Monolithic Inorganic Material Ferrite Bead INPAQ MCB1608S102CBP for RF and Logic Device Filtering
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Product Description
Product Overview
The INPAQ Global RF/Component Solutions MCB S Series Chip Ferrite Bead is a monolithic inorganic material construction designed for effective filtering capabilities over a wide range of frequencies. Featuring a closed magnetic circuit to avoid crosstalk, these SMD type components are suitable for reflow and wave soldering. They offer excellent solderability, heat resistance, and high reliability. Applications include filtering between analog and digital circuitry, clock generation, I/O interconnects, isolation between RF noisy circuits and logic devices, power supply filtering, and high-frequency EMI prevention in electronic devices such as computers, printers, VCRs, TVs, and portable telephones.
Product Attributes
- Brand: INPAQ Global RF/Component Solutions
- Series: MCB S Series
- Construction: Monolithic inorganic material
- Circuit Design: Closed magnetic circuit
- Mounting Type: SMD
- Soldering Compatibility: Reflow and Wave Soldering
- Features: Excellent solderability, heat resistance, high reliability
- Packaging Options: Embossed paper tape (P), Embossed plastic tape (E)
Technical Specifications
| Product Name | Size (EIAJ) | L (mm) | W (mm) | T (mm) | E (mm) | Part Number Code Structure | Test Instruments |
|---|---|---|---|---|---|---|---|
| Chip Ferrite Bead (MCB S Series) | 1005 (0402) | 1.000.10 | 0.500.10 | 0.500.10 | 0.250.10 | MCB [Size Code] [Material Code] [Impedance() 25%] [Fixed Decimal Point] [Rated Current Code] [Soldering] [Packaging] | HP4291B RF IMPEDANCE / MATERIAL ANALYZER, HP4338A/B MILLIOHMMETER, Agilent 8720ES S-PARAMETER NETWORK ANALYZER, HP6632B SYSTEM DC POWER SUPPLY |
| 1608 (0603) | 1.600.15 | 0.800.15 | 0.800.15 | 0.300.20 | |||
| 2012 (0805) | 2.000.20 | 1.250.20 | 0.900.20 | 0.500.30 | |||
| 3216 (1206) | 3.200.20 | 1.600.20 | 1.100.20 | 0.50030 | |||
| 3225 (1210) | 3.200.20 | 2.500.20 | 1.300.20 | 0.500.30 | |||
| 4516 (1806) | 4.500.25 | 1.600.20 | 1.600.20 | 0.600.40 | |||
| 4532 (1812) | 4.500.25 | 3.200.25 | 1.500.25 | 0.600.40 |
Part Number and Characteristics Table (Selected Examples)
| Part No. | Impedance() 25% | Test Freq.(MHz) | DCR() (Max.) | Rated Current (mA) |
|---|---|---|---|---|
| MCB1005S100FBP | 10 | 100 | 0.10 | 300 |
| MCB1005S241EBP | 240 | 100 | 0.70 | 200 |
| MCB1608S100IBP | 10 | 100 | 0.05 | 600 |
| MCB1608S102CBP | 1000 | 100 | 0.60 | 100 |
| MCB2012S300KBP | 30 | 100 | 0.05 | 800 |
| MCB2012S202EBP | 2000 | 100 | 0.50 | 200 |
| MCB3216S310KBE | 31 | 100 | 0.05 | 800 |
| MCB3216S202EBE | 2000 | 30 | 0.50 | 200 |
| MCB3225S600KBE | 60 | 100 | 0.30 | 800 |
| MCB4516S800KBE | 80 | 100 | 0.10 | 800 |
| MCB4532S700KBE | 70 | 100 | 0.40 | 800 |
General Technical Data
| Parameter | Value |
|---|---|
| Operating Temperature Range | -55 ~ +125 |
| Storage Condition | Less than 40 and 70% RH |
| Storage Time | 6 months (Size: 1005), 12 months (Size: 1608 above) |
| Soldering Method | Reflow or Wave Soldering |
Reliability and Test Conditions
| Test Item | Test Condition | Criteria |
|---|---|---|
| Temperature Cycle | Temp: -40 ~ +85, Cycle: 100 cycles, Dwell time: 30 minutes | No mechanical damage; Impedance value within 20% of initial value. |
| Operational Life | Temp: 125 5, Test time: 1000 hrs, Apply current: full rated current | No mechanical damage; Impedance value within 20% of initial value. |
| Biased Humidity | Temp: 40 2, Humidity: 90 ~ 95 % RH, Test time: 1000 hrs, Apply current: full rated current | No mechanical damage; Impedance value within 20% of initial value. |
| Resistance to Solder Heat | Solder temp: 260 5, Flux: Rosin, DIP time: 10 1 sec | >95% terminal electrode covered with new solder; No mechanical damage; Impedance value within 20% of initial value. |
| Adhesive Test | Reflow temp: 245, Apply force(F): 5 N, Test time: 10 sec | No mechanical damage; Soldering on PCB after pulling test force > 5 N. |
| Steam Aging Test | Temp: 93, Test time: 4 hrs (MCB1005) / 8 hrs (Others), Solder temp: 235 5, Flux: Rosin, DIP time: 5 1 sec | >95% terminal electrode covered with new solder. |
| Rated Current Test | Apply current: full rated current / 5min | Temperature rise less than 25. |
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina