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Quartz Crystal HELE X3S027000BA1H-X with 27 MHz Frequency Pb Free RoHS Compliant and REACH Certified

Price Negotiable
Price: Negotiable
MOQ: Negotiable
Delivery Time: Negotiable
Product Description

Product Overview

The Harmony Electronics Corporation HSX321S is a high-quality Quartz Crystal designed for reliable electronic applications. This product is Pb-free, RoHS Compliant, HF-Halogen free, and REACH Compliant, ensuring adherence to environmental and safety standards. It is manufactured in Taiwan and is suitable for various automated SMT processes. The crystal offers a nominal frequency of 27.000000MHz and is built to withstand demanding operational conditions.

Product Attributes

  • Brand: Harmony Electronics Corporation
  • Product Type: Quartz Crystal
  • Model: HSX321S
  • Country of Origin: Taiwan
  • Certifications: Pb free, RoHS Compliant, HF-Halogen free, REACH Compliant
  • MSL Level: 1

Technical Specifications

Item Electrical Spec. Unit Notes Min Type Max
Frequency (FL) MHz 27.000000
Mode of oscillation Fundamental
Frequency tolerance ppm at 253 -10 +10
Equivalent resistance (RR) SERIES 60
Storage temperature range -40 +90
Operable temperature range -30 +90
Temperature stability ppm -30 ~ +90 -50 +50
Loading capacitance (CL) pF 10.0
Drive level (DL) W 10 100
Shunt Capacitance (C0) pF 2.0
Insulation resistance M at DC 100V 500
Aging ppm/Year -3 +3
Circuit Measured in HP/E5100A,S&A 250B
Dimensions (L x W) mm 3.2 x 2.5
Dimensions (Height) mm 0.7
Package Quantity PCS / REEL Standard Packing Quantity 3,000
Mechanical Performance Specifications Code
Shock Dropping from 120 cm height 3 times on 30 mm Concrete floor. A
Vibration Frequency 10-55Hz, Sine Wave full amplitude of 0.8mm to X, Y and Z 3 axes, 2 cycles and duration of 2 hours to each direction. A
Leakage Test Leak Rate 1.0x10-9 Pa-m3/sec. Max. Measured by Helium leak detector. ---
Solder ability After applying ROSIN Flux, dipping in solder bath at 245deg.C 5deg.C for 3 0.5 sec. B
Bending Strength Mount a sample on board. Apply Pressure to the center of board until it is bent to 3 mm and hold for 5 1 sec. Pressure speed: 0.5 mm/sec. A
Adhesion Mount a sample on the circuit board. Apply pressure vertically to the side of specimen attached to the circuit board with the pressure jig. Pressure: 5N for 101 sec. C
Body strength Apply pressure to the center of body with the R0.5 pressure jig. pressure :10N for 101sec C
Environmental Performance Specifications Code
Resistance of Soldering Heat Performing as the following reflow: A
Humidity Temperature 602, RH 90~95%, duration of 240 hours. Back to room temperature first, then check the component after 1~2 hours. A
Storage in Low Temperature -40deg.C 2deg.C, duration of 240 hours. Back to the room temperature first, then check the component after 1~2 hours. A
Storage in High Temperature +85deg.C 2deg.C, duration of 240 hours. Back to the room temperature first, then check the component after 1~2 hours. A
Thermal shock -55deg.C 2deg.C (30min) +125deg.C 2deg.C (30min) 25 cycles. And Temperature Increasing/reducing time3mins. Back to the room temperature first, then check the component after 1~2 hours. A

Specifications Code Details:
A: FREQ. DRIFT: 5 ppm Max, RESISTANCE DRIFT: 15% or 2
B: More than 90% of lead shall be covered by new solder.
C: FREQ. DRIFT: 15 ppm Max, RESISTANCE DRIFT: 25% or 10


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Company Beijing Silk Road Enterprise Management Services Co., Ltd.
Location 16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person Sellina

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