10mm, Duration: 101s
Adhesion of electrode The termination and body should be no damage. Applied force: 5N for 1005 series. Keep time: 101S
Low temperature resistance No mechanical damage. Inductance change: within 10%, Q value change(ceramic): within 20% Temperature: -552, Testing time: 1000 24 0 h
Bending strength No mechanical damage. Testing board: glass epoxy-resin substrate, For 0.5 mm/s compression speed, curvature: 2mm, hold time 20s1s
Vibration No mechanical damage. Inductance change: within 10%, Q value change(ceramic): within 20% Amplitude modulation: 1.5mm, Test time: A period of 2h in each of 3 mutually perpendicular directions. Frequency range: 10Hz to 55Hz to 10Hz for 1min.
High temperature resistance No mechanical damage. Inductance change: within 10%, Q value change(ceramic): within 20% Testing time: 1000 24 0 h, Temperature: 1252
Static Humidity No mechanical damage. Inductance change: within 10%, Q value change(ceramic): within 20% Humidity: 90% to 95% RH, Temperature: 602, Testing time: 1000 24 0 h
High temperature load No mechanical damage. Inductance change: within 10%, Q value change(ceramic): within 20% Impose current: rated current, Testing time: 1000 24 0 h, Temperature: 1252
Temperature Shock No mechanical damage. Inductance change: within 10%, Q value change(ceramic): within 20% Temperature: -55 for 303min +125 for 303min, Number of cycles: 100
Size Pieces per REEL Pieces per BOX Pieces per CASE
100505 10000 100000 600000
Soldering Conditions Details
Reflow Soldering Pre-heating temperature difference: 150. Cooling temperature difference: 100. Products should be soldered within the allowable range indicated by the slanted line in the reflow soldering profile.
Iron Soldering Iron temperature: 350 (Max), Power: 30W (Max), Soldering Time:
Cleaning Conditions Details
Temperature 60 (max)
Time 1 minute (min)
Ultrasonic Power 200W (max)
Storage Requirements Details
Storage Period Within 1 year from the factory inspection date. If exceeded, check solderability before use.
Storage Conditions Temperature: -10 to +40, Humidity: 30% to 70% RH. Avoid corrosive substances, moisture, dust, heat shock, vibration, and direct sunlight. Products should be stored in airtight packaging.
ODS Usage Details
Substances Not Used CCl4 (Carbon Tetrachloride), HCFC, etc.
Notes Details
RoHS Compliance "Unitary lead free" products comply with RoHS directive requirements.
Product Integration Ensure your product is evaluated and confirmed against your specifications when our product is mounted.
Usage Deviation We do not warrant against failure caused by any use of our product that deviates from the intended use as described in this product specification.

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Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Beijing Silk Road Enterprise Management Services Co., Ltd.
Location 16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person Sellina

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