Accurate frequency oscillator HELE S2H019200IECHE-T engineered for performance in electronic devices

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Product Description

Product Overview

The HSO221S is a high-quality oscillator manufactured by HARMONY ELECTRONICS CORP. Designed for broad applications, this component offers precise frequency output and stable performance across various environmental conditions. It is suitable for integration into electronic devices requiring a reliable and accurate clock source, with a focus on industrial and commercial applications.

Product Attributes

Brand: HARMONY ELECTRONICS CORP.
Model: HSO221S
Country of Origin: TAIWAN
Moisture Sensitivity Level: Level 1

Technical Specifications

Item	Symbol	Value	Unit	Condition	Min	Typ	Max	Etc
1. Type Name
Type Name		HSO221S
2. Output Frequency
Output Frequency		19.200000	MHz
3. Absolute Maximum Ratings
Vdd terminal voltage	Vdd	-0.5 ~ 4.0	V
Input terminal voltage	Vcont	-0.5 ~ Vdd+0.5	V
Output terminal voltage	Vout	-0.5 ~ Vdd+0.5	V
Output terminal current	Iout		mA			15
Storage temp. range	Tstr	-55 ~ 125	deg.C
4. Electric Specifications
Frequency Stability	f/F		ppm	1.8+/- 0.09V, -40~85	-50		+30
Operating temp. range	Topr				-40	25	+85
Supply voltage	Vdd		V		1.71	1.8	1.89
Current consumption 1 (#1 pin: open or "H")	Idd1		mA	Fig1,2, 1.8V, 25+/-3			7
Current consumption 2 (#1 pin: "L" level)	Idd2		mA	Fig1,2, 1.8V, 25+/-3		0.01
Symmetry Duty			%		40	50	60
Low level output voltage	Vol		V				0.1xVdd
High level output voltage	Voh		V		0.9xVdd
Rise & Fall time	Tr & Tf		ns	CL=15 pF			10
Pin #1 options		YES
Output load	CL-MOS	15	pF	(Idd1, Idd2 test at No Load)
Low level input current	Iil		uA	Fig3, 1.8V, 25+/-3			10
High Level input current	Iih		uA	Fig3, 1.8V, 25+/-3			10
Low level input voltage	Vil		V				Vddx0.3
High level input voltage	Vih		V		Vddx0.7
Output disable time	Tplz		ns				150
Output enable time	Tpzl		ms				10
Smart Up Time			ms				10
Aging			ppm/year		-3		3
5. Dimensions
Dimensions		2.0 x 1.15 x 0.7 (approx.)	mm					(Refer to drawing)
6. Inside Structure
Base Material		Alumina Ceramic (Al2O3)
IC		IC(Si. Al.)
Bonding Wire		Au
Crystal Blank		Rectangular At-Cut Quartz Crystal Blank
LID		Fe+Ni+Co
Adhesive		Silver Conductive Silicon Resin
7. Mechanical Performance
Natural Drop		Drop 3 times from 50cm onto hard wooden board		JIS C 60068-2-6 A
Vibration		10-55Hz, 0.8mm amplitude, 2 hours per axis (X, Y, Z)		MIL-HDBK-781A 6.5.2 / JIS C 60068-2-6 A
Sealing Tightness (Leak Rate)		1.0x10-8 Pa-m3/sec. Max. (Helium leak detector)		Fine Leakage
Sealing Tightness (Dipping Test)		No gas bubble observed after dipping in FC-40 at +125 deg.C for 5 minutes
Solder ability		Dipping in solder bath at 245deg.C+/-5deg.C for 3+/-0.5 sec. after applying ROSIN Flux		JIS C 60068-2-20 B
8. Environment Performance
Humidity		60+/-2, RH 90~95% for 240 hours		JIS C 60068-2-3 A
Storage in Low Temperature		-40deg.C +/-2deg.C for 240 hours		JIS C 60068-2-1 A
Storage in High Temperature		+85deg.C +/-2deg.C for 240 hours		JIS C 60068-2-2 A
Temperature cycles		-30deg.C (30min) +80deg.C (30min), 25 cycles		JIS C 0025 A
High Temperature Operation		+85deg.C +/-2deg.C, +1.8V Vdd for 240 hours		JIS C 60068-2-2 A
Performance after Environmental Tests		Frequency variation within +/-5ppm, Equivalent resistance within specification						A
Solderability after Environmental Tests		More than 90% of lead covered by new solder						B
9. Supplement
Soldering Cycles		Max. 2 times, follow proposed reflow condition						9.1
Solder Iron Temperature		Max. 350deg.C, Max. 3 sec. per terminal, Max. 1 time per terminal						9.3
Mounting Caution		Avoid Ultrasonic welding due to risk of internal damage						9.4
Cleaning Liquid Restriction		Do not use cleaning liquids that corrode Nickel						9.5
Handling Static Electricity		Handle with care as other C-MOS devices						9.6
By-pass Capacitor Recommendation		Recommend 0.01F ceramic chip capacitor between Vdd and GND						9.7
Storage Conditions		Keep away from high temperature, high humidity, direct sunlight, and dew						9.8
10. Taping and Packing
Quantity on Reel		3,000 PCS/REEL						10.4
Storage Conditions (Taping/Packing)		Temperature +40deg.C Max., Humidity 80% Max.						10.3