Beijing Silk Road Enterprise Management Services Co., Ltd.
                                                                                                           
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multilayer chip ferrite inductors FH CMI201209V47NKT with Ni Cu Zn ferrite material and silver inner electrodes

Price Negotiable
Price: Negotiable
MOQ: Negotiable
Delivery Time: Negotiable
Product Description

Product Overview

The CMI2012 Series Multilayer Chip Ferrite Inductors are designed for various electronic applications. These inductors offer reliable performance with a compact multilayer chip structure. They are suitable for use in a wide range of operating temperatures and are manufactured with high-quality ferrite or ceramic bodies, silver inner electrodes, and terminal electrodes with Ni/Sn plating.

Product Attributes

  • Product Type: Multilayer Chip Ferrite Inductors
  • Series: CMI2012 Series
  • Material: Ferrite (Ni-Cu-Zn system)
  • Inner Electrode Material: Pure Silver (Ag)
  • Terminal Electrode Plating: Ni/Sn plating
  • Body Material: Ferrite or Ceramic
  • Certifications: RoHS compliant (if specified as "Unitary lead free")

Technical Specifications

Model Size (L x W x T) (mm) Inductance (H) Tolerance Q Value (min) DCR () max Test Frequency (MHz) Test Voltage (mV) SRF (MHz) min Rated Current (mA) max
CMI201209V47NKT 2.0 x 1.2 x 0.9 0.047 10% 25 0.15 50 50 320 300
CMI201209V56NKT 2.0 x 1.2 x 0.9 0.056 10% 25 0.15 50 50 320 300
CMI201209V68NKT 2.0 x 1.2 x 0.9 0.068 10% 25 0.20 50 50 280 300
CMI201209V82NKT 2.0 x 1.2 x 0.9 0.082 10% 25 0.20 50 50 280 300
CMI201209VR10KT 2.0 x 1.2 x 0.9 0.10 10% 20 0.20 25 50 235 250
CMI201209VR12KT 2.0 x 1.2 x 0.9 0.12 10% 20 0.25 25 50 220 250
CMI201209VR15KT 2.0 x 1.2 x 0.9 0.15 10% 20 0.25 25 50 200 250
CMI201209VR18KT 2.0 x 1.2 x 0.9 0.18 10% 20 0.30 25 50 185 250
CMI201209VR22KT 2.0 x 1.2 x 0.9 0.22 10% 20 0.30 25 50 170 250
CMI201209VR27KT 2.0 x 1.2 x 0.9 0.27 10% 20 0.40 25 50 150 250
CMI201209VR33KT 2.0 x 1.2 x 0.9 0.33 10% 20 0.40 25 50 145 250
CMI201209VR39KT 2.0 x 1.2 x 0.9 0.39 10% 25 0.50 25 50 135 200
CMI201209VR47KT 2.0 x 1.2 x 0.9 0.47 10% 25 0.50 25 50 125 200
CMI201209VR56KT 2.0 x 1.2 x 0.9 0.56 10% 25 0.60 25 50 115 150
CMI201209VR68KT 2.0 x 1.2 x 0.9 0.68 10% 25 0.65 25 50 105 150
CMI201209VR82KT 2.0 x 1.2 x 0.9 0.82 10% 25 0.70 25 50 100 150
CMI201209U1R0KT 2.0 x 1.2 x 0.9 1.0 10% 35 0.40 10 50 75 50
CMI201209U1R2KT 2.0 x 1.2 x 0.9 1.2 10% 35 0.40 10 50 65 50
CMI201209U1R5KT 2.0 x 1.2 x 0.9 1.5 10% 35 0.40 10 50 60 50
CMI201209U1R8KT 2.0 x 1.2 x 0.9 1.8 10% 35 0.40 10 50 55 50
CMI201209U2R2KT 2.0 x 1.2 x 0.9 2.2 10% 35 0.60 10 50 50 50
CMI201209U2R7KT 2.0 x 1.2 x 0.9 2.7 10% 35 0.60 10 50 45 50
CMI201209U3R3KT 2.0 x 1.2 x 0.9 3.3 10% 35 0.60 10 50 41 50
CMI201209U3R9KT 2.0 x 1.2 x 0.9 3.9 10% 35 0.80 10 50 38 50
CMI201209U4R7KT 2.0 x 1.2 x 0.9 4.7 10% 35 0.90 10 50 35 30
CMI201209X5R6KT 2.0 x 1.2 x 0.9 5.6 10% 30 1.00 4 50 32 15
CMI201209X6R8KT 2.0 x 1.2 x 0.9 6.8 10% 30 1.05 4 50 29 15
CMI201209X8R2KT 2.0 x 1.2 x 0.9 8.2 10% 30 1.05 4 50 26 15
CMI201209X100KT 2.0 x 1.2 x 0.9 10 10% 30 1.15 2 50 24 15
CMI201209X120KT 2.0 x 1.2 x 0.9 12 10% 30 1.15 2 50 22 15
CMI201209J150KT 2.0 x 1.2 x 0.9 15 10% 25 1.15 1 50 19 5
CMI201209J180KT 2.0 x 1.2 x 0.9 18 10% 25 1.20 1 50 18 5
CMI201209J220KT 2.0 x 1.2 x 0.9 22 10% 25 1.20 1 50 16 5
CMI201209J270KT 2.0 x 1.2 x 0.9 27 10% 25 1.50 1 50 16 5
CMI201212J330MT 2.0 x 1.2 x 1.2 33 20% 25 1.50 1 50 16 5
CMI201212J390MT 2.0 x 1.2 x 1.2 39 20% 25 1.50 1 50 16 5
CMI201212J470MT 2.0 x 1.2 x 1.2 47 20% 25 1.70 1 50 15 5
CMI201212J560MT 2.0 x 1.2 x 1.2 56 20% 25 2.60 1 50 10 5
CMI201212J680MT 2.0 x 1.2 x 1.2 68 20% 25 2.60 1 50 10 5
Item Requirements Test Methods and Remarks
Operating Temperature Range -40+85
Solder ability At least 95% of terminal electrode should be covered with solder Preheating temperature: 120 to 150, Preheating time: 60s, Solder: 96.5%Sn/3.0%Ag/0.5%Cu, Solder temperature: 2455, Immersion tin depth: 10mm, Duration: 51s
Resistance to Soldering At least 95% of terminal electrode should be covered with solder. No mechanical damage. Inductance change: V,U within 20%, X within 25%, J within 30%. Q value change(ferrite): within 30% Preheating temperature: 120 to 150, Preheating time: 60s, Solder: 96.5%Sn/3.0%Ag/0.5%Cu, Solder temperature: 2605, Immersion tin depth: 10mm, Duration: 101s
Adhesion of electrode The termination and body should be no damage. Applied force: 10N for 2012 series. Keep time: 101S
Low temperature resistance No mechanical damage. Inductance change: within 10%. Q value change(ferrite): within 30% Temperature: -402, Testing time: 100024h
Bending strength No mechanical damage. Testing board: glass epoxy-resin substrate, For 0.5 mm/s compression speed, curvature: 2mm, hold time: 20s1s
Vibration No mechanical damage. Inductance change: within 10%. Q value change(ferrite): within 30% Amplitude modulation: 1.5mm, Test time: A period of 2h in each of 3 mutually perpendicular directions. Frequency range: 10Hz to 55Hz to 10Hz for 1min.
High temperature resistance No mechanical damage. Inductance change: within 10%. Q value change(ferrite): within 30% Testing time: 100024h, Temperature: 852
Static Humidity No mechanical damage. Inductance change: within 10%. Q value change(ferrite): within 30% Humidity: 90% to 95% RH, Temperature: 602, Testing time: 100024h
High temperature load No mechanical damage. Inductance change: within 10%. Q value change(ferrite): within 30% Impose current: rated current, Testing time: 100024h, Temperature: 852
Temperature Shock No mechanical damage. Inductance change: within 10%. Q value change(ferrite): within 30% Temperature: -40 for 303min +85 for 303min, Number of cycles: 32

