Epoxy resin coated axial fixed inductors LanTu Micro AL0307-6R8M ideal for televisions and computers
Axial Fixed Inductors - AL0307 Series
Product Overview
The AL0307 Series Axial Fixed Inductors are designed for RF applications, offering a wide inductance range in a compact, lightweight package. Featuring epoxy resin coating for humidity resistance and long life, these inductors provide high Q and self-resonant frequencies. They are suitable for automated insertion processes and comply with RoHS, Halogen Free, and REACH standards. Applications include televisions, personal computers, radios, telephones, chargers, and other electronic products.
Product Attributes
- Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
- Product Type: Axial Fixed Inductors
- Series: AL0307
- Coating: Epoxy resin
- Certifications: RoHS, Halogen Free, REACH Compliance
- Packaging Options: Tape packaging for auto-insertion, Bulk Package
Technical Specifications
Environmental Data:
- Operating Temperature: -25 to +85 (Including coil self-temperature rise)
Dimensions:
| Part No | External Dimensions (LH) (mm) | Type |
|---|---|---|
| AL0307 | 3.27.62 | Axial Fixed Inductors |
Product Identification: AL 0307 [Inductance] [Tolerance] [Packing]
- Inductance Tolerance: J: 5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30%
- Packing: B (Bulk Package), TF (Tape)
Electrical Characteristics:
| Part No | Inductance (H) | Tolerance | Q Min @ Test Freq. (MHz) | SRF Min (MHz) | DCR Max () | Rated Current Max (mA) |
|---|---|---|---|---|---|---|
| AL0307-1R0M | 1.0 | 20% | 40 @ 25.2MHZ | 150 | 0.15 | 740 |
| AL0307-1R2M | 1.2 | 20% | 40 @ 7.96MHZ | 150 | 0.18 | 740 |
| AL0307-1R5M | 1.5 | 20% | 40 @ 7.96MHZ | 150 | 0.20 | 700 |
| AL0307-1R8M | 1.8 | 20% | 50 @ 7.96MHZ | 125 | 0.23 | 655 |
| AL0307-2R2M | 2.2 | 20% | 50 @ 7.96MHZ | 110 | 0.27 | 630 |
| AL0307-2R7M | 2.7 | 20% | 50 @ 7.96MHZ | 95 | 0.28 | 595 |
| AL0307-3R3M | 3.3 | 20% | 50 @ 7.96MHZ | 70 | 0.30 | 575 |
| AL0307-3R9M | 3.9 | 20% | 50 @ 7.96MHZ | 65 | 0.32 | 555 |
| AL0307-4R7M | 4.7 | 20% | 50 @ 7.96MHZ | 36 | 0.35 | 530 |
| AL0307-5R6M | 5.6 | 20% | 50 @ 7.96MHZ | 32 | 0.40 | 500 |
| AL0307-6R8M | 6.8 | 20% | 50 @ 7.96MHZ | 28 | 0.48 | 470 |
| AL0307-8R2M | 8.2 | 20% | 50 @ 7.96MHZ | 23 | 0.56 | 425 |
| AL0307-100K | 10 | 10% | 50 @ 7.96MHZ | 18 | 0.75 | 370 |
| AL0307-120K | 12 | 10% | 50 @ 2.52MHZ | 17 | 0.80 | 350 |
| AL0307-150K | 15 | 10% | 50 @ 2.52MHZ | 16 | 0.93 | 335 |
| AL0307-180K | 18 | 10% | 50 @ 2.52MHZ | 15 | 1.00 | 315 |
| AL0307-220K | 22 | 10% | 50 @ 2.52MHZ | 13 | 1.20 | 285 |
| AL0307-270K | 27 | 10% | 50 @ 2.52MHZ | 11 | 1.80 | 270 |
| AL0307-330K | 33 | 10% | 50 @ 2.52MHZ | 10 | 2.20 | 255 |
| AL0307-390K | 39 | 10% | 50 @ 2.52MHZ | 9.5 | 2.30 | 240 |
| AL0307-470K | 47 | 10% | 50 @ 2.52MHZ | 8.5 | 2.60 | 205 |
| AL0307-560K | 56 | 10% | 50 @ 2.52MHZ | 7.5 | 2.90 | 195 |
| AL0307-680K | 68 | 10% | 50 @ 2.52MHZ | 6.5 | 3.30 | 185 |
| AL0307-820K | 82 | 10% | 50 @ 2.52MHZ | 6.0 | 3.80 | 175 |
| AL0307-101K | 100 | 10% | 50 @ 2.52MHZ | 5.5 | 4.20 | 165 |
| AL0307-121K | 120 | 10% | 50 @ 0.796 MHZ | 5.4 | 4.70 | 160 |
| AL0307-151K | 150 | 10% | 50 @ 0.796 MHZ | 4.7 | 5.40 | 150 |
| AL0307-181K | 180 | 10% | 50 @ 0.796 MHZ | 4.3 | 6.00 | 140 |
| AL0307-221K | 220 | 10% | 60 @ 0.796 MHZ | 4.0 | 7.00 | 130 |
| AL0307-271K | 270 | 10% | 60 @ 0.796 MHZ | 3.7 | 7.70 | 120 |
| AL0307-331K | 330 | 10% | 60 @ 0.796 MHZ | 3.4 | 11.1 | 100 |
| AL0307-391K | 390 | 10% | 60 @ 0.796 MHZ | 2.8 | 12.6 | 95 |
| AL0307-471K | 470 | 10% | 60 @ 0.796 MHZ | 2.5 | 14.0 | 90 |
| AL0307-561K | 560 | 10% | 60 @ 0.796 MHZ | 2.3 | 15.5 | 85 |
| AL0307-681K | 680 | 10% | 60 @ 0.796 MHZ | 2.0 | 25.3 | 75 |
| AL0307-821K | 820 | 10% | 60 @ 0.796 MHZ | 1.5 | 27.5 | 65 |
| AL0307-102K | 1000 | 10% | 50 @ 0.796 MHZ | 1.2 | 31.4 | 60 |
Current Definitions:
- Saturation Current (Isat): Current at which inductance becomes 10% lower than its initial value (Ta=25).
