Power resistor Isabellenhuette VMS-R500-1.0-U suitable for reflow IR soldering and automotive control systems applications
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MOQ:
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Delivery Time:
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Product Description
Product Overview
The ISA-PLAN VMS series from Isabellenhtte Heusler GmbH & Co. KG are precision resistors designed for demanding power hybrid applications. These resistors offer high pulse power capability, excellent long-term stability, and are AEC-Q200 qualified, making them ideal for control systems in the automotive market, power modules, frequency converters, and switch mode power supplies. They are suitable for reflow and IR soldering and comply with RoHS 2011/65/EU.
Product Attributes
- Brand: ISA-PLAN
- Manufacturer: Isabellenhtte Heusler GmbH & Co. KG
- Model Series: VMS
- Size: 2512
- Mounting: Reflow- and IR-soldering
- Qualification: AEC-Q200 qualified
- Compliance: RoHS 2011/65/EU compliant
- Packaging: Tape and reel (12 mm tape width, 13-inch reel size, 9000 pcs per reel)
Technical Specifications
| Specification | Value | Unit | Notes |
|---|---|---|---|
| Power Rating (P95 C) | 3 | W | At 95 C |
| Power Rating (P70 C) | 4 | W | At 70 C |
| Constant Current | up to 25 | A | For 5 mOhm resistance |
| Resistance values | 0.005 to 1000 | Ohm | Standard values available, see page 2 for details |
| Tolerance | 1 %, 2 %, 5 % | % | Standard tolerances |
| Temperature coefficient (20-60 C) | < 20 | ppm/K | |
| Applicable temperature range | -65 to +170 | C | |
| Internal heat resistance (Rthi) | < 25 | K/W | |
| Dielectric withstanding voltage | 200 | V AC/DC | |
| Inductance | < 3 | nH | |
| Stability (at rated power, 2000h) | < 0.5 % | % | TK = 65 C |
| Stability (at rated power, 2000h) | < 0.7 % | % | TK = 95 C |
| Tape width | 12 | mm | DIN EN 60286-3 |
| Reel size | 13 | inch | |
| Parts per reel | 9000 | pcs | |
| Packaging weight net | 539 | g | |
| Recommended solder profile peak temperature | 260 | C | 40 sec |
| Recommended solder profile temperature | 255 | C | 90 sec |
| Recommended solder profile temperature | 217 | C | |
| Dimensions (L x W x H) | 6.35 0.3 x 3.05 0.2 x 0.4 0.15 | mm | |
| Pad dimensions (A x B) | 0.9 0.2 x 0.5 0.2 | mm | |
| Solder pad type (l x w x a x b x c) | 7.5 x 3.6 x 1.55 x 2.6 x 1.0 | mm | If TC < 20 ppm/K is required for R in between 30 and 80 mOhm |
| Temperature Cycling (2000 cycles, -55 C to +150 C) | 0.5 % | % | Resistance change |
| Low Temperature Storage (-65 C for 24 h) | 0.1 % | % | Resistance change |
| Resistance to Soldering Heat (260 C for 10 sec / 8h steam aging) | 0.3 % | % | Resistance change |
| Moisture Resistance (MIL-STD-202 method 106) | 0.3 % | % | Resistance change |
| Mechanical Shock (100 g, 6 ms half sine) | 0.2 % | % | Resistance change |
| Vibration, High Frequency (20 g, 10-2000 Hz) | 0.2 % | % | Resistance change |
| Operational Life (2000 h, TK max at rated power) | 1.0 % | % | TK = 95 C |
| High Temperature Exposure (2000 h / 170 C) | 1.0 % | % | Resistance change |
| Bias Humidity (+85 C, 85 r.F., 1000 h, powered) | 0.5 % | % | Resistance change |
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