Electronic Component HELE X2B026000B81H-CHZ Quartz Crystal Unit with 26 Megahertz Frequency Stability

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Price: Negotiable

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Product Description

Product Overview

The HSX221SA is a quartz crystal unit designed for various electronic applications. It offers a stable frequency of 26.000MHz with a tight frequency tolerance of +/-10 ppm at 25C. This crystal unit features a holder type of HSX221SA and is manufactured by Harmony Electronics Corp. It is suitable for applications requiring reliable oscillation and is built to withstand mechanical and environmental stresses.

Product Attributes

Brand: HARMONY ELECTRONICS CORP.
Model: HSX221SA
Type: Quartz Crystal Unit
Country of Origin: TAIWAN
Manufacturing Facilities: TAIWAN, THAILAND, CHINA
Moisture Sensitivity Level: Level 1
Environmental Compliance: ROHS Compliant, Green Product

Technical Specifications

Specification	Value	Notes
Frequency	26.000000MHz	Nominal Frequency
Holder Type	HSX221SA	Seam type
Frequency Tolerance	+/-10 ppm	at 25C +/-3C
Equivalent Resistance	40 Ohms Max.	SERIES
Storage Temperature Range	-40C to +85C
Operable Temperature Range	-30C to +85C
Temperature Drift	+/-11ppm	-30C to +85C
Loading Capacitance (CL)	8.0 pF
Drive Level	10 W	100 W Max.
Shunt Capacitance	0.8~1.2 pF
Insulation Resistance	> 500 M Ohms	at DC 100V
Mode of Oscillation	Fundamental
Shock Test (Drop)	Frequency variation	Dropping from 120 cm height 3 times on Concrete floor
Aging
Dimensions	Refer to Page 4
Carrier Tape & Reel	Refer to Page 6 & 7
Packing Quantity	3,000 PCS / REEL
Carrier Tape Material	PS Conductive
Top Tape Material	Polyester
Cover Tape Release Strength	0.1N to 0.7N	Pulling direction 165 to 180, Speed 300mm/min
Mechanical Drop Test	Frequency variation	120 cm height, 3 times on Concrete floor
Vibration Test	Frequency 10-55Hz, Sine Wave, full amplitude 0.8mm to X, Y and Z 3 axes, 2 hours each axis.
Sealing Tightness	Leak Rate 1.0x10-8 Pa-m/sec. Max.	Measured by Helium leak detector.
Solderability	More than 90% of lead covered by new solder.	Dipped in solder bath at 245C+/-5C for 3+/-0.5 sec.
Humidity Test	Frequency variation within +/-5ppm, Equivalent resistance within +/-15% or 2	60C +/-2C, RH 90~95%, Duration of 240 hours.
Low Temperature Storage	Component checked after returning to room temp.	-40C +/-2C, Duration of 240 hours.
High Temperature Storage	Component checked after returning to room temp.	+85C +/-2C, Duration of 240 hours.
Temperature Cycles	Component checked after returning to room temp.	-40C (30min) +85C (30min), 25 cycles.
Soldering (Reflow)	Max. 2 times soldering.	Proposed reflow condition: Preheat 160~180C (120sec), Primary heat 220C (60sec), Peak 260C (10sec Max.).
Soldering (Iron)	Bit temp.: 350max., Time: 3sec max.	Each terminal solder 1 time max.
Mounting	Designed for automatic insertion. Avoid Ultrasonic welding.
Cleaning	Avoid cleaning liquids that corrode Nickel. Ultrasonic cleaning possible, check on your board.
Storage Conditions	Keep away from high temperature and high humidity, direct sunlight, and dew.