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China Thick Film Chip Resistor GiantOhm GR2512F0R68T4G00 Suitable for Telecommunications and Smart Devices for sale

Thick Film Chip Resistor GiantOhm GR2512F0R68T4G00 Suitable for Telecommunications and Smart Devices

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Product Description

Product Overview

The GiantOhm GR Series General Purpose Thick Film Chip Resistors are designed for high reliability and compatibility with reflow and wave soldering. Utilizing thick film technology, these resistors offer a tiny and lightweight solution suitable for a wide range of applications including home appliances, telecommunications, smart wearables, computers, notebooks, tablets, peripherals, and instruments. They are RoHS compliant and adhere to MSL Class 1 standards.

Product Attributes

  • Brand: GiantOhm
  • Series: GR Series
  • Technology: Thick Film
  • Compliance: RoHS compliant
  • Moisture Sensitivity Level: MSL 1

Technical Specifications

Manufacturer Part No. Example Series Size Tolerance Nominal Resistance Value PKG SPQ Feature TCR (PPM/)
GR1206J100KT5G00 GR 1206 5% (J) 100K (100K) T/R (Taping in Reel) 5000 General Purpose 100 to 300 (depending on resistance value and size)
0105 0.5% (D), 1% (F), 5% (J), Jumper ( 1 to 10M (0.5%, 1%), 1 to 10M (5%), -200~+600 (1R10), 300 (10R100), 200 (100)
0201 0.5% (D), 1% (F), 5% (J), Jumper ( 1 to 10M (0.5%, 1%), 1 to 10M (5%), -100~+350 (1R10), 200 (10)
0402 0.5% (D), 1% (F), 5% (J), Jumper ( 1 to 10M (0.5%), 1 to 22M (1%), 1 to 22M (5%), 200 (1R10), 100 (10 R10M), 200 (10MR22M), 300 (22MR100M)
0603 0.5% (D), 1% (F), 5% (J), Jumper ( 1 to 10M (0.5%), 1 to 22M (1%), 1 to 100M (5%), 200 (1R10), 100 (10 R10M), 200 (10MR22M), 300 (22MR100M)
0805 0.5% (D), 1% (F), 5% (J), Jumper ( 1 to 10M (0.5%), 1 to 22M (1%), 1 to 100M (5%), 200 (1R10), 100 (10 R10M), 200 (10MR22M), 300 (22MR100M)
1206 0.5% (D), 1% (F), 5% (J), Jumper ( 1 to 10M (0.5%), 1 to 22M (1%), 1 to 100M (5%), 200 (1R10), 100 (10 R10M), 200 (10MR22M), 300 (22MR100M)
1210 0.5% (D), 1% (F), 5% (J), Jumper ( 1 to 10M (0.5%), 1 to 22M (1%), 1 to 100M (5%), 200 (1R10), 100 (10 R10M), 200 (10MR22M), 300 (22MR100M)
1812 0.5% (D), 1% (F), 5% (J), Jumper ( 1 to 10M (0.5%), 1 to 22M (1%), 1 to 100M (5%), 200 (1R10), 100 (10 R10M), 200 (10MR22M), 300 (22MR100M)
2010 0.5% (D), 1% (F), 5% (J), Jumper ( 1 to 10M (0.5%), 1 to 22M (1%), 1 to 100M (5%), 200 (1R10), 100 (10 R10M), 200 (10MR22M), 300 (22MR100M)
2512 0.5% (D), 1% (F), 5% (J), Jumper ( 1 to 10M (0.5%), 1 to 22M (1%), 1 to 100M (5%), 200 (1R10), 100 (10 R10M), 200 (10MR22M), 300 (22MR100M)
Series Rated Power Max. Working Voltage (MWV) Max. Overload Voltage (MOV) Dielectric Withstanding Voltage (DWV) Max. Rated Current (MRC) Max. Overload Current (MOC)
GR0105 1/32W 15V 30V - 0.5A 1A
GR0201 1/20W 25V 50V - 0.5A 1A
GR0402 1/16W 50V 100V 100V 1A 2A
GR0603 1/10W 75V 150V 300V 1A 2A
GR0805 1/8W 150V 300V 500V 2A 5A
GR1206 1/4W 200V 400V 500V 2A 10A
GR1210 1/2W 200V 500V 500V 2A 10A
GR1812 3/4W 200V 500V 500V 2A 10A
GR2010 3/4W 200V 500V 500V 2A 10A
GR2512 1W 200V 500V 500V 2A 10A
Type L (mm) W (mm) H (mm) A (mm) B (mm)
0105 0.400.02 0.200.02 0.130.02 0.100.03 0.100.03
0201 0.600.03 0.300.03 0.230.03 0.100.05 0.150.05
0402 1.000.10 0.500.05 0.350.05 0.200.10 0.250.10
0603 1.600.10 0.800.10 0.450.10 0.300.20 0.300.20
0805 2.000.15 1.250.15 0.550.10 0.400.20 0.400.20
1206 3.100.15 1.550.15 0.550.10 0.450.20 0.450.20
1210 3.100.10 2.600.20 0.550.10 0.500.25 0.500.20
