Multilayer Ceramic Chip Capacitors IHHEC C1808X221K302T Supporting Lead Free Wave and Reflow Soldering Applications
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Delivery Time:
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Product Description
Product Overview
Multilayer Ceramic Chip Capacitors (MLCC) designed for electric equipment operating within a voltage range of 1KV to 8KV. These capacitors support Lead-Free wave and reflow soldering, maintaining their electrical characteristics and reliability. This product is compliant with RoHS.
Product Attributes
- Certifications: RoHS compliant
Technical Specifications
| Part Number Code | Product | Chip Size (mm) | Temperature Characteristics | Capacitance Unit | Capacitance Tolerance | Rated Voltage (Vdc) | Tapping Code |
| C 1206 X 102 K 202 T | Multilayer Ceramic Chip Capacitor | 3.201.60 (.126.063) | X7R (-55~+125 15%) | pF | K ( 10.0 %) | 2,000 | T (Tape & Reel) |
| C 0402 N 101 J 101 T | Multilayer Ceramic Chip Capacitor | 1.000.50 (.039.020) | NPO (-55~+125 30 ppm/) | pF | J ( 5.00 %) | 100 | T (Tape & Reel) |
| C 0603 L 470 G 501 T | Multilayer Ceramic Chip Capacitor | 1.600.80 (.063.031) | SL (-25~+85 +350~-1000ppm) | pF | G ( 2.00 %) | 50 | T (Tape & Reel) |
| C 1210 B 103 M 802 B | Multilayer Ceramic Chip Capacitor | 3.202.50 (.126.098) | X5R (-55~+85 15%) | pF | M ( 20.0 %) | 8,000 | B (Bulk) |
| C 1812 Y 222 Z 103 T | Multilayer Ceramic Chip Capacitor | 4.603.20 (.181.125) | Y5V (-30~+85 +22/-82%) | pF | Z (+80/-20 %) | 1,000 | T (Tape & Reel) |
Performance Specifications
| Item | Specification | Test Condition |
| Insulation Resistance | 10,000M or 500/C (Whichever Is Smaller) | V500V, Applied 500Vdc; V500V, Applied 500Vdc; Charge Time: 60sec. |
| Capacitance | Class NPO/SL: Within Specified Tolerance; Class : Within Specified Tolerance | N/A |
| Q Factor | Class NPO/SL: More Than 30pF: Q 1000; 30pF & Below: Q40020C (C: Capacitance, pF) | N/A |
| Tan | Class Char.: X7R 2.5%; Z5U/Y5U 4.0% | N/A |
| Withstanding Voltage | No dielectric breakdown or mechanical breakdown | 200%/150%/120%/100% Rated Voltage (Voltage ramp up rate500v/sec for 1~5 sec.) |
| Temperature Capacitance Coefficient | Class: [C2-C1/C1(T2-T1)] 100%; Class: (C2-C1)/C1 100% | T1: 25; T2: Test temperature; C1: Capacitance at 25; C2: Capacitance at T2. |
| Adhesive Strength of Termination | 0603: 5N ( 0.5 Kgf); 0603: 10N (1.0 Kgf) | Pull force applied for 101 second. |
| Resistance to Flexure of Substrate | Capacitance Change: NPO 5.0%; SL 5.0%; X7R 12.5%; Y5U/Z5U 30.0% | Bending applied to the 1.0 mm with 1.0 mm/sec. |
| Solderability | More than 90% of terminal surface soldered newly, metal part does not come out or dissolve. | Solder Temp: 2455; Dip Time: 50.5 sec.; Immersing Speed: 2510% mm/s; Solder: Lead Free; Flux: Rosin; Preheat: 80~120 for 10~30sec. |
| Resistance To Soldering Heat | Capacitance Change: Class (NPO/SL) Within 2.5% or 0.25pF (whichever is larger); Class X7R Within 10%; Z5U/Y5U Within 20% | Preheat: 15010 For 60~120sec.; Dip: Solder Temp. 2605; Dip Time: 101sec.; Immersing Speed: 2510% mm/s; Flux: Rosin. |
| Temperature Cycle | Capacitance Change: Class (NPO/SL) Within 2.5% or 0.25pF (whichever is larger); Class X7R Within 7.5%; Z5U/Y5U Within 20% | Five cycles: Step 1: Min Rated Temp. +0/-3 for 30min; Step 2: 25 for 3min; Step 3: Max Rated Temp. +3/-0 for 30min; Step 4: 25 for 3min. |
| Humidity | Capacitance Change: Class (NPO/SL) Within 5.0% or 0.5pF (whichever is larger); Class X7R Within 15%; Z5U/Y5U Within 30% | Temperature: 402; Relative Humidity: 90~95%RH; Test Time: 500 +12/-0Hr. |
| High Temperature Load | Capacitance Change: Class (NPO/SL) Within 3.0% or 0.3pF (whichever is larger); Class X7R Within 15%; Z5U/Y5U Within 30% | DC voltage applied for one hour at maximum operation temperature 3. |
| Vibration | Appearance: No mechanical damage shall occur. | Solder the capacitor on P.C. board shown in Fig 2. before testing. |
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina