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CGA0603X5R475K250JT Ceramic Capacitor 4.7F Capacitance X5R Dielectric and 25Vdc Voltage for Circuits

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Product Description

Product Overview

The CGA0603X5R475K250JT is a multilayer ceramic capacitor (MLCC) with an X5R dielectric. It offers a capacitance of 4.7F and a rated voltage of 25Vdc. Designed for surface mounting, this component is suitable for a wide range of electronic applications requiring stable capacitance over a moderate temperature range.

Product Attributes

  • Brand: CGA
  • Material: Ceramic Dielectric, Nickel Inner Electrode, Copper Outer Electrode
  • Temperature Characteristic: X5R

Technical Specifications

Part NumberSize (mm)CapacitanceCapacitance ToleranceRated VoltageTemperature CharacteristicTemperature RangeCapacitance Change RatePackagingPackaging Quantity
CGA0603X5R475K250JT1.600.20 x 0.800.20 x 0.800.204.7F10%25VdcX5R-55~+8515%T (180mm Reel)4,000
Test ItemTest SpecificationTest Method (Reference Standard: JIS C 5101, IEC60384)
AppearanceNo defects or abnormalities.Visual (Microscope) inspection of the product.
DimensionConforms to specifications.Check the physical dimensions of the equipment using a micrometer.
Voltage ProofWithstand test voltage, no defects or abnormalities.Material: X7R/X5R. Rated Voltage (RV) 50V: Test Voltage 250% RV. Test Time: 1 to 5 seconds. Max Charging/Discharging Current: 50mA.
Insulation Resistance (I.R.)100MTest Temperature: 25. Test Points: Between terminals. Test Voltage: 500V: Rated Voltage; >500V: 500V. Charging Time: 1 minute. Max Charging/Discharging Current: 50mA.
CapacitanceWithin specified tolerance.Measurement Temperature: 25. Material: X5R. Capacitance: 4.7F. Frequency: 120Hz24Hz. Voltage: 0.5V0.1Vrms.
Q Factor / Dissipation Factor (D.F.)C > 10F: 5.0%Measurement Temperature: 25. Frequency: 120Hz24Hz. Voltage: 0.5V0.1Vrms.
Temperature Characteristics of CapacitanceX5R: 15%Steps: 1. Reference Temp: 252; 2. Lowest Operating Temp: 3; 3. Reference Temp: 252; 4. Highest Operating Temp: 2; 5. Reference Temp: 252. Measurement should be taken after 5 minutes at each specified temperature stage.
Adhesive Strength of TerminationNo termination peeling, ceramic breakage, etc.Mounting Method: Solder capacitor onto test substrate. Force: 5 N (0402: 2.5 N / 0201: 1 N). Application Direction: Gradually apply thrust in the horizontal direction of the P.C. board at the center of the specimen. Time: 101 seconds.
Substrate Bending TestAppearance: No defects or abnormalities. C/C X7R/X5R: 10%Mounting Method: Reflow solder capacitor on P.C. board, then bend by 1 mm.
Solderability95% of terminals should be uniformly and continuously soldered.Solder: Sn-3.0Ag-0.5Cu (Lead-free solder). Flux: Isopropyl alcohol Rosin 25% solid solution. Soldering Temperature: 2455C. Dwell Time: 20.5s. Soldering Position: Until both ends are completely wetted.
Resistance to Soldering HeatAppearance: No cracks. Capacitance Change: X7R/X5R 7.5%. Q/DF: Same as initial value. Insulation Resistance: Same as initial value. Voltage Proof: No defects or abnormalities.Pre-treatment: Heat treatment at 150+0/-10C for 1 hour, then stand at room temperature for 242 hours. Solder bath method. Solder Type: Sn-3.0Ag-0.5Cu. Test Temperature: 2605C. Test Time: 101s. Preheating Temp: 110 to 140. Preheating Time: 1 minute. Post-treatment: Stand at room temperature for 242 hours.
Temperature CycleAppearance: No defects or abnormalities. Capacitance Change: X7R/X5R 7.5%. Q/DF: Same as initial value. Insulation Resistance: Same as initial value.Mounting Method: Solder capacitor onto test substrate. Pre-treatment: Heat treatment at 150+0/-10C for 1 hour, then stand at room temperature for 242 hours. Temperature Cycle: 5 cycles. Steps: 1. Min Temp 3 (303 min); 2. Room Temp (2~5 min); 3. Max Temp 3 (303 min); 4. Room Temp (2~5 min). Post-treatment: Stand at room temperature for 242 hours.
High Temperature High Humidity (Load)Appearance: No defects or abnormalities. Capacitance Change: X5R/X7R 12.5%. Q/DF: 16V: 7% or 2x initial value; 25V: 5% or 2x initial value (whichever is greater). Insulation Resistance: 500M or R.C5s (whichever is smaller).Mounting Method: Reflow solder capacitor on P.C. board. Pre-treatment: Heat treatment at 150+0/-10C for 1 hour, then stand at room temperature for 242 hours. Test Temperature: 402. Test Humidity: 90%RH to 95%RH. Test Time: 50024 hours. Test Voltage: Rated voltage (not exceeding 630V). Voltage Conditioning: Apply voltage for 1 hour at test temp/voltage, then condition at ambient for 242 hours before measurement.
Life TestAppearance: No defects or abnormalities. Capacitance Change: X5R/X7R 12.5%. Q/DF: 16V: 7% or 2x initial value; 25V: 5% or 2x initial value (whichever is greater). Insulation Resistance: X5R/X7R: 1G or R.C50s (whichever is smaller).Mounting Method: Solder capacitor onto test substrate. Pre-treatment: Heat treatment at 150+0/-10C for 1 hour, then stand at room temperature for 242 hours. Test Temperature: Max operating temp 3. Test Time: 100012 hours. Test Voltage (Life): 100% R.V. Voltage Conditioning: Apply voltage for 1 hour at test temp/voltage, then condition at ambient for 242 hours before measurement.
Size (mm)Reel SizeQuantity per ReelTape Type
06037"4,000Paper Tape
Reel DiameterReel WidthHub DiameterFlange DiameterHub WidthFlange Width
1782.02.0 0.513 1.0210.850 or larger101.0

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Company Beijing Silk Road Enterprise Management Services Co., Ltd.
Location 16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person Sellina

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