quartz crystal unit HELE X3S030000BK1H featuring 30 megahertz nominal frequency and alumina ceramic base

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Price: Negotiable

MOQ: Negotiable

Delivery Time: Negotiable

Product Description

Product Overview

The HSX321S is a quartz crystal unit manufactured by HARMONY ELECTRONICS CORP. Designed for various product applications, this crystal unit operates at a nominal frequency of 30.000MHz. It features a holder type of HSX321S and is built with a rectangular At-cut quartz crystal blank enclosed in an alumina ceramic base and a Fe-Ni-Co lid. The crystal unit is suitable for applications requiring stable frequency and reliable performance within specified environmental and mechanical conditions.

Product Attributes

Brand: HARMONY ELECTRONICS CORP.
Model: HSX321S
Country of Origin: TAIWAN
Manufacturing Locations: Taiwan Factory, Thailand Factory, Shenzhen Factory
Holder Type: HSX321S
Crystal Blank Type: Rectangular At-Cut Quartz Crystal Blank
Base Material: Alumina Ceramic (Al2O3)
Lid Material: Fe-Ni-Co
Marking Method: Laser Marking

Technical Specifications

Specification	Details
Nominal Frequency	30.000000MHz
Frequency Tolerance	+/-10 ppm at 25C +/-3C
Equivalent Resistance	50 ohms Max. / SERIES
Storage Temperature Range	-40C To +85C
Operable Temperature Range	-10C To +60C
Temperature Drift	+/-30 ppm (-10C To +60C)
Loading Capacitance (CL)	20.0 pF +/- 0.2 pF
Drive Level	10 uW +/- 2 uW (100uW Max)
Shunt Capacitance	2.0 pF Max
Insulation Resistance	More than 500M ohms at DC 100V
Mode of Oscillation	Fundamental
Shocking (Frequency/Resistance Variation)	Frequency: Less than +/-5 ppm; Resistance: Less than +/- 15 % or 2ohms max. (Dropping from 50 cm height 3 times on firm wood)
Aging	Less than +/- 5 ppm/Year
Sealing Tightness (Leak Rate)	1.0x10 Pam/sec. Max. (Fine Leakage)
Solderability	More than 90% of lead shall be covered by new solder. (Dipped in solder bath at 245C+/-5C for 3+/-0.5 sec. after applying ROSIN Flux)
Standard Packing Quantity	3,000 PCS / REEL
Carrier Tape Material	PS Conductive
Top Tape Material	Polyester
Cover Tape Release Strength	0.1N to 0.7N (Pulling direction 165 to 180, Speed 300mm/min)
Reflow Condition (Max Soldering Times)	2 times max. (Preheat 160~180C 120sec; Primary heat 220C 60sec; Peak 260C 10sec Max.)
Solder Iron Condition	Bit temp.: 350C max., Time: 3sec max., Each terminal solder 1 time max.