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Seam Type Quartz Crystal HSX321S 40 MHz Frequency Tolerance 10 ppm HELE X3S040000BF1H-Z Product Details

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Price: Negotiable
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Product Description

HSX321S Quartz Crystal Specification

The HSX321S is a quartz crystal unit manufactured by Harmony Electronics Corp., designed for various product applications. This specification document outlines the technical details, performance characteristics, and handling guidelines for the HSX321S model.

Product Attributes

  • Brand: HARMONY ELECTRONICS CORP.
  • Model: HSX321S
  • Country of Origin: TAIWAN
  • Manufacturing Factories: THAILAND, SHENZHEN
  • Specification Number: X3S040000BF1H-Z Rev. 0
  • Date Issued: 2011/12/08

Technical Specifications

Item Specification Details
Frequency 40.000000MHz
Holder Type HSX321S Seam type
Frequency Tolerance +/-10 ppm at 25C +/-3C
Equivalent Resistance 20 ohms Max. /SERIES
Storage Temperature Range -40C To +85C
Operable Temperature Range -30C To +85C
Temperature Drift +/-10ppm -30C To +85C
Loading Capacitance (CL) 15.0 pF
Drive Level 10 uW (100uW Max)
Shunt Capacitance 2.0 pF Max
Insulation Resistance More than 500M ohms at DC 100V
Mode of Oscillation Fundamental
Circuit Measurement Measured in HP/E5100A, S&A 250B
Shocking Frequency: less than +/-5 ppm
Resistance: less than +/- 15 % or 2ohms max.
Dropping from 50 cm height 3 times on firm wood
Aging Less than +/-5 ppm/Year
Inside Structure - Base Alumina Ceramic (Al2O3) Metallized Pad: W Ni Plating Au Plating (Supplier: Kyocera NTK)
Inside Structure - Lid Fe-Ni-Co
Inside Structure - Crystal Enclosure Seal Seal Seam
Inside Structure - Crystal Blank Rectangular At-Cut Quartz Crystal Blank
Inside Structure - Adhesive Silver Conductive Silicon Resin Adhesive bonding: upper & lower bonding/lower bonding only
Inside Structure - PAD Alumina Ceramic (W. Ni. Au)
Inside Structure - Cover Ring Fe-Ni-Co Alloy
Carrier Tape Dimensions (Refer to page 6)
Reel Dimensions Diameter: 180+/-3 mm
Inner Width: 9.3+/-0.3 mm
Outer Width: 11.3+/-1.0 mm
Out Line Diameter: 60.5+/-0.5 mm
Flange F1: 3.0+0.5/-0
Flange F2: 4.0+0.5/-0
Width F3: 5.0+0.5/-0
Center Core slit Position q: 120deg
Spindle Diameter C: 13.2+/-0.5 mm
HUB Key Ditch Width E: 3.0+/-0.2 mm
(UNIT: mm)
Storage Condition Temperature: +40C Max.
Relative Humidity: 80% Max.
Standard Packing Quantity 3,000 PCS / REEL
Material of Tape Carrier tape: PS
Top tape: Polyester
Label Contents Sticks label for every reel.
Taping Dimension - Leader Cover-tape length in leader > 400 mm (including empty embossed area)
Taping Dimension - Terminal > 40 mm empty embossed area sealed by cover-tape
Joint of Tape Carrier-tape and top cover-tape should not be jointed.
Release Strength of Cover Tape 0.1N to 0.7N Pulling direction 165 to 180, Speed 300mm/min. (Other standards based on JIS C 0806-1990)
Mechanical Performance - Natural Drop Frequency variation +/-5ppm, Equivalent resistance specification Drop 3 times from 50cm onto min. 30mm thickness hard wooden board.
Mechanical Performance - Vibration Frequency variation +/-5ppm, Equivalent resistance specification 10-55Hz, Sine Wave, full amplitude of 0.8mm to X, Y and Z 3 axes, Duration of 2 hours to each axis.
Mechanical Performance - Sealing Tightness Leak Rate 1.0x10-8 Pa-m/sec. Max. Measured by Helium leak detector (Fine Leakage).
Mechanical Performance - Solderability More than 90% of lead shall be covered by new solder. Apply ROSIN Flux, dip in solder bath at 245C+/-5C for 3+/-0.5 sec.
Environmental Performance - Humidity Frequency variation +/-5ppm, Equivalent resistance specification 60C +/-2C, RH 90~95%, Duration of 240 hours. Check after returning to room temperature (1-2 hours).
Environmental Performance - Storage in Low Temperature Frequency variation +/-5ppm, Equivalent resistance specification -40C +/-2C, Duration of 240 hours. Check after returning to room temperature (1-2 hours).
Environmental Performance - Storage in High Temperature Frequency variation +/-5ppm, Equivalent resistance specification +85C +/-2C, Duration of 240 hours. Check after returning to room temperature (1-2 hours).
Environmental Performance - Temperature Cycles Frequency variation +/-5ppm, Equivalent resistance specification -40C +/-2C (30min) +85C +/-2C (30min), 25 cycles. Check after returning to room temperature (1-2 hours).
Soldering - Reflow Condition Max. 2 times soldering Proposed reflow condition (Refer to page 11)
Soldering - Solder Iron Bit temp.: 350C max., Time: 3 sec max. Each terminal solder 1 time max.
Mounting Designed for automatic insertion Trial with insertion machine recommended. Pay attention to board warp.
Cleaning Avoid cleaning liquids that corrode Nickel. Ultra-sonic cleaning possible, check on your board.
Storage Keep away from high temperature and high humidity. No direct sunlight, no dew.
Environmental Workload Chemical Substance Components List (See page 14 for detailed list and percentages)

Note: Marking specification includes Logo, Nominal Frequency (integer only), and Manufactured Year & Month. Refer to Table-1 and Table-2 for coding.


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