High reliability power inductors LanTu Micro STC303020-3R3MT with T core molding structure and ultra high current capability
Product Overview
The STC303020 series T-core molding structure power inductors from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are designed for high-density mounting with excellent anti-electromagnetic interference due to their magnetic shielding. These thin-profile inductors feature low DC resistance and ultra-high current capabilities, making them ideal for high switching frequencies. Their T-core molding structure ensures high reliability and superior vibration resistance. They are compliant with RoHS, Halogen Free, and REACH standards.
Product Attributes
- Brand: LANTU
- Origin: SHENZHEN, CHINA
- Product Type: T-core molding Structure Power Inductors
- Certifications: RoHS, Halogen Free, REACH Compliance
Technical Specifications
General Specifications
| Attribute | Value |
|---|---|
| Operating Temperature | -40 to +125 (Including coils self-temperature rise) |
| Test Equipment - Inductance | WK3260B LCR meter or equivalent |
| Test Equipment - Current | WK3260B+WK3265B or equivalent |
| Test Equipment - DCR | Chroma 16502 or equivalent |
Product Identification
Format: STC 303020 1R0 M T
- Type: STC (T-CORE molding Structure Power Inductors)
- Inductance: e.g., 1.0 uH
- External Dimensions (LWH) (mm): e.g., 303020 (3.03.02.0)
- Inductance Tolerance: J:5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30%
- Packing: B (Bulk Package), T (Tape & Reel)
Appearance Dimensions (STC303020)
| Part No | A (mm) | B (mm) | C (mm) | D (mm) | E (mm) | F (mm) | H (mm) |
|---|---|---|---|---|---|---|---|
| STC303020 | 3.00.1 | 3.00.1 | 2.0Max | 1.00.2 | 3.0Typ | 0.8Typ | 3.0Typ |
Electrical Characteristics (STC303020 Series)
| Part No | Inductance (H) | Tol. | DCR (m) | Saturation Current (A) | Heat Rating Current (A) | |||
|---|---|---|---|---|---|---|---|---|
| @ 1MHz, 1.0V | Typical | Max | Typical | Max | Typical | Max | ||
| STC303020-1R0M | 1.0 | 20% | 14 | 20 | 8.0 | 7.3 | 6.5 | 6.0 |
| STC303020-1R5M | 1.5 | 20% | 19 | 25 | 7.0 | 6.5 | 6.3 | 5.8 |
| STC303020-2R2M | 2.2 | 20% | 37 | 45 | 6.0 | 5.5 | 4.7 | 4.3 |
| STC303020-3R3M | 3.3 | 20% | 52 | 63 | 5.9 | 5.4 | 4.5 | 4.0 |
| STC303020-4R7M | 4.7 | 20% | 60 | 73 | 4.8 | 4.0 | 4.2 | 3.8 |
| STC303020-6R8M | 6.8 | 20% | 107 | 135 | 4.5 | 3.8 | 3.2 | 3.0 |
| STC303020-100M | 10 | 20% | 135 | 160 | 3.8 | 3.3 | 2.5 | 2.2 |
Definitions:
- Saturation Current: DC current at which inductance drops 30% from its value without current.
- Heat Rating Current: The actual value of DC current when the temperature rise is T 40 (Ta=25).
- Rated DC Current: The lesser value of Isat or Irms.
- Special remind: Circuit design, component, PCB trace size and thickness, airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.
Applications
- DC/DC converters for CPU in Notebook PCs
- Phones, tablets, HDDs, DVCs, PDAs, 5G modules
- Servers, base stations, etc.
- Various DC-DC conversion power modules
Reliability Testing Summary
| Test Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Terminal Strength (SMT/DIP) | Meet requirements without loose terminal | Pulling test, Solder paste thickness, Terminal diameter and applied force |
| Resistance to Flexure | No visible mechanical damage | Flexure: 2mm, Speed: 0.5mm/sec, Keep time: 30 sec |
| Dropping | No case deformation or change in appearance; No short and no open | Drop from 1m high in 1 angle, 3 ridges and 6 surfaces, twice in each direction |
| Solderability | Wetting shall exceed 75% coverage; Terminals must have 95% minimum solder coverage | Solder temperature: 2402, Duration: 3 sec |
| Vibration | No visible mechanical damage; Inductance change: Within 10%; Q factor change: Within 20% | Frequency 10-55 Hz, Amplitude 1.5mm, 2 hours in each 3 perpendicular directions |
| Thermal Shock | No visible mechanical damage; Inductance change: Within 10%; Q factor change: Within 20% | 100 cycles of temperature change (-55~40 to 85~125) |
| Low temperature Storage | No visible mechanical damage; Inductance change: Within 10%; Q factor change: Within 20% | Temperature: -55~-402, Duration: 962 hours |
| High temperature Storage | No visible mechanical damage; Inductance change: Within 10%; Q factor change: Within 20% | Temperature: 85~1252, Duration: 962 hours |
| Damp Heat (Steady States) | No visible mechanical damage; Inductance change: Within 10%; Q factor change: Within 20% | Temperature: 602, Humidity: 90% to 95% RH, Duration: 962 hours |
| Heat endurance of Reflow soldering | No significant defects in appearance; L/L10%; Q/Q30%; DCR/DCR10% | Peak temperature: 260+0/-5, twice reflow |
| Resistance to solvent test | No case deformation or change in appearance or obliteration of marking | Dip into IPA solvent, dry, and brush 10 times |
| Overload test | No smoke, no peculiar smell, no fire; Characteristics normal after test | Apply twice rated current for 5 minutes |
| Voltage resistance test | No breakdown; Characteristics normal after test | DC1000V, Current: 1mA, Time: 1Min |
Recommended Reflow Soldering Curve
Refer to the provided graph for recommended reflow conditions. Adjustments may be necessary based on specific user environments and equipment.
Reminders for Using These Products
- Storage: Within 12 months, temperature 5~40C, humidity 35~66% RH.
- Environment: Avoid gas corrosive environments (salt, acid, alkali, etc.).
- Handling: Avoid direct contact with terminals due to hand oils. Handle carefully to prevent damage.
- Terminal Bending: Do not bend terminals excessively to avoid wire fracture.
- Cleaning: Do not rinse coils; contact the manufacturer if cleaning is necessary.
- Magnetic Fields: Do not expose to magnets or magnetic fields.
- Preheating: Preheat components before soldering. Temperature difference between solder and chip should not exceed 150C.
- Soldering Corrections: Perform within specified conditions to avoid short circuits, performance degradation, or reduced lifespan.
- Thermal Design: Account for self-heating when power is on.
- Non-magnetic Shield Type: Careful layout is required on the PCB to prevent malfunction due to magnetic interference.
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