Beijing Silk Road Enterprise Management Services Co., Ltd.
                                                                                                           
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axial fixed inductors LanTu Micro AL0307-821K with epoxy resin coating and automated tape packaging

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Product Description

Axial Fixed Inductors - AL0307 Series

Product Overview

The AL0307 Series Axial Fixed Inductors from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are designed for high-performance RF applications. Featuring an epoxy resin coating for enhanced humidity resistance and longevity, these inductors offer a wide inductance range in a compact, lightweight design. They are engineered for high Q factors and self-resonant frequencies, making them ideal for automated insertion processes due to their tape packaging. These inductors are RoHS, Halogen Free, and REACH compliant, suitable for a variety of electronic products including televisions, personal computers, radios, telephones, and chargers.

Product Attributes

  • Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
  • Series: AL0307 Series
  • Type: Axial Fixed Inductors
  • Coating: Epoxy resin
  • Certifications: RoHS, Halogen Free, REACH Compliance
  • Packaging Options: Bulk Package (B), Tape Packaging (TF)

Technical Specifications

General Specifications:

Attribute Value
Operating Temperature -25 to +85 (Including coil self-temperature rise)
External Dimensions (LH) 3.27.62 mm (for 0307 size)

Product Identification: AL 0307 [Inductance] [Tolerance] [Packing]

  • Inductance Tolerance: J: 5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30%

Electrical Characteristics (at 25):

Part No Inductance (H) Tolerance Q Min @ Test Freq. (MHz) SRF Min (MHz) DCR Max () Rated Current Max (mA)
AL0307-1R0M 1.0 20% 40 @ 25.2 150 0.15 740
AL0307-1R2M 1.2 20% 40 @ 7.96 150 0.18 740
AL0307-1R5M 1.5 20% 40 @ 7.96 150 0.20 700
AL0307-1R8M 1.8 20% 50 @ 7.96 125 0.23 655
AL0307-2R2M 2.2 20% 50 @ 7.96 110 0.27 630
AL0307-2R7M 2.7 20% 50 @ 7.96 95 0.28 595
AL0307-3R3M 3.3 20% 50 @ 7.96 70 0.30 575
AL0307-3R9M 3.9 20% 50 @ 7.96 65 0.32 555
AL0307-4R7M 4.7 20% 50 @ 7.96 36 0.35 530
AL0307-5R6M 5.6 20% 50 @ 7.96 32 0.40 500
AL0307-6R8M 6.8 20% 50 @ 7.96 28 0.48 470
AL0307-8R2M 8.2 20% 50 @ 7.96 23 0.56 425
AL0307-100K 10 10% 50 @ 7.96 18 0.75 370
AL0307-120K 12 10% 50 @ 2.52 17 0.80 350
AL0307-150K 15 10% 50 @ 2.52 16 0.93 335
AL0307-180K 18 10% 50 @ 2.52 15 1.00 315
AL0307-220K 22 10% 50 @ 2.52 13 1.20 285
AL0307-270K 27 10% 50 @ 2.52 11 1.80 270
AL0307-330K 33 10% 50 @ 2.52 10 2.20 255
AL0307-390K 39 10% 50 @ 2.52 9.5 2.30 240
AL0307-470K 47 10% 50 @ 2.52 8.5 2.60 205
AL0307-560K 56 10% 50 @ 2.52 7.5 2.90 195
AL0307-680K 68 10% 50 @ 2.52 6.5 3.30 185
AL0307-820K 82 10% 50 @ 2.52 6.0 3.80 175
AL0307-101K 100 10% 50 @ 2.52 5.5 4.20 165
AL0307-121K 120 10% 50 @ 0.796 5.4 4.70 160
AL0307-151K 150 10% 50 @ 0.796 4.7 5.40 150
AL0307-181K 180 10% 50 @ 0.796 4.3 6.00 140
AL0307-221K 220 10% 60 @ 0.796 4.0 7.00 130
AL0307-271K 270 10% 60 @ 0.796 3.7 7.70 120
AL0307-331K 330 10% 60 @ 0.796 3.4 11.1 100
AL0307-391K 390 10% 60 @ 0.796 2.8 12.6 95
AL0307-471K 470 10% 60 @ 0.796 2.5 14.0 90
AL0307-561K 560 10% 60 @ 0.796 2.3 15.5 85
AL0307-681K 680 10% 60 @ 0.796 2.0 25.3 75
AL0307-821K 820 10% 60 @ 0.796 1.5 27.5 65
AL0307-102K 1000 10% 50 @ 0.796 1.2 31.4 60

Current Definitions:

  • Saturation Current (Isat): Current at which inductance drops by 10% from its initial value (Ta=25).
  • Temperature Rise Current (Irms): DC current causing a temperature rise of T 40 (Ta=25).
  • Rated DC Current: The lower value of Isat or Irms.

