Quartz Crystal Frequency Control HELE X2B032000BC1H-HZ 32 MHz Pb Free RoHS Compliant for Electronics

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Product Description

Product Overview

The Harmony Electronics HSX221SA is a Quartz Crystal designed for reliable frequency control. It operates at a nominal frequency of 32.000000MHz and is suitable for a wide range of electronic applications. This product is Pb-free, RoHS Compliant, HF-Halogen free, and REACH Compliant, emphasizing its commitment to environmental standards. It is manufactured in Taiwan.

Product Attributes

Brand: Harmony Electronics Corporation
Product Type: Quartz Crystal
Model: HSX221SA
Country of Origin: Taiwan
Certifications: Pb free, RoHS Compliant, HF-Halogen free, REACH Compliant
MSL Level: 1

Technical Specifications

Item	Electrical Spec.	Unit	Notes	Min	Type	Max
Frequency (FL)	Frequency	MHz			32.000000
Mode of oscillation	Mode of oscillation		Fundamental
Frequency tolerance	Frequency tolerance	ppm	at 253	-10		+10
Equivalent resistance (RR)	Equivalent resistance		SERIES		50
Storage temperature range	Storage temperature range			-40		+125
Operable temperature range	Operable temperature range			-30		+85
Temperature stability	Temperature stability	ppm	-30 ~ +85	-12		+12
Loading capacitance (CL)	Loading capacitance	pF			12.0
Drive level (DL)	Drive level	W			10	100
Shunt Capacitance (C0)	Shunt Capacitance	pF			2.0
Insulation resistance	Insulation resistance	M	at DC 100V	500
Aging	Aging	ppm/Year		-3		+3
Circuit Measured			in HP/E5100A,S&A 250B
Dimensions (L x W)		mm			2.0 x 2.5
Dimensions (Height)		mm	Max		1.15
Dimensions (Lead Pitch)		mm			0.7
Pin Connections			Pin 1,2 Crystal; Pin 3,4 GND/Lid
Carrier Tape Width		mm			8.0
Carrier Tape Pitch		mm			4.0
Reel Quantity		pcs	Standard Packing		3000
Shock Test	Shock		Dropping from 120 cm height 3 times on 30 mm Concrete floor.		A
Vibration Test	Vibration		Frequency 10-55Hz, Sine Wave full amplitude of 0.8mm to X, Y and Z 3 axes, 2 cycles and duration of 2 hours to each direction.		A
Leakage Test	Leak Rate	Pa-m3/sec. Max.	Measured by Helium leak detector.		1.0x10-9
Solder ability Test			After applying ROSIN Flux, dipping in solder bath at 245deg.C 5deg.C for 3 0.5 sec.		B
Bending Strength Test			Mount a sample on board. Apply Pressure to the center of board until it is bent to 3 mm and hold for 5 1 sec. Pressure speed: 0.5 mm/sec.		A
Adhesion Test			Apply pressure vertically to the side of specimen attached to the circuit board with the pressure jig. Pressure: 5N for 101 sec.		C
Body Strength Test			Apply pressure to the center of body with the R0.5 pressure jig. pressure :10N for 101sec		C
Resistance of Soldering Heat Test			Performing as the following reflow.		A
Humidity Test			Temperature 602, RH 90~95%, duration of 240 hours. Back to room temperature first, then check the component after 1~2 hours.		A
Storage in Low Temperature Test			-40deg.C 2deg.C, duration of 240 hours. Back to the room temperature first, then check the component after 1~2 hours.		A
Storage in High Temperature Test			+85deg.C 2deg.C, duration of 240 hours. Back to the room temperature first, then check the component after 1~2 hours.		A
Thermal shock Test			-55deg.C 2deg.C (30min) +125deg.C 2deg.C (30min) 25 cycles. And Temperature Increasing/reducing time3mins. Back to the room temperature first, then check the component after 1~2 hours.		A
Specifications Code A	FREQ. DRIFT	ppm Max			5
Specifications Code A	RESISTANCE DRIFT				15 or 2
Specifications Code B		%	More than 90% of lead shall be covered by new solder.
Specifications Code C	FREQ. DRIFT	ppm Max			15
Specifications Code C	RESISTANCE DRIFT				25 or 10