Power Inductors Featuring LanTu Micro STC303020-4R7MT T Core Molding Structure for High Current Handling
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Delivery Time:
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Product Description
Product Overview
The LANTU STC303020 series T-core molding structure power inductors are designed for high-density installation with excellent anti-electromagnetic interference capabilities. These thin-profile inductors offer low DC resistance and ultra-high current handling, making them ideal for high switching frequencies. Their T-core molding structure ensures high reliability and superior vibration resistance. They are compliant with RoHS, Halogen Free, and REACH standards.
Product Attributes
- Brand: LANTU
- Origin: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
- Certifications: RoHS, Halogen Free, REACH Compliance
- Structure Type: T-core molding Structure
- Shielding: Magnetic shielding type
Technical Specifications
General Specifications
| Attribute | Value |
|---|---|
| Operating Temperature | -40 to +125 (Including coils self-temperature rise) |
| Test Equipment - Inductance | WK3260B LCR meter or equivalent |
| Test Equipment - Current | WK3260B+WK3265B or equivalent |
| Test Equipment - DCR | Chroma 16502 or equivalent |
Product Identification
Model Format: STC 303020 - 1R0 M T
- Type: STC (T-core molding Structure Power Inductors)
- Inductance: e.g., 1.0 uH
- External Dimensions (LWH): e.g., 303020 (3.03.02.0 mm)
- Inductance Tolerance: J:5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30%
- Packing: B (Bulk Package), T (Tape & Reel)
Electrical Characteristics (STC303020 Series)
| Part No | Inductance (H) | Tol. | DCR (m) Typical | DCR (m) Max | Saturation Current (A) Typical | Saturation Current (A) Max | Heat Rating Current (A) Typical | Heat Rating Current (A) Max |
|---|---|---|---|---|---|---|---|---|
| STC303020-1R0M | 1.0 | 20% | 14 | 20 | 8.0 | 7.3 | 6.5 | 6.0 |
| STC303020-1R5M | 1.5 | 20% | 19 | 25 | 7.0 | 6.5 | 6.3 | 5.8 |
| STC201612-2R2M | 2.2 | 20% | 37 | 45 | 6.0 | 5.5 | 4.7 | 4.3 |
| STC201612-3R3M | 3.3 | 20% | 52 | 63 | 5.9 | 5.4 | 4.5 | 4.0 |
| STC201612-4R7M | 4.7 | 20% | 60 | 73 | 4.8 | 4.0 | 4.2 | 3.8 |
| STC201612-6R8M | 6.8 | 20% | 107 | 135 | 4.5 | 3.8 | 3.2 | 3.0 |
| STC201612-100M | 10 | 20% | 135 | 160 | 3.8 | 3.3 | 2.5 | 2.2 |
Note: Saturation Current: DC current at which inductance drops 30% from its value without current. Heat Rating Current: the actual value of DC current when the temperature rise is T 40 (Ta=25). Rated DC Current: The less value which is Isat or Irms.
Shape and Dimensions
| Part No | A (mm) | B (mm) | C (mm) | D (mm) | E (mm) | F (mm) | H (mm) |
|---|---|---|---|---|---|---|---|
| STC303020 | 3.00.1 | 3.00.1 | 2.0Max | 1.00.2 | 3.0Typ | 0.8Typ | 3.0Typ |
Applications
- DC/DC converter for CPU in Notebook PC
- Phones, tablets, HDDs, DVCs, PDAs, 5G modules
- Server, base station, etc.
- Various DC-DC conversion power modules
Reliability Testing Summary
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Terminal Strength | Meet requirements without any loose terminal | Pulling test (SMT/DIP), Solder paste thickness, Terminal diameter based force application |
| Resistance to Flexure | No visible mechanical damage | Flexure: 2mm, Speed: 0.5mm/sec, Keep time: 30 sec |
| Dropping | No case deformation or change in appearance. No short and no open. | Drop packaged products from 1m high (1 angle, 3 ridges, 6 surfaces, twice each direction) |
| Solderability | Wetting shall exceed 75% coverage. Terminals must have 95% minimum solder coverage. | Solder temperature: 2402, Duration: 3 sec |
| Vibration | Inductance change: Within 10%. Q factor change: Within 20%. | Amplitude 1.5mm, Frequency 10-55 Hz (1 min cycle), 2 hours per direction (3 directions) |
| Thermal Shock | Inductance change: Within 10%. Q factor change: Within 20%. | 100 cycles (-55~40 to 85~125), Transforming interval Max. 20 sec |
| Low temperature Storage | Inductance change: Within 10%. Q factor change: Within 20%. | Temperature: -55~-402, Duration: 962 hours |
| High temperature Storage | Inductance change: Within 10%. Q factor change: Within 20%. | Temperature: 85~1252, Duration: 962 hours |
| Damp Heat (Steady States) | Inductance change: Within 10%. Q factor change: Within 20%. | Temperature: 602, Humidity: 90% to 95% RH, Duration: 962 hours |
| Heat endurance of Reflow soldering | L/L10%. Q/Q30% (SMD series only). DCR/DCR10%. | Peak temperature: 260+0/-5 (twice) |
| Resistance to solvent test | No case deformation or change in appearance or obliteration of marking | Dip in IPA solvent for 50.5Min, dry 5Min, brushing 10 times |
| Overload test | No smoke, no peculiar smell, no fire. Characteristics normal after test. | Apply twice rated current for 5 minutes. |
| Voltage resistance test | No breakdown. Characteristics normal after test. | DC1000V, Current: 1mA, Time: 1Min. |
Recommended Reflow Soldering Curve
The recommended reflow conditions are set according to LANTU's soldering equipment. Users should adjust and confirm according to their specific environment/equipment.
Reminders for Using These Products
- Storage: Within 12 months, temperature: 5~40C, humidity: 35~65% RH or less.
- Environment: Avoid gas corrosive environments (salt, acid, alkali, etc.).
- Handling: Avoid touching terminals directly with bare hands. Handle carefully to prevent damage. Do not bend terminals excessively.
- Cleaning: Do not rinse coils. Contact LANTU if cleaning is necessary.
- Magnetic Fields: Do not expose to magnets or magnetic fields.
- Preheating: Preheat components before soldering. Temperature difference between solder and chip should not exceed 150C.
- Soldering Corrections: Perform within specified conditions. Overheating may cause short circuits, performance degradation, or reduced lifespan.
- Thermal Design: Account for self-heating when power is on.
- Non-magnetic Shield Type: Careful layout is needed to avoid malfunction due to magnetic interference.
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina