Precision current sensing resistor Isabellenhuette VMS-R330-1.0-U suitable for automotive power modules and control systems
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Product Description
Product Overview
The ISA-PLAN VMS series from Isabellenhtte Heusler GmbH & Co. KG are precision resistors designed for current sensing in power hybrid applications. These resistors are AEC-Q200 qualified and RoHS 2011/65/EU compliant, offering high pulse power rating, excellent long-term stability, and constant current capability up to 25 A with a resistance of 5 mOhm. They are suitable for demanding applications in control systems for the automotive market, power modules, frequency converters, and switch mode power supplies. Mounting is achieved via reflow- and IR-soldering.
Product Attributes
- Brand: ISA-PLAN
- Series: VMS
- Size: 2512
- Manufacturer: Isabellenhtte Heusler GmbH & Co. KG
- Qualification: AEC-Q200
- Compliance: RoHS 2011/65/EU
- Mounting: Reflow- and IR-soldering
Technical Specifications
| Specification | Value | Unit | Notes |
|---|---|---|---|
| Power Rating (P95 C) | 3 | W | at 95 C |
| Power Rating (P70 C) | 4 | W | at 70 C |
| Constant Current | 25 | A | (5 mOhm) |
| Resistance Values | 0.005 to 1 | Ohm | See page 2 for standard values |
| Tolerance | 1 / 2 / 5 | % | |
| Temperature Coefficient (20-60 C) | < 20 | ppm/K | |
| Applicable Temperature Range | -65 to +170 | C | |
| Internal Heat Resistance (Rthi) | < 25 | K/W | |
| Dielectric Withstanding Voltage | 200 | V AC/DC | |
| Stability (at rated power, 2000h) | < 0.5 | % | (TK=65 C) |
| Stability (at rated power, 2000h) | < 0.7 | % | (TK=95 C) |
| Tape Width | 12 | mm | DIN EN 60286-3 |
| Reel Size | 13 | inch | |
| Parts per Reel | 9000 | pcs | |
| Packaging Weight (net) | 539 | g | |
| Recommended Solder Peak Temperature | 260 | C | for Reflow- and IR-soldering |
| Recommended Solder Peak Time | 40 | sec | |
| Recommended Solder Temperature (above 217 C) | 255 | C | |
| Recommended Solder Time (above 217 C) | 90 | sec | |
| Dimensions (L x W x H) | 6.35 0.3 x 3.05 0.2 x 0.4 0.15 | mm | |
| Pad Dimensions (A x B) | 0.9 0.2 x 0.5 0.2 | mm | |
| Solder Pad Type (l x w x a x b x c) | 7.5 x 3.6 x 1.55 x 2.6 x 1.0 | mm | if TC < 20 ppm/K is required for R in between 30 and 80 mOhm |
| Test: Temperature Cycling | 0.5 % | 2000 cycles (-55 C to +150 C) | |
| Test: Low Temperature Storage | 0.1 % | -65 C for 24 h | |
| Test: Resistance to Soldering Heat | 0.3 % | 260 C for 10 sec / 8h steam aging | |
| Test: Moisture Resistance | 0.3 % | MIL-STD-202 method 106 | |
| Test: Mechanical Shock | 0.2 % | 100 g, 6 ms half sine | |
| Test: Vibration, High Frequency | 0.2 % | 20 g, 10-2000 Hz | |
| Test: Operational Life | 1.0 % | 2000 h, TK max at rated power (TK = 95 C) | |
| Test: High Temperature Exposure | 1.0 % | 2000 h / 170 C | |
| Test: Bias Humidity | 0.5 % | +85 C, 85 r.F., 1000 h, powered |
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