Quartz Crystal Unit HELE X2C016000B81H-R Featuring 16 MHz Frequency and High Environmental Endurance

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Product Description

Product Overview

The HARMONY ELECTRONICS CORP. HSX211S is a quartz crystal unit designed for electronic applications. It operates at a nominal frequency of 16.000 MHz and offers precise frequency tolerance. This component is suitable for a range of operating temperatures and is built with a robust construction for mechanical and environmental endurance.

Product Attributes

Brand: HARMONY ELECTRONICS CORP.
Model: HSX211S
Country of Origin: TAIWAN / CHINA / THAILAND
Moisture Sensitivity Level: Level 1
Certifications: ROHS Compliant, Green Product

Technical Specifications

Specification	Details
Nominal Frequency	16.000000 MHz
Holder Type	HSX211S
Frequency Tolerance	+/-10 ppm at 25deg.C +/-3deg.C
Equivalent Resistance	200 ohms Max. / SERIES
Storage Temperature Range	-40 deg.C To +85 deg.C
Operable Temperature Range	-20 deg.C To +75 deg.C
Temperature Drift	+/-10 ppm (-20 deg.C To +75 deg.C)
Loading Capacitance (CL)	8.0 pF
Drive Level	10 W (100uW Max)
Shunt Capacitance	2.0 pF Max
Insulation Resistance	More than 500M ohms at DC 100V
Mode of Oscillation	Fundamental
Aging	Less than +/- 3 ppm/Year
Holder Type	HSX211S Seam type
Standard Packing Quantity	3,000 PCS / REEL
Tape Material	Carrier tape: PS, Conductive Top tape: Polyester
Cover Tape Release Strength	0.1N to 0.7N (Pulling direction 165 to 180, Speed 300mm/min)
Mechanical Drop Test	Dropping from 120 cm height 3 times on Concrete floor
Vibration Test	Frequency 10-55Hz, Sine Wave full amplitude of 0.8mm to X, Y and Z 3 axes, Duration of 120min. to each direction.
Sealing Tightness	Leak Rate 1.0x10-8 Pa-m3/sec. Max. (Helium leak detector)
Solderability Test	Dipping in solder bath at 245deg.C+/-5deg.C for 3+/-0.5 sec.
Substrate Bending Test	3 mm deflection for 5 1 sec.
Adhesion Test	5N for 10+/-1 sec.
Body Strength Test	10N for 10+/-1sec.
Humidity Test	60+/-2, RH 90~95%, Duration of 240 hours.
Low Temperature Storage Test	-40deg.C +/-2deg.C, Duration of 240 hours.
High Temperature Storage Test	+85deg.C +/-2deg.C, Duration of 240 hours.
Temperature Cycles Test	-40deg.C +/-2deg.C (30min) +85deg.C +/-2deg.C (30min), 25 cycles.
Reflow Soldering Condition (Preheat)	160~180 deg.C, 120sec.
Reflow Soldering Condition (Primary Heat)	220 deg.C, 60sec.
Reflow Soldering Condition (Peak)	260 deg.C, 10sec. Max.
Solder Iron Condition	Bit temp.:350 max., Time:3sec max.