Electronic Timing Crystal HELE X3S016000B81H-DHU Frequency Control Component for Various Applications

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Product Description

Product Overview

The HSX321S Quartz Crystal from HARMONY ELECTRONICS CORP. is a high-performance frequency control component designed for various product applications. It offers precise frequency stability and reliable operation across a wide temperature range. This crystal unit is suitable for applications requiring accurate timing and oscillation, making it a key component in electronic devices.

Product Attributes

Brand: HARMONY ELECTRONICS CORP.
Model: HSX321S
Country of Origin: TAIWAN
Manufacturing Locations: THAILAND, CHINA
Moisture Sensitivity Level: Level 1

Technical Specifications

Specification	Value	Unit	Notes
Frequency	16.000000	MHz
Holder Type	HSX321S
Frequency Tolerance	+/-10	ppm	at 25C +/-3C
Equivalent Resistance	50	Ohms Max.	SERIES
Storage Temperature Range	-40 to +90	C
Operable Temperature Range	-30 to +90	C
Temperature Drift	+/-20	ppm	-30C to +90C
Loading Capacitance (CL)	8.0	pF
Drive Level	10	W	(200W Max.)
Shunt Capacitance	2.0	pF Max.
Insulation Resistance	> 500	M ohms	at DC 100V
Mode of Oscillation	Fundamental
Shock Test (Frequency Variation)		ppm	Dropping from 120 cm height 3 times on Concrete floor
Shock Test (Resistance Variation)			Dropping from 120 cm height 3 times on Concrete floor
Aging		ppm/Year
Holder	HSX321S		Seam type
Carrier Tape Material	PS Conductive
Top Tape Material	Polyester
Standard Packing Quantity	3,000	PCS / REEL
Storage Condition (Temp.)	+40	C Max.
Storage Condition (RH)	80	% Max.
Cover Tape Release Strength	0.1 to 0.7	N	Pulling direction 165 to 180, Speed 300mm/min
Mechanical Performance - Natural Drop	Frequency		Dropping from 120 cm height 3 times on Concrete floor
Mechanical Performance - Vibration	Frequency 10-55Hz, Sine Wave full amplitude of 0.8mm to X, Y and Z 3 axes, Duration of 2 hours to each axis.
Mechanical Performance - Sealing Tightness	Leak Rate		Measured by Helium leak detector.
Mechanical Performance - Solder Ability	Dipping in solder bath at 245C+/-5C for 3+/-0.5 sec.		After applying ROSIN Flux.
Mechanical Performance - Substrate Bending	Apply Pressure to the center of board until it is bent to 3 mm and hold for 5 1 sec. Pressure speed :0.5 mm / sec
Mechanical Performance - Adhesion	Apply pressure vertically to the side of specimen attached to the circuit board with the pressure jig. Pressure : 5N for 101 sec
Mechanical Performance - Body Strength	Apply pressure to the center of body with the R0.5 pressure jig. pressure :10N for 101sec
Environmental Performance - Humidity	Temperature 60 +/-2 C, RH 90~95%, Duration of 240 hours.
Environmental Performance - Storage in Low Temperature	-40C +/-2C, Duration of 240 hours.
Environmental Performance - Storage in High Temperature	+85C +/-2C, Duration of 240 hours.
Environmental Performance - Temperature Cycles	-40C +/-2C (30min) +85C +/-2C (30min) 25 cycles.
Soldering Reflow Condition	Available for Lead Free Soldering		Proposed reflow condition, soldering 2 times max.
Soldering Iron Condition	Bit temp.: 350 max., Time: 3sec max. , Each terminal solder a 1 time max.