Packaging

Taping Dimensions (Unit: mm)

Model Size A B C N G
Reel CF-8 1782.0 22.02.0 12.51.5 572.0 8
Model Size A0 B0 W F E P1 P2 P0 D0 T
201212 Embossed tape 1.520.10 2.410.10 8.00+/-0.2 3.50+/-0.10 1.75+/-0.10 4.00+/-0.10 2.00+/-0.10 4.00+/-0.10 1.50+/-0.10 0.23+/-0.20
201209 Embossed tape 1.500.2 2.300.2 8.00.2 3.50.1 1.750.2 4.00.2 2.00.1 4.00.2 1.550.1 0.950.1

Peeling off force: 0.1N0.7N (pulling in the direction of arrow), Speed: 300mm/min.

Packaging Quantity (Unit: Pcs)

Model Size REEL BOX CASE
201212 3000 30000 180000
201209 4000 40000 240000

Recommended Soldering Conditions

Reflow Soldering:

  • Temperature difference between solder and ferrite surface during pre-heating: max 150.
  • Temperature difference between product surface and solvent during cooling after soldering: max 100.
  • Products should be soldered within the allowable range indicated by the reflow soldering profile curve.

Iron Soldering:

  • Soldering Iron Temperature: 350 (Max)
  • Power: 30W (Max)
  • Soldering Time: < 5S (Avoid touching terminal electrodes with the soldering iron tip)

Cleaning

  • Cleaning Temperature: 60 (max)
  • Cleaning Time: 1 minute (min)
  • Ultrasonic Output Power: 200W (max)

Storage Requirements

Storage Period: Within 1 year from the factory inspection date. If exceeding 1 year, solderability must be checked before use.

Storage Conditions:

  • Warehouse Temperature: -10 to +40, Relative Humidity: 30% to 70%.
  • Do not store in corrosive substances (sulfur, chlorine gas, acid) to prevent electrode oxidation.
  • Store on shelves to avoid moisture and dust.
  • Avoid heat shock, vibration, and direct sunlight.
  • Products should be stored in airtight packaging.

Usage Of ODS (Ozone Depleting Substances)

The company does not use ODS such as CCl4 and HCFC in its production process.

Notes

  • If the product is labeled "Unitary lead free", it complies with RoHS directive requirements.
  • This specification guarantees the quality of the product as a single unit. Ensure your product has been evaluated and confirmed against your specifications when integrating our product.
  • The company does not warrant against failure caused by any use deviating from the intended use described in this specification.

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Beijing Silk Road Enterprise Management Services Co., Ltd.
Location 16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person Sellina

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