Beijing Silk Road Enterprise Management Services Co., Ltd.
                                                                                                           
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Effective EMI Suppression Chip Ferrite Bead INPAQ MCB1005B152DBP for Electronic Circuit Applications

Price Negotiable
Price: Negotiable
MOQ: Negotiable
Delivery Time: Negotiable
Product Description

Product Overview

The INPAQ Global RF/Component Solutions MCB B Series is a Chip Ferrite Bead designed for RF and component applications. These components are manufactured to precise specifications, offering reliable performance in various electronic circuits. The MCB 1005 B Series is particularly suited for applications requiring effective EMI suppression and impedance matching, with a focus on lead-free soldering processes and standard packaging for automated assembly.

Product Attributes

  • Brand: INPAQ Global RF/Component Solutions
  • Series: MCB B Series
  • Product Type: Chip Ferrite Bead
  • Size Code: EIAJ 1005 (EIA 0402)
  • Soldering: Lead-Free (A - Soldering Lead-Free, B - Lead-Free for whole chip)
  • Packaging: Embossed paper tape, 7" reel
  • Operating Temperature Range: -55 to +125
  • Storage Condition: Less than 40 and 70% RH
  • Storage Time: 6 months Max.
  • Soldering Method: Reflow or Wave Soldering

Technical Specifications

Part Number Impedance () 25% Test Frequency (MHz) DCR () Max. Rated Current (mA) Size (mm) L x W x T End Electrode (mm) E
MCB1005B601FB_ 600 100 0.60 300 1.00 0.10 x 0.50 0.10 x 0.50 0.10 0.25 0.10
MCB1005B102EB_ 1000 100 1.00 200
MCB1005B152DB_ 1500 100 1.50 150
Note: For special part numbers not listed, refer to appendix.

Packaging & Reel Specifications

Part Size (EIA Size) Reel Diameter Quantity per Reel (pcs) Quantity per Inner Box
1005 (0402) 7 10,000 5 reels / inner box

Taping Dimensions (Unit: mm)

Size W P E F D Po P2 Ao Bo Ko(T)
1005 8.000.10 2.000.05 1.750.05 3.500.05 1.550.05 4.000.10 2.000.05 0.620.03 1.120.03 0.600.03

Solder Land Information (Unit: mm)

Size A B C
1005 0.4 0.6 1.6 2.6 0.4 0.7

Reliability and Test Conditions

Test Item Test Condition Criteria
Temperature Cycle a. Temp: -40 ~ +85
b. Cycle: 100 cycles
c. Dwell: 30 min
d. Measurement: 24 hrs ambient
a. No mechanical damage
b. Impedance within 20% of initial value
Operational Life a. Temp: 125 5
b. Time: 1000 hrs
c. Current: Full rated current
d. Measurement: 24 hrs ambient
a. No mechanical damage
b. Impedance within 20% of initial value
Biased Humidity a. Temp: 40 2
b. Humidity: 90 ~ 95 % RH
c. Time: 1000 hrs
d. Current: Full rated current
e. Measurement: 24 hrs ambient
a. No mechanical damage
b. Impedance within 20% of initial value
Resistance to Solder Heat a. Solder Temp: 260 5
b. Flux: Rosin
c. DIP time: 10 1 sec
a. >95% terminal electrode covered with new solder
b. No mechanical damage
c. Impedance within 20% of initial value
Adhesive Test a. Reflow Temp: 245
b. Force: 5 N
c. Time: 10 sec
a. No mechanical damage
b. Soldering on PCB after pulling test force > 5 N
Steam Aging Test a. Temp: 93
b. Time: 4 hrs
c. Solder Temp: 235 5
d. Flux: Rosin
e. DIP time: 5 1 sec
>95% terminal electrode covered with new solder
Rated Current Test a. Apply current: Full rated current / 5min Temperature rise

Test Instruments

  • HP4291B RF IMPEDANCE / MATERIAL ANALYZER
  • HP4338A/B MILLIOHMMETER
  • Agilent 8720ES S-PARAMETER NETWORK ANALYZER
  • HP6632B SYSTEM DC POWER SUPPLY

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Beijing Silk Road Enterprise Management Services Co., Ltd.
Location 16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person Sellina

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