Precision Grade Flat Chip Resistors KOA RK73H1ETTP5232F Featuring Metal Glaze Thick Film and RoHS Compliance
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Product Description
Product Overview
The RK73H series of Flat Chip Resistors (Precision Grade) are designed for high reliability in demanding applications. Featuring a small size, light weight, and excellent heat and weather resistance due to metal glaze thick film, these resistors offer high stability with a triple-layer electrode structure. They are compatible with automatic mounters and suitable for both flow and reflow soldering. These RoHS-compliant products are ideal for automotive, medical, and aerospace equipment where failure could lead to serious damage or loss of life.
Product Attributes
- Brand: KOA
- Product Type: Flat Chip Resistors (Precision Grade)
- Coating Color: Black (1F, 1H), Blue (1E, 1J, 2A, 2B, 2E, W2H, W3A, W3A2)
- Certifications: EU RoHS compliant (lead-free termination), AEC-Q200 qualified (Exemption 1F)
- Material: Metal glaze thick film (resistive film), Alumina (substrate)
- Origin: Japan (implied by company name and product origin)
Technical Specifications
| Type (Inch Size Code) | Dimensions (mm) L x W x c x d x t | Weight (g/1000pcs) | Power Rating | Rated Ambient Temp. | Rated Terminal Part Temp. | T.C.R. (10-6/K) | Resistance Range () | Max. Working Voltage | Max. Overload Voltage | Packaging & Q'ty/Reel (pcs) |
| 1F (01005) | 0.40.02 x 0.20.02 x 0.100.03 x 0.110.03 x 0.130.02 | 0.04 | 0.03W | 70 | 200 (100k1M), 250 (1091k) | 101M | 20V | 30V | 40,000 | |
| 1H (0201) | 0.60.03 x 0.30.03 x 0.10.05 x 0.150.05 x 0.230.03 | 0.14 | 0.05W | 70 | 200 (1010M), 400 (19.1) | 1010M | 25V | 50V | 35,000 | |
| 1E (0402) | 1.0+0.1-0.05 x 0.50.05 x 0.20.1 x 0.25+0.05-0.1 x 0.350.05 | 0.68 | 0.1W | 70 | 125 | 100 (101M), 200 (19.76, 1.02M10M) | 101M | 75V | 100V | |
| 1J (0603) | 1.60.2 x 0.80.1 x 0.30.1 x 0.30.1 x 0.450.1 | 2.14 | 0.1W | 70 | 125 | 100 (1.02k1M), 200 (19.76, 1.02M10M) | 1.02k1M | 5,000 | ||
| 1J (0603) | 1.60.2 x 0.80.1 x 0.30.1 x 0.30.1 x 0.450.1 | 2.14 | 0.125W | 70 | 125 | 100 (101k), 200 (19.76) | 101k | 5,000 | ||
| 2A (0805) | 2.00.2 x 1.250.1 x 0.40.2 x 0.3+0.2-0.1 x 0.50.1 | 4.54 | 0.25W | 70 | 125 | 100 (101M), 200 (19.76), 400 (1.02M10M) | 101M | 150V | 200V | 4,000 |
| 2B (1206) | 3.20.2 x 1.60.2 x 0.50.3 x 0.4+0.2-0.1 x 0.60.1 | 9.14 | 0.25W | 70 | 125 | 100 (101M), 200 (19.76), 400 (1.02M5.6M) | 101M | 200V | 400V | 4,000 |
| 2E (1210) | 2.60.2 x 15.5 x 0.60.1 x 0.50.1 | 0.5W | 70 | 125 | 100 (101M), 200 (19.76), 400 (1.02M5.6M) | 101M | 4,000 | |||
| W2H (2010) | 5.00.2 x 2.50.2 x 0.650.15 x 0.4+0.2-0.1 x 0.50.1 | 24.3 | 0.75W | 70 | 125 | 100 (101M), 200 (19.76), 400 (1.02M5.6M) | 101M | 4,000 | ||
| W3A (2512) | 6.30.2 x 3.10.2 x 0.60.1 x 0.4+0.2-0.1 x 0.50.1 | 37.1 | 1W | 70 | 125 | 100 (101M), 200 (19.76), 400 (1.02M5.6M) | 101M | 200V (500V5) | 400V (500V5) | 4,000 |
| W3A2 (2512) | 6.30.2 x 3.10.2 x 0.60.1 x 0.4+0.2-0.1 x 0.50.1 | 2W | 95 | 100 (101M), 200 (19.76), 400 (1.02M5.6M) | 101M | 200V | 400V | 4,000 |
Performance
| Test Items | Performance Requirements (R(+0.1 )) | Limit | Typical | Test Methods |
| Resistance | Within specied tolerance | |||
| Resistance Temperature Coefcient (T.C.R.) | Within specied T.C.R. | -55/+25/-55 and +25/+125 | ||
| Overload (Short time) | 1 (1F), 0.5 (another) | Rated voltage 2.5 for 5s (1E, 2B, W3A2: Rated voltage2 for 5s) | ||
| Resistance to soldering heat | 1:1FW3A (10R1M), 3:1HW3A (R1M) | 0.5:1FW3A (10R1M), 1:1HW3A (R1M) | 2605, 10s1s | |
| Rapid change of temperature | 1 (1F), 0.5 (another) | 0.5 (1F), 0.3 (another) | -55 (30min.) /+125 (30min.) 100 cycles | |
| Moisture resistance | 2 (1J, 2A, 2B), 3 (another) | 0.75 (1J, 2A, 2B), 1.5 (1F), 1 (another) | 402, 90%95%RH, 1000h (1.5h ON/0.5h OFF cycle) | |
| Endurance at 70 | 2 (1J, 2A, 2B), 3 (another) | 0.75 (1J, 2A, 2B), 1 (another) | 702, 1000h (1.5h ON/0.5h OFF cycle) | |
| High temperature exposure | 1 | 0.5 (1F), 0.3 (another) | +125, 1000h: 1F; +155, 1000h: 1H,1E, 1J, 2A, 2B, 2E, W2H, W3A, W3A2 |
Precautions for Use
- The substrate of chip resistors is alumina. Cracks may occur at the connection of solder (solder fillet portion) due to the difference of the coefficient of thermal expansion from the mounting board when heat stress like heat cycle, etc. are repeatedly applied. Care should be taken to the occurrence of cracks when the change in ambient temperature or ON/OFF of load is repeated, especially with large types (W2H/W3A/W3A2) which have large thermal expansion and also self-heating. By general temperature cycle tests using glass-epoxy (FR-4) boards under the maximum/minimum temperatures of the operating temperature range, cracks do not occur easily in types 1F2E, but tend to occur in types W2H/W3A/W3A2. Cracks caused by thermal stress depend on the size of the mounted pad, the amount of solder, and the heat dissipation of the mounting board. Therefore, careful design is required when used under conditions of significant ambient temperature changes or load ON/OFF.
- Please be aware that RK73H1F resistors may be damaged by static electricity generated or applied during equipment assembly processes.
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina