High Voltage Multilayer Ceramic Chip Capacitors IHHEC C1210P224K451TFF Featuring RoHS Compliant X7P Class

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Product Description

Multilayer Ceramic Chip Capacitors (MLCC) HVC-016-1705

This specification applies to Multilayer Ceramic Chip Capacitors (MLCC) designed for high-voltage applications in electric equipment. The X7P product offering is ideally suited for LED driver, lighting, power, adapter, and USB charge applications where maintaining effective capacitance at working voltage is critical for circuit design. This product is compliant with RoHS & HF.

Product Attributes

Certifications: RoHS & HF compliant

Technical Specifications

Item	Specification	Test Condition
Scope	Multilayer Ceramic Chip Capacitor (MLCC) for high voltage applications	-
Class Characteristic	X7P	-
Tolerance	K ( 10.0 %)	-
Nominal Capacitance (E-series)	E-3: 1.0, 2.2, 4.7 pF E-6: 1.0, 1.5, 2.2, 3.3, 4.7, 6.8 pF E-12: 1.0, 1.2, 1.5, 1.8, 2.2, 2.7, 3.3, 3.9, 4.7, 5.6, 6.8, 8.2 pF E-24: 1.0, 1.2, 1.5, 1.8, 2.2, 2.7, 3.3, 3.9, 4.7, 5.6, 6.8, 8.2 pF	-
Operation Temperature Range	-55 ~ +125	Reference Temp: 25
Storage Condition	Temperature: 5 to 40 Relative Humidity: 20 to 70 % Storage Time: 12 months max.	-
Part Number Code Example: C1210P224K451T	(1) Product Code: C (MLCC) (2) Chip Size Code: 1210 (3.20 2.50 mm) (3) Temperature Characteristics Code: P (X7P, -55~+125, 10%) (4) Capacitance: 224 (220,000.0 pF) (5) Capacitance Tolerance Code: K ( 10.0 %) (6) Rated Voltage Code: 451 (450 Vdc) (7) Tapping Code: T (Tape & Reel) (8) Thickness Code: F (2.000.30 mm) (9) Special Code: F	-
Dimensions (Type 1210)	L: 3.20 0.30 mm W: 2.50 0.20 mm T: 2.00 0.30 mm B (min): 1.60 mm BW (min): 0.30 mm	-
Insulation Resistance	500/C min.	V500V, Rated Voltage, Charge Time: 60sec.
Capacitance	Within the specified tolerance	Class
Tan (X7P)	2.5% max.	Class Char.
Withstanding Voltage	No dielectric breakdown or mechanical breakdown	V500V: 200% Rated Voltage for 1~5 sec.
Temperature Capacitance Coefficient (X7P)	10%	Class , -55 ~ +125
Adhesive Strength of Termination	>0603: 10N (1.0 Kgf)	Pull force applied for 10 1 sec.
Resistance to Flexure of Substrate	Capacitance Change: X7P 12.5%	Bending to 1.0 mm at 1.0 mm/sec.
Solderability	More than 90% of terminal surface soldered	Solder Temp: 245 5, Dip Time: 5 0.5 sec.
Resistance To Soldering Heat	Capacitance Change: X7P Within 10% Tan : Satisfy initial value Insulation Resistance: Satisfy initial value Withstand Voltage: Satisfy initial value	Preheat: 150 10 for 60~120sec. Dip: 260 5, Dip Time: 10 1sec.
Temperature Cycle	Capacitance Change: X7P Within 7.5% Tan : Satisfy initial value Insulation Resistance: Satisfy initial value	Five cycles of temperature variation.
Humidity	Capacitance Change: X7P Within 15% Tan : X7P 5.0% max. Insulation Resistance: 50/C min.	40 2, 90 ~ 95%RH, 500 +12/-0Hr
High Temperature Load (Life Test)	Capacitance Change: X7P Within 15% Tan : X7P 5.0% max. Insulation Resistance: 50/C min.	100% Rated Voltage, 1000 +12/-0Hr
Vibration	Capacitance Change: X7P Within 7.5% Tan : Satisfy initial value Insulation Resistance: Satisfy initial value	Amplitude 1.5mm P-P, 10Hz to 55Hz and back to 10Hz.