- Temperature Rise Current (Irms): Actual DC current when temperature rise is T 40 (Ta=25).
- Rated DC Current: The lesser value between Isat and Irms.
Packaging Specifications:
| Series Type | Packaging | Quantity (pcs) | Carton Size (mm) LWH | Parts/Box | Parts/Reel | Parts/Carton |
|---|---|---|---|---|---|---|
| T5A | Tape and reel | 3000 | 440275392 | (Not specified) | (Not specified) | 72,000 |
Reliability Testing:
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Terminal Strength (SMT/DIP) | Meet requirements without any loose terminal. | Defined pulling forces based on terminal cross-sectional area or diameter, duration 10s. Solder paste thickness: 0.12mm (SMT). |
| Resistance to Flexure | No visible mechanical damage. | Flexure: 2mm. Pressurizing Speed: 0.5mm/s. Keep time: 30s. |
| Dropping | No case deformation or change in appearance. No short and no open. | Drop packaged products from 1m high in 1 angle, 3 ridges and 6 surfaces, twice in each direction. |
| Solderability | Terminals must have 95% minimum solder coverage. Wetting shall exceed 75% coverage. | Solder temperature: 2402. Duration: 3s. Solder: Sn/3.0Ag/0.5Cu. Flux: 25% Resin and 75% ethanol. |
| Vibration | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Frequency varied between 10 and 55 Hz, traversed in 1 minute. Applied for 2 hours in each of 3 mutually perpendicular directions (total 6 hours). |
| Thermal Shock | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | 100 cycles of temperature shock between (85~125) and (-55~40). Transforming interval: Max. 20s. |
| Low temperature Storage | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Temperature: -55~-402. Duration: 962 hours. |
| High temperature Storage | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Temperature: 125~852. Duration: 962 hours. |
| Damp Heat (Steady States) | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Temperature: 602. Humidity: 90% to 95% RH. Duration: 962 hours. |
| Heat endurance of Reflow soldering | No significant defects in appearance. L/L10%. Q/Q30% (SMD series only). DCR/DCR10%. | Refer to reflow curve, undergo reflow twice. Peak temperature: 260+0/-5. |
| Resistance to solvent test | No case deformation or change in appearance or obliteration of marking. | Dip parts into IPA solvent for 50.5Min, dry for 5Min, then brush 10 times. |
| Overload test | During test: no smoke, no peculiar smell, no fire. Characteristics normal after test. | Apply twice rated current for 5 minutes. |
| Voltage resistance test | During test: no breakdown. Characteristics normal after test. | DC1000V, Current: 1mA, Time: 1Min. |
Recommended Lead-free Wave Soldering Curve (DIP-Type):
Refer to manufacturer's recommendations and adjust based on user's environment/equipment.
Soldering Iron (Rework):
- Use soldering iron, temperature not exceeding 350 degrees, max 3 times.
- Avoid contacting the inductor body or wire during soldering.
- Hand soldering with a soldering iron is not recommended.
Reminders for Using These Products:
- Storage: Within 12 months, under 5~40C and 35~65% RH. Deterioration of terminal solderability may occur if storage period is exceeded.
- Environment: Do not use or store in gas corrosive environments (salt, acid, alkali, etc.).
- Handling: Avoid direct contact with terminals due to hand grease affecting solderability. Handle carefully to prevent damage from dropping. Do not excessively bend terminals.
- Cleaning: Do not rinse coils; contact the manufacturer if cleaning is necessary.
- Magnetic Fields: Do not expose products to magnets or magnetic fields.
- Preheating: Preheat components before soldering; temperature difference between solder and chip should not exceed 150C.
- Soldering Correction: Perform corrections within specified conditions. Overheating may cause short circuits, performance degradation, or reduced lifespan.
- Self-heating: Account for self-heating (temperature increase) when power is on in thermal design.
- Layout: For non-magnetic shield types, careful coil placement on the PCB is required to prevent malfunctions due to magnetic interference.
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