General purpose thick film chip resistors GiantOhm GR2010F0R68T4G00 with MSL 1 moisture sensitivity
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Product Description
Product Overview
The GiantOhm GR Series General Purpose Thick Film Chip Resistors are designed with advanced thick film technology, offering tiny and lightweight components with high reliability. These RoHS-compliant resistors are compatible with both reflow and wave soldering, and feature an MSL 1 moisture sensitivity level. They are suitable for a wide range of applications including home appliances, telecommunications, smart wearables, computers and peripherals, and instruments and meters.
Product Attributes
- Brand: GiantOhm
- Series: GR Series
- Technology: Thick Film
- Compliance: RoHS compliant
- Moisture Sensitivity Level (MSL): MSL 1
Technical Specifications
| Series | Rated Power | Max. Working Voltage (MWV) | Max. Overload Voltage (MOV) | Dielectric Withstanding Voltage (DWV) | Max. Rated Current (MRC) | Max. Overload Current (MOC) | Resistance Value Range (0.5%) | Resistance Value Range (1%) | Resistance Value Range (5%) | Jumper Resistance |
|---|---|---|---|---|---|---|---|---|---|---|
| GR0105 | 1/32W | 15V | 30V | - | 0.5A | 1A | 10-10M | 1-10M | - | < 50m |
| GR0201 | 1/20W | 25V | 50V | - | 0.5A | 1A | 1-10M | 1-10M | - | < 50m |
| GR0402 | 1/16W | 50V | 100V | 100V | 1A | 2A | 1-10M | 1-22M | 1-22M | < 50m |
| GR0603 | 1/10W | 75V | 150V | 300V | 1A | 2A | 1-10M | 1-22M | 1-100M | < 50m |
| GR0805 | 1/8W | 150V | 300V | 500V | 2A | 5A | 1-10M | 1-22M | 1-100M | < 50m |
| GR1206 | 1/4W | 200V | 400V | 500V | 2A | 10A | 1-10M | 1-22M | 1-100M | < 50m |
| GR1210 | 1/2W | 200V | 500V | 500V | 2A | 10A | 1-10M | 1-22M | 1-100M | < 50m |
| GR1812 | 3/4W | 200V | 500V | 500V | 2A | 10A | 1-10M | 1-22M | 1-100M | < 50m |
| GR2010 | 3/4W | 200V | 500V | 500V | 2A | 10A | 1-10M | 1-22M | 1-100M | < 50m |
| GR2512 | 1W | 200V | 500V | 500V | 2A | 10A | 1-10M | 1-22M | 1-100M | < 50m |
| Type | L (mm) | W (mm) | H (mm) | A (mm) | B (mm) |
|---|---|---|---|---|---|
| 0105 | 0.400.02 | 0.200.02 | 0.130.02 | 0.100.03 | 0.100.03 |
| 0201 | 0.600.03 | 0.300.03 | 0.230.03 | 0.100.05 | 0.150.05 |
| 0402 | 1.000.10 | 0.500.05 | 0.350.05 | 0.200.10 | 0.250.10 |
| 0603 | 1.600.10 | 0.800.10 | 0.450.10 | 0.300.20 | 0.300.20 |
| 0805 | 2.000.15 | 1.250.15 | 0.550.10 | 0.400.20 | 0.400.20 |
| 1206 | 3.100.15 | 1.550.15 | 0.550.10 | 0.450.20 | 0.450.20 |
| 1210 | 3.100.10 | 2.600.20 | 0.550.10 | 0.500.25 | 0.500.20 |
| 1812 | 4.500.20 | 3.200.20 | 0.550.20 | 0.500.20 | 0.500.20 |
| 2010 | 5.000.10 | 2.500.20 | 0.550.10 | 0.600.25 | 0.500.20 |
