Molding SMD Power Inductor LanTu Micro SMS0650-330MT with Low Loss Alloy Powder Die Casting Material
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Product Description
Molding SMD Power Inductors - SMS0650 Series
Product Overview
The SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. SMS0650 Series is an ultra-high current, thin-profile SMD power inductor designed for high-density installations. Featuring magnetic shielding for strong anti-electromagnetic interference, these inductors offer high reliability through an integral construction, providing excellent vibration resistance and ultra-low buzz noise due to their composite structure. They are manufactured using low-loss alloy powder die-casting, resulting in low impedance, small parasitic capacitance, high efficiency, and reduced eddy-current loss. Capable of operating at frequencies up to 3MHz, these inductors are suitable for a wide range of applications including PDA, notebook, desktop, server applications, high current POL converters, battery-powered devices, and DC/DC converters in distributed power systems.
Product Attributes
- Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
- Series: SMS0650
- Type: Molding SMD Power Inductor
- Certifications: RoHS, Halogen Free, REACH Compliance
- Origin: Shenzhen, China
Technical Specifications
General Specifications
| Parameter | Value |
|---|---|
| Operating Temperature | -55 to +125 (Including coil self-temperature rise) |
| Maximum Voltage | 30VDC |
| Frequency Range | Up to 3MHz |
| External Dimensions (LWH) | 7.16.65.0 mm |
Electrical Characteristics (at 25)
| Part No. | Inductance (H) @ 100KHz, 1.0V | Tolerance | DCR (m) Typical | DCR (m) Max | Saturation Current (A) Typical | Heat Rating Current (A) Typical |
|---|---|---|---|---|---|---|
| SMS0650-R22M | 0.22 | 20% | 1.1 | 1.3 | 40.00 | 30.00 |
| SMS0650-R47M | 0.47 | 20% | 3.2 | 3.8 | 24.00 | 20.00 |
| SMS0650-R56M | 0.56 | 20% | 3.4 | 3.9 | 20.00 | 18.00 |
| SMS0650-R68M | 0.68 | 20% | 3.9 | 4.2 | 17.00 | 17.50 |
| SMS0650-R82M | 0.82 | 20% | 4.6 | 4.9 | 17.00 | 17.00 |
| SMS0650-1R0M | 1.00 | 20% | 6.5 | 8.5 | 16.50 | 13.00 |
| SMS0650-1R5M | 1.50 | 20% | 7.0 | 10.0 | 12.70 | 12.00 |
| SMS0650-2R2M | 2.20 | 20% | 11.2 | 13.6 | 12.50 | 11.00 |
| SMS0650-3R3M | 3.30 | 20% | 20.0 | 22.0 | 9.00 | 8.50 |
| SMS0650-4R7M | 4.70 | 20% | 26.0 | 30.0 | 8.00 | 6.70 |
| SMS0650-5R6M | 5.60 | 20% | 31.0 | 36.0 | 7.60 | 5.80 |
| SMS0650-6R8M | 6.80 | 20% | 36.5 | 41.0 | 7.30 | 5.50 |
| SMS0650-100M | 10.00 | 20% | 48.0 | 55.0 | 5.50 | 4.70 |
| SMS0650-150M | 15.00 | 20% | 77.0 | 85.0 | 5.00 | 4.00 |
| SMS0650-220M | 22.00 | 20% | 125.0 | 140.0 | 4.00 | 3.20 |
| SMS0650-330M | 33.00 | 20% | 150.0 | 200.0 | 3.30 | 2.80 |
| SMS0650-470M | 47.00 | 20% | 260.0 | 300.0 | 2.80 | 2.20 |
| SMS0650-680M | 68.00 | 20% | 340.0 | 442.0 | 2.20 | 1.80 |
| SMS0650-101M | 100.00 | 20% | 595.0 | 720.0 | 2.00 | 1.50 |
Inductance Tolerance Codes
| Code | Tolerance |
|---|---|
| J | 5% |
| K | 10% |
| L | 15% |
| M | 20% |
| P | 25% |
| N | 30% |
Shape and Dimensions (mm)
| Part No. | A | B | C (Max) | D (Typ) | E (Typ) | F | G | H |
|---|---|---|---|---|---|---|---|---|
| SMS0650 | 7.100.30 | 6.600.20 | 5.00 | 3.00 | 1.60 | 3.70 | 8.40 | 3.50 |
Packaging Options
| Packing Type | Description |
|---|---|
| Bulk | |
| Tape & Reel |
Test Equipment Used
| Parameter Tested | Equipment |
|---|---|
| Inductance (L) | WK3260B LCR meter or equivalent |
| Saturation Current (Isat) & Heat Rating Current (Irms) | WK3260B+WK3265B or equivalent |
| DC Resistance (DCR) | Chroma 16502 or equivalent |
Definitions
- Saturation Current: DC current at which inductance drops 30% from its value without current.
- Heat Rating Current: The actual value of DC current when the temperature rise is T 40 (Ta=25).
- Rated DC Current: The lesser value between Isat and Irms.
Reminders for Using These Products
- Storage: Within 12 months, under conditions of 5~40C and 35~65% RH. Terminal solderability may deteriorate beyond this period.
- Environment: Avoid use and storage in corrosive gas environments (salt, acid, alkali, etc.).
- Handling: Avoid direct contact with terminals by bare hands due to oil secretions that can inhibit soldering. Handle products carefully to prevent damage.
- Terminal Bending: Do not excessively bend terminals to avoid wire fracture.
- Cleaning: Do not rinse coils. Contact the manufacturer if cleaning is necessary.
- Magnetic Fields: Do not expose products to magnets or strong magnetic fields.
- Preheating: Preheat components before soldering. The temperature difference between solder and chip temperature should not exceed 150C.
- Soldering Corrections: Post-mounting soldering corrections must be within specified conditions. Overheating can cause short circuits, performance degradation, or reduced lifespan.
- Thermal Design: Account for self-heating when power is applied; ensure sufficient thermal design margin.
- Non-Magnetic Shield Type: Careful coil placement is required in PCB design to prevent malfunctions due to magnetic interference.
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina