Electronic Oscillator Component HELE X5H012000FC1H-X Quartz Crystal Unit with 12 Megahertz Frequency

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Product Description

Product Overview

The HSX530G is a Quartz Crystal Unit from HARMONY ELECTRONICS CORP., designed for general product applications. This specification sheet details its electrical, mechanical, and environmental characteristics, ensuring reliable performance in various electronic systems. It is manufactured with a ceramic base and cap, utilizing a rectangular AT-cut quartz crystal blank for oscillation.

Product Attributes

Brand: HARMONY ELECTRONICS CORP.
Model: HSX530G
Country of Origin: TAIWAN
Manufacturing Locations: THAILAND FACTORY, CHINA FACTORY
Specification Number: X5H012000FC1H-X
Revision: 0
Date: 2012/10/15
Moisture Sensitivity Level: Level 1

Technical Specifications

Item	Specification	Details
Frequency	12.000000MHz
Holder Type	HSX530G	Ceramic Base
Frequency Tolerance	+/-30ppm	at 25C 3C
Equivalent Resistance	100 ohms Max.	/ SERIES
Storage Temperature Range	-40C To +85C
Operable Temperature Range	-40C To +85C
Temperature Drift	+/-50ppm	-40C To +85C
Loading Capacitance (CL)	12.0pF
Drive Level	10 uW	(300uW Max)
Shunt Capacitance	7.0 pF Max
Insulation Resistance	More than 500M ohms	at DC 100V
Mode of Oscillation	Fundamental
Circuit Measurement		HP/E5100A, S&A 250B
Shocking (Drop Test)	Frequency: Resistance:	Dropping from 50 cm height 3 times on firm wood
Aging	Less than +/-5 ppm/Year
Inside Structure - Base Material	Alumina Ceramic (Al2O3)
Inside Structure - Cap Material	Alumina Ceramic (Al2O3)
Inside Structure - Crystal Blank	Rectangular At-Cut Quartz Crystal Blank
Emboss Carrier Tape & Reel - Standard Packing Quantity	1,000 PCS / REEL
Emboss Carrier Tape & Reel - Storage Condition	Temperature: +40 Max. Relative Humidity: 80% Max.
Emboss Carrier Tape & Reel - Tape Material	Carrier tape: PS Top tape: PET
Emboss Carrier Tape & Reel - Release Strength of Cover Tape	0.1N to 0.7N	Pulling direction 165 to 180, Speed 300mm/min
Mechanical Endurance - Drop	Satisfied	Dropping 3 times from 50 cm onto hard wooden board (>30mm thick)
Mechanical Endurance - Vibration	Satisfied	Frequency: 10~55Hz, Cycle: 1-2 Min, Amplitude: 0.8mm, Direction: X.Y.Z, Time: 2 Hours/Each Direction
Mechanical Endurance - Substrate Bending	Satisfied	Pressure applied to substrate, Speed: 0.5 mm/sec, Duration: 5 1 sec, Amount of substrate: 3 mm Max.
Mechanical Endurance - Adhesion	Satisfied	Weight: 5N, Duration: 10 1 sec
Mechanical Endurance - Body Strength	Satisfied	Weight: 10N, Duration: 10 1 sec
Mechanical Endurance - Seal	Less than 1.0 x 10-8 Pa.m3/sec	By Helium leak detector. No serial bubble by Fluorinate tests.
Mechanical Endurance - Solder Ability	Satisfied	3 sec +/-0.5sec. Dip in 245C+/-5C solder (ROSIN type flux)
Mechanical Endurance - Resistance to Soldering Heat	Available for Lead Free Soldering	Reflow soldering allowed twice. Preheat 160~180C (120sec), Primary heat 220C (60sec), Peak 260C (10sec Max).
Environmental Endurance - Humidity	Satisfied	+60C+/-2C, 90% ~ 95% RH for 240 hours
Environmental Endurance - Storage in Low Temperature	Satisfied	-40C+/-2C for 240 hours
Environmental Endurance - Storage in High Temperature	Satisfied	+85C+/-2C for 240 hours
Environmental Endurance - Thermal Shock	Satisfied	25 cycles of temperature cycling (-40C to +85C), Temp. change within 3 minutes.