| 2512 | 6.350.10 | 3.200.20 | 0.550.10 | 0.600.25 | 0.500.20 |
| Operating Temperature Range | TCR (PPM/) |
|---|---|
| 0105 size: -55 to +125 | GR0105: 1R10: -200~+600; 10R100: 300; 100: 200 |
| 0201~2512 size: -55 to +155 | GR0201: 1R10: -100~+350; 10: 200 |
| GR0402~2512: 1R10: 200; 10 R10M: 100; 10MR22M: 200; 22MR100M: 300 |
| Item | Test Method | Acceptable Criterion |
|---|---|---|
| Insulation Resistance | Parallel clamp method: 10015VDC applied between electrode and substrate for 60 seconds. | 109 |
| Dielectric Withstanding Voltage | AC applied between electrode and substrate at max. overload voltage for 60 5 seconds. | No current or arc breakdown 10uA |
| Short Time Over Load | 2.5 times rated voltage or max. overload voltage (whichever is smallest) for 5 seconds. | 1% series: R/R=(1.0%+0.05); 5% series: R/R=(2.0%+0.05); 0105: R/R=(2.0%+0.05) |
| Intermittent Overload | Thermostat, 2.5 times rated voltage, 1 sec ON, 25 sec OFF, 10000 cycles. | R/R=(5.0%+0.05); Jumper: < 50m |
| Resistance to Solvent | Immerse in isopropanol at room temp (235) for 5min, wipe 10 times with toothbrush, repeat 3 times. | No obvious damage, peeling, swelling |
| Solderability | Pretreatment: dry heat 155, 4H. Test Method B1: Dip in tin furnace at 2455 for 5 seconds. Method D: 2605, T=30+5/-0s. | Solder coverage over 95%; No more than 5% exposed substrate, non-wetted plating or ceramic |
| Resistance to Soldering Heat | Reflow test: time above 217 C is 60s-150s, time above 250 5C is 305s. | R/R=(1.0%+0.05); Jumper: < 50m |
| Thermal Shock | Upper/lower limits of application temp, 30min residence, conversion time < 30s, 500 cycles. | R/R=(1.0%+0.05); Jumper: < 50m |
| Solder Joint Endurance Test | SMD resistance welded to test board, bent with standard pressure block for 60 sec. | R/R=(1.0%+0.05); Jumper: < 50m |
| Resistance to Dry Heat | Oven at 1555 for 1000 hrs. | 1% series: R/R=(1.0%+0.05); 5% series: R/R=(3.0%+0.05); 0105: R/R=(3.0%+0.05); Jumper: < 50m |
| Loading Life in Moisture | Constant temp/humidity box (402, 90~96%RH), applied voltage for 1000 hrs. | 1% series: R/R=(1.0%+0.05); 5% series: R/R=(3.0%+0.05); 0105: R/R=(3.0%+0.05); Jumper: < 100m |
| Load Life | Oven at 702, rated voltage, 90 min ON, 30 min OFF, 1000 hrs. | 1% series: R/R=(1.0%+0.05); 5% series: R/R=(3.0%+0.05); 0105: R/R=(3.0%+0.05); Jumper: < 100m |
| Low temperature load test | -55, unpowered 1 hr.; Rated voltage/current for 45 minutes, then unpowered within 15 minutes, return to room temp, stand for 24 hours. | 1% series: R/R=(1.0%+0.05); 5% series: R/R=(2.0%+0.05); 0105: R/R=(2.0%+0.05); Jumper: < 50m |