1812 4.500.20 3.200.20 0.550.20 0.500.20 0.500.20
2010 5.000.10 2.500.20 0.550.10 0.600.25 0.500.20
2512 6.350.10 3.200.20 0.550.10 0.600.25 0.500.20
Reliability Item Acceptable Criterion
Temperature Coefficient of Resistance (T.C.R.) Varies by size and resistance value (e.g., 100 PPM/ to 600 PPM/)
Insulation Resistance 109
Dielectric Withstanding Voltage No current or arc breakdown by 10uA
Short Time Over Load R/R=(1.0%+0.05) for 1% series; R/R=(2.0%+0.05) for 5% series and 0105;
Intermittent Overload R/R=(5.0%+0.05) for 1% series; R/R=(5.0%+0.05) for 5% series and 0105;
Resistance to Solvent No obvious damage, peeling, swelling phenomenon
Solderability Solder coverage over 95%; No more than 5% of the partially exposed substrate, non-wetted plating or ceramic substrate part.
Resistance to Soldering Heat R/R=(1.0%+0.05) for 1% series; R/R=(1.0%+0.05) for 5% series and 0105;
Thermal Shock R/R=(1.0%+0.05) for 1% series; R/R=(1.0%+0.05) for 5% series and 0105;
Solder Joint Endurance Test R/R=(1.0%+0.05) for 1% series; R/R=(1.0%+0.05) for 5% series and 0105;
Resistance to Dry Heat R/R=(1.0%+0.05) for 1% series; R/R=(3.0%+0.05) for 5% series and 0105;
Loading Life in Moisture R/R=(1.0%+0.05) for 1% series; R/R=(3.0%+0.05) for 5% series and 0105;
Load Life R/R=(1.0%+0.05) for 1% series; R/R=(3.0%+0.05) for 5% series and 0105;
Low temperature load test R/R=(1.0%+0.05) for 1% series; R/R=(2.0%+0.05) for 5% series and 0105;
Shear force test Without visible damage
Type Soldering Pad A (mm) Soldering Pad B (mm) Soldering Pad C (mm)
0105 0.2 0.5 0.2
0201 0.3 1.0 0.4
0402 0.5 1.5 0.6
0603 0.8 2.1 0.9
0805 1.2 3.0 1.3
1206 2.2 4.2 1.6
1210 2.2 4.2 2.8
1812 3.1 5.9 3.0
2010 3.5 6.1 2.8
2512 3.8 8.0 3.5
Storage Condition Specification
Temperature 255
Humidity 6015%RH
Storage life 0105/0201 size: 1 year; 0402 size: 2 years. FIFO.
Taping Type Size or Type A (mm) B (mm) C (mm) D (mm) E (mm) F (mm) G (mm) W (mm) T (mm)
Carrier Taping A 0105 0.240.05 0.450.05 2.0 1.5 1.75 3.5 4.0 8.0 0.40
Carrier Taping A 0201 0.400.05 0.700.05 2.0 1.5 1.75 3.5 4.0 8.0 0.47
Carrier Taping A 0402 0.670.1 1.170.1 2.0 1.5 1.75 3.5 4.0 8.0 0.47
Carrier Taping B 0603 1.10 1.90 2.0 1.5 1.75 3.5 4.0 8.0 0.67
Carrier Taping B 0805 1.65 2.40 2.0 1.5 1.75 3.5 4.0 8.0 0.81
Carrier Taping B 1206 1.90 3.45 2.0 1.5 1.75 3.5 4.0 8.0 0.81
Carrier Taping B 1210 2.85 3.50 2.0 1.5 1.75 3.5 4.0 8.0 0.81
Embossed Taping 2010 2.90 5.60 2.00 1.50 1.50 1.75 5.50 4.00 12.00 1.00
Embossed Taping 1812 3.50 4.80 2.00 1.50 1.50 1.75 5.50 4.00 12.00 1.00
Embossed Taping 2512 3.50 6.70 2.00 1.50 1.50 1.75 5.50 4.00 12.00 1.00
Type SPQ PCS/Rl. A (mm) B (mm) C (mm) D (mm) M (mm) W (mm)
0105 20,000 20,000 2.0 13.0 21.0 60.0 178.0 10.0
0201 15,000 15,000 2.0 13.0 21.0 60.0 178.0 10.0
0402 10,000 10,000 2.0 13.0 21.0 60.0 178.0 10.0
0603 5,000 5,000 2.0 13.0 21.0 60.0 178.0 10.0
0805 5,000 5,000 2.0 13.0 21.0 60.0 178.0 10.0
1206 5,000 5,000 2.0 13.0 21.0 60.0 178.0 10.0
1210 5,000 5,000 2.0 13.0 21.0 60.0 178.0 10.0
1812 4,000 4,000 2.0 13.0 21.0 60.0 178.0 13.8
2010 4,000 4,000 2.0 13.0 21.0 60.0 178.0 13.8
2512 4,000 4,000 2.0 13.0 21.0 60.0 178.0 13.8
Chip Resistor Size Adhesive Force Limit (gf)
0105, 0201 6~30
0402 10~40
0603 and above 10~70

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Company Beijing Silk Road Enterprise Management Services Co., Ltd.
Location 16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person Sellina

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