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thick film flat chip resistors KOA RK73H1ETTP1803F with small size and excellent weather resistance

Price Negotiable
Price: Negotiable
MOQ: Negotiable
Delivery Time: Negotiable
Product Description

Product Overview

The RK73H series of flat chip resistors are precision-grade, thick-film resistors designed for high reliability and stability. They feature a small size, light weight, and excellent heat and weather resistance due to their metal glaze thick film construction. The triple-layer electrode structure ensures high reliability. These resistors are suitable for automated mounting and reflow/wave soldering processes. They are RoHS compliant with lead-free terminations, and some models are AEC-Q200 qualified. Applications include automotive, medical, and aerospace equipment, where high safety and reliability are critical.

Product Attributes

  • Brand: KOA
  • Product Type: Flat Chip Resistors (Precision Grade)
  • Coating Color: Black (1F, 1H), Blue (1E, 1J, 2A, 2B, 2E, W2H, W3A, W3A2)
  • Material: Metal Glaze Thick Film, Alumina Substrate
  • Certifications: EU RoHS Compliant, AEC-Q200 Qualified (Exemption 1F)
  • Origin: Japan (implied by manufacturer)

Technical Specifications

Type (Inch Size Code)Dimensions (mm) L x W x c x d x tWeight (g/1000pcs)Power RatingRated Ambient Temp.Rated Terminal Part Temp.T.C.R. (10-6/K)Resistance Range ()Max. Working VoltageMax. Overload VoltagePackaging & Q'ty/Reel (pcs)
1F (01005)0.40.02 x 0.20.02 x 0.100.03 x 0.110.03 x 0.130.020.040.03W70200 (100k1M), 250 (1091k)101M420V30V40,000
1H (0201)0.60.03 x 0.30.03 x 0.10.05 x 0.150.05 x 0.230.030.140.05W70200 (1010M), 400 (19.1)1010M425V50V35,000
1E (0402)1.0+0.1-0.05 x 0.50.05 x 0.20.1 x 0.25+0.05-0.1 x 0.350.050.680.1W70125100 (101M), 200 (19.76), 200 (1.02M10M)101M, 1.02M10M75V100VTPL: 20,000, TP: 10,000
1J (0603)1.60.2 x 0.80.1 x 0.30.1 x 0.30.1 x 0.450.12.140.1W / 0.125W70125100 (1.02k1M), 200 (19.76, 1.02M10M), 100 (101k), 200 (19.76)1.02k1M, 101kTP: 10,000, 5,000
2A (0805)2.00.2 x 1.250.1 x 0.40.2 x 0.3+0.2-0.1 x 0.50.14.540.25W70125100 (101M), 200 (19.76), 400 (1.02M10M)101M, 1.02M10M150V200VTP: 10,000, 5,000, 4,000
2B (1206)3.20.2 x 1.60.2 x 0.50.3 x 0.4+0.2-0.1 x 0.60.19.140.25W70125100 (101M), 200 (19.76), 400 (1.02M5.6M)101M, 1.02M10M200V400V5,000, 4,000
2E (1210)2.60.2 x 15.5 W2H (2010) 10.5W70125100 (101M), 200 (19.76), 400 (1.02M5.6M)101M, 1.02M10M5,000, 4,000
W2H (2010) 15.00.2 x 2.50.2 x 0.650.1524.30.75W70125100 (101M), 200 (19.76), 400 (1.02M5.6M)101M, 1.02M10M4,000
W3A (2512) 16.30.2 x 3.10.237.11W70125100 (101M), 200 (19.76), 400 (1.02M5.6M)101M, 1.02M10M200V (500V5)400V (500V5)4,000
W3A2 (2512) 12W95100 (101M), 200 (19.76), 400 (1.02M5.6M)101M, 1.02M10M200V400V4,000

Note: 1 Also available for RK73H 2H, 3A and 3A2 (different d dimensions = 0.4 +0.2 0.1 mm). 4 Nominal resistance value for RK73H1F (F:1%) and RK73H1H (1R9.1, 1MR10M) is E24. 5 Please consult for Max. working voltage and Max. overload voltage in parentheses.

Performance

Test ItemsPerformance Requirements (R(+0.1 ))Test Methods
ResistanceWithin specified tolerance
Resistance Temperature Coefficient (T.C.R.)Within specified T.C.R.
Overload (Short time)1: 1F, 0.5: another (Rated voltage 2.5 for 5s; 1E, 2B, W3A2: Rated voltage 2 for 5s)
Resistance to soldering heat1: 1FW3A (10R1M), 3: 1HW3A (R1M)2605, 10s1s
Rapid change of temperature1: 1F, 0.5: another-55 (30min.) /+125 (30min.), 100 cycles
Moisture resistance2: 1J, 2A, 2B, 3: another402, 90%95%RH, 1000h (1.5h ON/0.5h OFF cycle)
Endurance at 702: 1J, 2A, 2B, 3: another702, 1000h (1.5h ON/0.5h OFF cycle)
High temperature exposure1, 0.5: 1F, 0.3: another+125, 1000h: 1F; +155, 1000h: 1H,1E, 1J, 2A, 2B, 2E, W2H, W3A, W3A2

Note: Typical values for Resistance to soldering heat: 0.5: 1FW3A (10R1M), 1: 1HW3A (R1M). Typical values for Rapid change of temperature: 0.5: 1F, 0.3: another. Typical values for Moisture resistance: 0.75: 1J, 2A, 2B, 1: another. Typical values for Endurance at 70: 0.75: 1J, 2A, 2B, 1: another. Typical values for High temperature exposure: 0.5: 1F, 0.3: another.

Precautions for Use

The alumina substrate of chip resistors may lead to solder cracks at the connection due to thermal stress from differences in thermal expansion coefficients with the mounting board. This is particularly true for larger sizes (W2H/W3A/W3A2) which have greater thermal expansion and self-heating. Cracks can occur when ambient temperature changes significantly or when load is repeatedly switched ON/OFF. While types 1F to 2E are less prone to cracking in general temperature cycle tests on FR-4 boards, W2H/W3A/W3A2 types tend to crack more easily. The occurrence of cracks due to thermal stress depends on factors like pad size, solder amount, and PCB heat dissipation. Therefore, careful design is required for applications with significant ambient temperature variations or load ON/OFF cycles. RK73H1F resistors may be damaged by static electricity generated during equipment assembly. Please exercise caution.


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Company Beijing Silk Road Enterprise Management Services Co., Ltd.
Location 16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person Sellina

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