Civil Grade Multilayer Ceramic Chip Capacitors FH-BK Guangdong Fenghua Bangke Elec 1206B681K102NT Model
Product Overview
This document outlines the approval sheet for a series of civil-grade multilayer ceramic chip capacitors manufactured by Guangdong Fenghua Bonke Electronics Co., Ltd. These capacitors are designed for various electronic applications and are available in a wide range of specifications, including different sizes, dielectric materials, capacitance values, voltage ratings, and termination types. The document details their model number representation, dimensions, structural components, and stringent quality control measures including appearance inspection, electrical parameter testing (capacitance, dissipation factor, insulation resistance, dielectric withstand voltage), and sampling plans for electrical performance, dimensions, appearance, and solderability.
Product Attributes
- Brand: Fenghua Bonke (FHBK)
- Product Type: Multilayer Ceramic Chip Capacitors
- Series: Civil-grade
- Termination Material: Three-layer plating (Ag/Ni/Sn)
- Packaging Options: Bulk packaging (B), Taped packaging (T)
- Origin: Guangdong Fenghua Bonke Electronics Co., Ltd.
Technical Specifications
| Model Representation Part | Description | Details | ||
|---|---|---|---|---|
| Size Specification (inch) | Dimensions (LW) | 0201 (0.600.30), 0402 (1.000.50), 0603 (1.600.80), 0805 (2.031.27), 1206 (3.201.52), 1210 (3.202.54), 1808 (4.502.00), 1812 (4.503.20), 2220 (5.705.00), 3035 (7.609.00) | ||
| Dielectric Type | Dielectric Material | COG, B (X7R), X (X5R) | ||
| Nominal Capacitance (pF) | Representation | 0R5 (0.5pF), 100 (10pF), 472 (4700pF), 226 (22x10^6 pF), 107 (10x10^7 pF) | ||
| Capacitance Tolerance | Allowable Deviation | B (0.10pF), C (0.25pF), D (0.50pF), F (1%), G (2%), J (5%), K (10%), M (20%) | ||
| Rated Voltage | Representation & Voltage (V) | 6R3 (6.3V), 10 (10x100V), 160 (16x100V), 250 (25x100V), 500 (50x100V), 630 (63x100V), 101 (10x10^1V), 201 (20x10^1V), 251 (25x10^1V), 501 (50x10^1V), 102 (10x10^2V) | ||
| Terminal Material | Terminal Type | N (Three-layer plating: Ag/Ni/Sn) | ||
| Packaging Form | Packaging Type | B (Bulk), T (Taped) | ||
| Dimensions (mm) | ||||
| Size Code | L | W | T | e |
| 0201 | 0.600.03 | 0.300.03 | 0.300.03 | 0.150.05 |
| 0402 | 1.000.05 | 0.500.05 | 0.500.05 | 0.250.10 |
| 0603 | 1.600.15 | 0.800.15 | 0.800.15 | 0.300.10 |
| 0805 | 2.030.30 | 1.270.20 | 0.700.20 | 0.500.20 |
| 1206 | 3.200.30 | 1.520.25 | 0.700.20 | 0.500.25 |
| 1210 | 3.200.30 | 2.540.30 | 1.250.30 | 0.750.25 |
| 1808 | 4.500.40 | 2.000.20 | 2.00 | 0.750.25 |
| 1812 | 4.500.38 | 3.200.38 | 3.50 | 0.900.60 |
| 2220 | 5.700.40 | 5.000.40 | 5.10 | 0.900.60 |
| 3035 | 7.600.50 | 9.000.50 | 5.10 | 0.900.60 |
| Electrical Specifications | ||||
| Item | Test Method | Requirement | ||
| Capacitance | Test Frequency: 1MHz50KHz (COG 1000pF, B/X 100pF); 1KHz50Hz (COG > 1nF, B/X 100pF 10uF). Test Voltage: 1.0V0.2Vrms. | Within specified allowable deviation. | ||
| Dissipation Factor (DF) | Same as Capacitance test. | COG: CR50pF, DF1510; CR50pF, DF1.5(150/CR+7)10. B/X (X7R, X5R): C10UF, DF2.5% (100V), 3.5% (50V, 25V), 5.0% (16V), 10% (10V). For 0603 or smaller sizes, or C0.22uF, DF10% or per above standards. | ||
| Insulation Resistance (Ri) | Test Voltage: Rated Voltage (UR500V), 500V (UR>500V). Reading time: 2min. | COG: Ri10000M. B/X: CR25nF, Ri4000M; CR25nF, RiCR100s. | ||
| Dielectric Withstand Voltage | Applied Voltage: 2.5UR (UR200V), 2UR (UR=250V), 1.5UR (500V UR | No breakdown, arcing, or visible damage. | ||
| Dimensions | Checked with measuring tools of appropriate precision. | Refer to section 2.1. | ||
| Appearance | Visual inspection or 10x microscope under appropriate lighting. | No deformation, damage, dents, cracks, burrs, foreign matter adhesion, delamination, or metallization peeling. | ||
| Solderability | Immersion in solder bath (10-15mm depth) at 2455 for 2s. | Solder coverage rate > 95%. | ||
| Storage Conditions | ||||
| Storage Period | One year. Recommended use within 6 months of purchase to ensure solderability. | |||
| Storage Temperature | -10 ~ 40 | |||
| Storage Humidity | 30 ~ 80% RH | |||
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