Packaging:

Series Type Packaging Quantity (pcs) Carton Size (mm) (LWH) Parts/Box Parts/Reel Parts/Carton
T5A Tape and Reel 3000 440275392 - - 72,000

Reliability Testing:

Item Requirements Test Methods and Remarks
Terminal Strength (SMT/DIP) Meet requirements without loose terminals Pulling test, Solder paste thickness, Force and duration based on terminal size (GB/T 2423.60-2008)
Resistance to Flexure No visible mechanical damage Flexure: 2mm, Speed: 0.5mm/s, Keep time: 30s (JIS C 5321:1997)
Dropping No case deformation, no short/open circuits Drop from 1m height, 1 angle, 3 ridges, 6 surfaces, twice each direction (GB/T 2423.7-2018)
Solderability Min 95% solder coverage on terminals, >75% wetting Solder temp: 2402, Duration: 3s, Solder: Sn/3.0Ag/0.5Cu (GB/T 2423.28-2005)
Vibration Inductance change: 10%, Q factor change: 20% 10-55 Hz, 1.5mm amplitude, 2 hours per direction (GB/T 2423.10-2019)
Thermal Shock Inductance change: 10%, Q factor change: 20% 100 cycles of -55~40 to 85~125 (GB/T 2423.22-2012 Method Na)
Low Temperature Storage Inductance change: 10%, Q factor change: 20% -55~-402 for 962 hours (GB/T 2423.1-2008 Method Ab)
High Temperature Storage Inductance change: 10%, Q factor change: 20% 125~852 for 962 hours (GB/T 2423.2-2008 Method Bb)
Damp Heat (Steady States) Inductance change: 10%, Q factor change: 20% 602, 90-95% RH for 962 hours (GB/T 2423.3-2016)
Heat endurance of Reflow soldering L/L10%, Q/Q30%, DCR/DCR10% Peak temp: 260+0/-5, twice (GJB 360B-2009)
Resistance to solvent test No case deformation, appearance change, or marking obliteration Dip in IPA solvent for 5min, dry 5min, brush 10 times (IAL 68-2-45:1993)
Overload test No smoke, peculiar smell, fire; characteristics normal after test Apply twice rated current for 5 minutes (JIS C5311-6.13)
Voltage resistance test No breakdown; characteristics normal after test DC1000V, Current: 1mA, Time: 1Min (MIL-STD-202G Method 301)

Recommended Lead-free Wave Soldering Curve (DIP-Type):

Refer to manufacturer's recommendations and adjust based on user environment/equipment.

Soldering Iron (Rework):

  • Max temperature: 350C, max 3 times.
  • Avoid direct contact with the inductor body and wire.
  • Hand soldering is not recommended.

Reminders for Using These Products:

  • Storage: Within 12 months, at 5-40C and 35-65% RH. Solderability may deteriorate after storage.
  • Environment: Avoid gas corrosive environments (salt, acid, alkali).
  • Handling: Avoid touching terminals directly with bare hands. Handle carefully to prevent damage from dropping. Do not excessively bend terminals.
  • Cleaning: Do not rinse coils; contact manufacturer if cleaning is necessary.
  • Magnetism: Keep away from magnets or magnetic fields.
  • Preheating: Preheat components before soldering; temperature difference between solder and chip should not exceed 150C.
  • Soldering Correction: Perform within specified conditions; overheating can cause issues.
  • Self-heating: Account for self-heating in thermal design.
  • Layout: For non-magnetic shield types, careful PCB layout is needed to avoid malfunction due to magnetic interference.

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Beijing Silk Road Enterprise Management Services Co., Ltd.
Location 16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person Sellina

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