Precision Resistor Isabellenhuette SMT-R025-1.0 for in Switch Mode Power Supplies and Control Systems
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Product Description
Product Overview
The ISA-PLAN 2817 is a precision Surface Mount Technology (SMT) resistor designed for demanding power hybrid applications. It offers excellent long-term stability, high pulse power handling, and is AEC-Q200 qualified. Ideal for control systems in the automotive market, power modules, frequency converters, and switch mode power supplies, this resistor provides reliable current sensing up to 35 A with a low resistance of 4 mOhm.
Product Attributes
- Brand: ISA-PLAN
- Manufacturer: Isabellenhtte Heusler GmbH & Co. KG
- Mounting Type: SMT (Surface Mount Technology)
- Soldering Methods: Reflow-soldering, IR-soldering
- Certifications: AEC-Q200 qualified, RoHS 2011/65/EU compliant
- Material: Manganin resistors (implied by temperature dependence graph title)
Technical Specifications
| Specification | Details |
|---|---|
| Product Series | ISA-PLAN |
| Resistor Type | Precision Resistors SMT |
| Size | 2817 |
| Power Rating (P105 C) | 5 W for < 1 ; 3 W for 1 |
| Power Rating (P70 C) | 7 W for < 1 ; 5 W for 1 |
| Constant Current Rating | Up to 35 A (at 4 mOhm) |
| Resistance Values | 0.004 to 4 |
| Tolerance | 0.5%, 1%, 2%, 5% |
| Temperature Coefficient (20-60 C) | <50 ppm/K for 10 m; <100 ppm/K for <10 m |
| Applicable Temperature Range | -55 C to +170 C |
| Internal Heat Resistance (Rthi) | <13 K/W for <1 ; <22 K/W for 1 |
| Dielectric Withstanding Voltage | 200 V AC/DC |
| Inductance | <3 nH |
| Stability (at rated power, 2000h) | <0.5% (TK = 75 C); <1.0% (TK = 105 C) |
| Recommended Soldering Temperature (Peak) | 260 C (40 sec) |
| Recommended Soldering Temperature (Time @ 255 C) | 90 sec |
| Recommended Soldering Temperature (Time @ 217 C) | 40 sec |
| Tape Width | 12 mm |
| Reel Size | 13 inch |
| Parts per Reel | 5000 pcs |
| Packaging Weight | 494 g |
| Test Conditions (Temperature Cycling) | 2000 cycles (-55 C to +150 C) |
| Resistance Change (Temperature Cycling) | 0.5% |
| Test Conditions (Low Temperature Storage/Operation) | -65 C for 24 h |
| Resistance Change (Low Temperature Storage/Operation) | 0.1% |
| Test Conditions (Resistance to Soldering Heat) | 260 C for 10 sec / 8h steam aging |
| Resistance Change (Resistance to Soldering Heat) | 0.3% |
| Test Conditions (Moisture Resistance) | MIL-STD-202 method 106 |
| Resistance Change (Moisture Resistance) | 0.1% |
| Test Conditions (Mechanical Shock) | 100 g, 6 ms half sine |
| Resistance Change (Mechanical Shock) | 0.1% |
| Test Conditions (Vibration, High Frequency) | 20 g, 10-2000 Hz |
| Resistance Change (Vibration, High Frequency) | 0.1% |
| Test Conditions (Operational Life) | 2000 h, TK max at rated power |
| Resistance Change (Operational Life) | 1.0% |
| Test Conditions (High Temperature Exposure) | 2000 h / 170 C |
| Resistance Change (High Temperature Exposure) | 1.0% |
| Test Conditions (Bias Humidity) | +85 C, 85 r.F., 1000 h |
| Resistance Change (Bias Humidity) | 0.5% |
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Contact Person
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