Low Resistance Flat Chip Resistors KOA SR732BTTD1R00F Current Detection Power Supply Motor Circuits

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Product Description

Product Overview

The SR73 series are low resistance flat chip resistors designed for current detection in power supply and motor circuits. They offer high reliability and performance with a resistance tolerance of 0.5% and a temperature coefficient of 10010^-6/K. These resistors are suitable for both reflow and flow soldering and meet EU-RoHS requirements for lead-free termination. They are AEC-Q200 qualified (excluding 1H type).

Product Attributes

Brand: KOA
Product Line: SR73
Type: Low Resistance Flat Chip Resistors (THICK FILM)
Certifications: IEC 60115-8, JIS C 5201-8, EIAJ RC-2134C, AEC-Q200 (Excluding 1H)
Environmental Compliance: EU-RoHS
Coating Color: Black (1H), Indigo (1E, 1J, 2A, 2B, 2E, W2H, W3A, W3A2)
Terminal Surface Material: Lead-free plating is standard. T is available for 1H, W2H, W3A, W3A2. Gold plated electrodes available for 1J, 2A, 2B (0.1 to 10).

Technical Specifications

Type (Inch Size Code)	Dimensions (mm) L x W x t	Weight (g/1000pcs)	Power Rating	Rated Ambient Temp.	Rated Terminal Part Temp.	T.C.R. (10^-6/K)	Resistance Range ()	Taping & Qty /Reel (pcs)
1H (0201)	0.60.03 x 0.30.03 x 0.230.03	0.14	0.1W	70		0+4000	110 (D,F), 0.2710 (TCM), 0.20.47 (TPL/TP), 0.10.18 (TD/TE)	TCM: 15,000
1E (0402)	1.0 x 0.5 x 0.350.05	0.68	0.166W	70	125	2000	0.5110.0 (D,F), 0.20.47 (TCM), 0.10.18 (TPL/TP/TD/TE)	TPL: 20,000, TP: 10,000
1J (0603)	1.60.2 x 0.8 x 0.450.1	2.14	0.2W	70	125	2000	1.110. (D,F), 0.25W: 0.11 (D,F)	TP: 10,000, 5,000
2A (0805)	2.00.2 x 1.250.1 x 0.50.1	4.54	0.33W	70	125	1000	0.1510 (D,F), 0.110. (G,J)	TP: 10,000, 5,000, 4,000
2B (1206)	3.20.2 x 1.60.2 x 0.60.1	9.14	0.33W	70	125	1000	0.1510 (D,F), 0.110. (G,J)	5,000, 4,000
2E (1210)	2.60.2 x 2.60.2 x 0.60.1	15.50	0.5W	70	125	1000	0.110. (D,F), 0.04710.00 (G,J)	5,000, 4,000
W2H (2010)	5.00.2 x 2.50.2 x 0.650.15	24.30	0.75W	70	125	1000	0.110. (D,F), 0.110. (G,J)	4,000
W3A (2512)	6.30.2 x 3.10.2 x 0.70.1	37.10	1W	70	125	1000	0.110. (D,F), 0.110. (G,J)	4,000
W3A2 (2512)	6.30.2 x 3.10.2 x 0.70.1	37.10	2W		95	1000	0.110. (D,F), 0.110. (G,J)	4,000

Performance

Test Items	Performance Requirements	Limit	Typical	Test Methods
Resistance	Within specified tolerance	R(+0.005)	25
T.C.R.	Within specified T.C.R		+25/55 and +25/+125
Overload (Short time)	2 (1H), 0.5 (1EW3A2)	3:1H, 1:1EW3A2	Rated voltage2.5 for 5s (W3A2: Rated voltage2.0 for 5s)
Resistance to soldering heat	0.75 (1H), 0.3 (1EW3A2)	1 (1EW3A2)	2605, 10s1s
Rapid change of temperature	1 (1H), 0.3 (1EW3A2)		40 (30min.)/+125 (30min.) 100 cycles
Moisture resistance	3 (1H), 2 (1EW3A2)	1.5	402, 90%95%RH, 1000h (1.5h ON/0.5h OFF cycle)	70

Applications

Current detecting resistors for power supply, motor circuits, etc.
Car electronics, Computers, HDDs, Cellular-telephones, Power supplies, and Motor circuits, etc.

Features

Current detecting resistors for power supply, motor circuits, etc.
High reliability and performance with resistance tolerance 0.5%, T.C.R. 10010^-6/K.
Suitable for both reflow and flow solderings.
Products with lead free termination meet EU-RoHS requirements. EU-RoHS regulation is not intended for Pb-glass contained in electrode, resistor element and glass.
AEC-Q200 qualified (Exemption 1H).

Precautions for Use

The substrate of chip resistors is alumina. Cracks may occur at the connection of solder (solder fillet portion) due to the difference of the coefficient of thermal expansion from a mounting board when heat stress like heat cycle, etc. are repeatedly given to them. Care should be taken to the occurrence of the cracks when the change in ambient temperature or ON / OFF of load is repeated, especially when large types of W2H/W3A/W3A2 which have large thermal expansion and also self heating. By general temperature cycle test using glass-epoxy(FR-4) boards under the maximum/minimum temperatures of operating temperature range, the crack does not occur easily in the types of 1H2E, but the crack tends to occur in the types of W2H/W3A/W3A2. The occurrence of the crack by heat stress may be influenced by the size of a pad, solder volume, heat radiation of mounting board etc., so please pay careful attention to designing when a big change in ambient temperature and conditions for use like ON/OFF of load can be assumed.
The resistance value after soldering may change depending on the size of pad pattern or solder amount. Make sure the effect of decline/increase of resistance value before designing.