| Shear force test | SMD resistance welded to PCB, apply test stress from side for 10s. | No visible damage |
| Type | A (mm) | B (mm) | C (mm) |
|---|---|---|---|
| 0105 | 0.2 | 0.5 | 0.2 |
| 0201 | 0.3 | 1.0 | 0.4 |
| 0402 | 0.5 | 1.5 | 0.6 |
| 0603 | 0.8 | 2.1 | 0.9 |
| 0805 | 1.2 | 3.0 | 1.3 |
| 1206 | 2.2 | 4.2 | 1.6 |
| 1210 | 2.2 | 4.2 | 2.8 |
| 1812 | 3.1 | 5.9 | 3.0 |
| 2010 | 3.5 | 6.1 | 2.8 |
| 2512 | 3.8 | 8.0 | 3.5 |
| Storage Condition Temperature | Storage Condition Humidity | Storage Life (0105/0201) | Storage Life (0402) |
|---|---|---|---|
| 255 | 6015%RH | 1 year | 2 years |
| Type or Size | A0.2 (mm) | B0.2 (mm) | C0.05 (mm) | D0 +0.1 (mm) | E0.1 (mm) | F0.05 (mm) | G0.1 (mm) | W0.2 (mm) | T0.1 (mm) | |
|---|---|---|---|---|---|---|---|---|---|---|
| Carrier Taping A 0105 | 0.24 | 0.45 | 2.0 | 1.5 | 1.75 | 3.5 | 4.0 | 8.0 | 0.40 | |
| Carrier Taping A 0201 | 0.40 | 0.70 | 2.0 | 1.5 | 1.75 | 3.5 | 4.0 | 8.0 | 0.47 | |
| Carrier Taping A 0402 | 0.67 | 1.17 | 2.0 | 1.5 | 1.75 | 3.5 | 4.0 | 8.0 | 0.47 | |
| Carrier Taping B 0603 | 1.10 | 1.90 | 2.0 | 1.5 | 1.75 | 3.5 | 4.0 | 8.0 | 0.67 | |
| Carrier Taping B 0805 | 1.65 | 2.40 | 2.0 | 1.5 | 1.75 | 3.5 | 4.0 | 8.0 | 0.81 | |
| Carrier Taping B 1206 | 1.90 | 3.45 | 2.0 | 1.5 | 1.75 | 3.5 | 4.0 | 8.0 | 0.81 | |
| Carrier Taping B 1210 | 2.85 | 3.50 | 2.0 | 1.5 | 1.75 | 3.5 | 4.0 | 8.0 | 0.81 | |
| Embossed Taping 2010 | 2.90 | 5.60 | 2.00 | 1.50 | 1.50 | 1.75 | 5.50 | 4.00 | 12.00 | 1.00 |
| Embossed Taping 1812 | 3.50 | 4.80 | 2.00 | 1.50 | 1.50 | 1.75 | 5.50 | 4.00 | 12.00 | 1.00 |
| Embossed Taping 2512 | 3.50 | 6.70 | 2.00 | 1.50 | 1.50 | 1.75 | 5.50 | 4.00 | 12.00 | 1.00 |
| Type | SPQ | PCS/Rl. | A0.5 (mm) | B0.5 (mm) | C0.5 (mm) | D1 (mm) | M2 (mm) | W1 (mm) |
|---|---|---|---|---|---|---|---|---|
| 0105 | 20,000 | 20,000 | 2.0 | 13.0 | 21.0 | 60.0 | 178.0 | 10.0 |
| 0201 | 15,000 | 15,000 | 2.0 | 13.0 | 21.0 | 60.0 | 178.0 | 10.0 |
| 0402 | 10,000 | 10,000 | 2.0 | 13.0 | 21.0 | 60.0 | 178.0 | 10.0 |
| 0603 | 5,000 | 5,000 | 2.0 | 13.0 | 21.0 | 60.0 | 178.0 | 10.0 |
| 0805 | 5,000 | 5,000 | 2.0 | 13.0 | 21.0 | 60.0 | 178.0 | 10.0 |
| 1206 | 5,000 | 5,000 | 2.0 | 13.0 | 21.0 | 60.0 | 178.0 | 10.0 |
| 1210 | 5,000 | 5,000 | 2.0 | 13.0 | 21.0 | 60.0 | 178.0 | 10.0 |
| 1812 | 4,000 | 4,000 | 2.0 | 13.0 | 21.0 | 60.0 | 178.0 | 13.8 |
| 2010 | 4,000 | 4,000 | 2.0 | 13.0 | 21.0 | 60.0 | 178.0 | 13.8 |
| 2512 | 4,000 | 4,000 | 2.0 | 13.0 | 21.0 | 60.0 | 178.0 | 13.8 |
| Size of chip resistors | Adhesive force limit |
|---|---|
| 0105, 0201 | 6~30gf |
| 0402 | 10~40gf |
| 0603 and above | 10~70gf |
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina