thick film chip resistor FOJAN FRC0603F1001TS suitable for power supplies communication and measuring tools
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Product Description
FRC-Series Thick Film Chip Resistor
The FRC-Series Thick Film Chip Resistor is a compact and lightweight component designed for high reliability and quality. It finds extensive application in various electronic devices, including entertainment systems, appliances, computers, communication equipment, power supplies, illumination equipment, and measuring instruments.
Product Attributes
- Brand: FOJAN
- Product Type: Thick Film Chip Resistor
- Material: Ceramic substrate (Al2O3), Conductive layer (Ag), Resistive layer (RuO2+ glass), Inner protective layer (Glass), Outer Protective layer (Epoxy), Marking (Epoxy), Ni plating layer (Ni), Sn plating layer (Matte Tin)
- Origin: China (implied by www.fojan.cn)
Technical Specifications
| Type | Rated Power (at 70) | Max. Working Voltage (RCWV) | Max Overload Voltage | T.C.R. (PPM/) | Resistance Range | Zero Ohm Resistance Tolerance | Zero Ohm Rated Current | Zero Ohm Max Current |
|---|---|---|---|---|---|---|---|---|
| 0201 | 1/20W | 25V | 50V | 400 (1~10) 200 (10~10M) | 1~10M | 5% ( | 0.5A | 1A |
| 0402 | 1/16W | 50V | 100V | 200 (1~10) 100 (10~22M) | 1~22M | 5% ( | 1A | 2A |
| 0603 | 1/10W | 75V | 150V | 200 (1~10) 100 (10~22M) | 1~22M | 1% (5% ( | 1A | 2A |
| 0805 | 1/8W | 150V | 300V | 200 (1~10) 100 (10~22M) | 1~22M | 1% (5% ( | 2A | 5A |
| 1206 | 1/4W | 200V | 400V | 200 (1~10) 100 (10~22M) | 1~22M | 1% (5% ( | 2A | 10A |
| 1210 | 1/2W | 200V | 400V | 200 (1~10) 100 (10~22M) | 1~22M | 1% (5% ( | 2A | 10A |
| 1218 | 1W | 200V | 500V | 200 (1~10) 100 (10~1M) | 1~1M | 1% (5% ( | 6A | 10A |
| 1812 | 3/4W | 200V | 400V | 200 (1~10) 100 (10~10M) | 1~10M | 1% (5% ( | 2A | 10A |
| 2010 | 3/4W | 200V | 400V | 200 (1~10) 100 (10~22M) | 1~22M | 1% (5% ( | 2A | 10A |
| 2512 | 1W | 200V | 400V | 200 (1~10) 100 (10~22M) | 1~22M | 1% (5% ( | 2A | 10A |
| Item | Test Method | Test Condition | Specification |
|---|---|---|---|
| Temperature Coefficient | JIS C 5201 4.8 / IEC60115-1-4.8 | TCR=(R-R0)/(t-t0)R0 10^6 (ppm) R0: resistance at room temperature; R: resistance at 125 or -55; t0: room temperature; t: test temperature (125 or -55) | As SPEC |
| Short-time overload | JIS C 5201 4.13 / IEC60115-1-4.13 | Applied 2.5 times of rated voltage for 5 seconds. Measure the variation of resistance before and after test. | 0.5%, 1%: (1.0%+0.05) 5%: (2.0%+0.05) |
| Solderability | JIS C 5201 4.17 / IEC60115-1-4.17 | Dip the terminal in a flux and then dip into a soldering bath at 2455 for 30.5 sec. | 95% coverage |
| Resist to soldering heat | JIS C 5201 4.18 / IEC 60115-1-4.18 | Dip the terminal in a flux and then dip into a soldering bath at 2605 for 100.5 sec. Measure the variation of resistance before and after test. | (1.00% +0.05) |
| Insulation resistance | JIS C 5201 4.6 / IEC60115-1-4.6 | Applied the dielectric withstanding voltage on the center of body for 605 seconds. Then measure insulation resistance. | >10G |
| Dielectric withstanding voltage | JIS C 5201 4.7 / IEC60115-1-4.7 | Applied the dielectric withstanding voltage on the center of body for 605 seconds. | No evidence of flashover, arcing or insulation breakdown |
| Terminal bending | JIS C 5201 4.33 / IEC60115-1-4.33 | Specimen shall be mounted on test board, then bend the board and maintained for 201s. Bending distance: 5+0.2/0 mm for resistors 1206, 2+0.2/0 mm for resistors >1206. Measure the variation of resistance before and after test. | (1.00% +0.05) |
| Rapid temperature changes | JIS C 5201 4.19 / IEC60115-1-4.19 | Put specimen in a chamber with temperature cycles: T1: -553; T2: 1553/1253, 30min each, repeated 300 cycles. Measure the variation of resistance before and after test. | 0.5%, 1%: (1.0%+0.05) 5%: (2.0%+0.05) |
| Humidity | JIS C 5201 4.24 / IEC60115-1-4.24 | Put resistor in a constant temperature and humidity chamber: 402, 90~95 %RH; apply rated voltage for 1.5 hours, then power off for 0.5 hours; repeat power on/off for a total test time of 1000 +48/-0 hours. Measure the variation of resistance before and after test. | (Data truncated in source) |
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