Beijing Silk Road Enterprise Management Services Co., Ltd.
                                                                                                           
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CGA0603X5R226M6R3JT multilayer chip ceramic capacitor 22 microfarad 6.3 volt rated voltage X5R dielectric material

Price Negotiable
Price: Negotiable
MOQ: Negotiable
Delivery Time: Negotiable
Product Description

Product Overview

The CGA0603X5R226M6R3JT is a multilayer chip ceramic capacitor designed for various electronic applications. It offers reliable performance and adheres to strict quality standards, making it suitable for demanding environments.

Product Attributes

  • Brand: CGA
  • Material: X5R
  • Origin: Not specified
  • Color: Not specified
  • Certifications: Not specified

Technical Specifications

Part NumberCapacitanceCapacitance ToleranceRated VoltageTemperature CharacteristicTemperature RangeThicknessDimensions (mm)Packaging
CGA0603X5R226M6R3JT22 uF±15%6.3 VdcX5R-55 to +850.20-0.65Length: 1.60±0.20, Width: 0.80±0.20, Thickness: 0.80±0.20Tape Reel (180mm), 4,000 pcs
Test ItemSpecificationTest Method (Reference Standard: JIS C 5101, IEC60384)
CapacitanceWithin specified tolerance.Test Voltage: 0.5-5.0Vrms (Frequency dependent on capacitance value)
Insulation Resistance (I.R.) 10 G or RC 500·F (whichever is smaller)Test Voltage: Varies based on Rated Voltage (RV)
Voltage ProofWithstand test voltage without defects or abnormalities.Test Voltage: 150% to 300% of RV (depending on RV value)
Quality Factor / Dissipation Factor (D.F.)Varies based on material and frequencyFrequency: 1.0±0.1MHz or 1.0±0.1KHz
AppearanceNo defects or abnormalities. Visual (microscope) inspection.-
DimensionConforms to specifications. Micrometer inspection.-
Temperature Characteristics of CapacitanceΔC/C Temperature Range: -55 to +85
Substrate Bending TestNo terminal detachment, ceramic breakage.Apply force to the center of the specimen.
Adhesive Strength of TerminationNo terminal detachment, ceramic breakage.Solder capacitor on PCB, bend 1mm.
Solderability 95% of terminals should be uniformly and continuously soldered.Solder bath method: Sn-3.0Ag-0.5Cu (Lead Free Solder)
Resistance to Soldering HeatNo cracks.Solder bath method: Sn-3.0Ag-0.5Cu (Lead Free Solder)
Temperature CycleCapacitance change within specified limits. Appearance: No defects or abnormalities.5 cycles of temperature changes from -55 to +125.
Durability (Life Test)Capacitance, Insulation Resistance, Q/DF within specified limits. Appearance: No defects or abnormalities.Test Voltage: 100% RV, Test Time: 1000±12 hours at Max operating temperature.
High Temperature High HumidityCapacitance, Insulation Resistance, Q/DF within specified limits. Appearance: No defects or abnormalities.Test Temperature: 40±2, Test Humidity: 90%RH to 95%RH, Test Time: 500±24 hours.
Size (mm)Carrier Tape WidthPackaging QuantityPackaging Material
01005 (0402)2mm20,000Paper Tape
02012mm15,000Paper Tape
0402 (1005)2mm10,000Paper Tape
0603 (1608)8mm4,000Paper Tape
0805 (2012)8mm4,000Paper Tape/Plastic Tape
1206 (3216)8mm2,000Paper Tape/Plastic Tape
1210 (3225)8mm1,000Plastic Tape

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Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Beijing Silk Road Enterprise Management Services Co., Ltd.
Location 16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person Sellina

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