Power Inductors Featuring LanTu Micro STC303020-1R5MT T Core Molding Structure with Magnetic Shielding
Product Overview
The LANTU STC303020 series T-core molding structure power inductors are designed for high-density installation and offer exceptional reliability and vibration resistance. Featuring a thin profile with low DC resistance and ultra-high current capabilities, these magnetically shielded inductors provide strong anti-electromagnetic interference. They are ideal for high switching frequencies due to their extremely low DCR and ultra-low AC losses. These products comply with RoHS, Halogen Free, and REACH standards, making them suitable for a wide range of demanding applications.
Product Attributes
- Brand: LANTU
- Origin: SHENZHEN
- Certifications: RoHS, Halogen Free, REACH Compliance
- Structure Type: T-core molding Structure
- Shielding: Magnetic shielding type
Technical Specifications
| Product Model | Type | Inductance (H) | Tolerance | Dimensions (LWH mm) | DCR (m) Typical | DCR (m) Max | Saturation Current (A) Typical | Saturation Current (A) Max | Heat Rating Current (A) Typical | Heat Rating Current (A) Max |
|---|---|---|---|---|---|---|---|---|---|---|
| STC303020-1R0M | STC (T-CORE) | 1.0 | 20% | 3.03.02.0 | 14 | 20 | 8.0 | 7.3 | 6.5 | 6.0 |
| STC303020-1R5M | STC (T-CORE) | 1.5 | 20% | 3.03.02.0 | 19 | 25 | 7.0 | 6.5 | 6.3 | 5.8 |
| STC201612-2R2M | STC (T-CORE) | 2.2 | 20% | 2.01.61.2 | 37 | 45 | 6.0 | 5.5 | 4.7 | 4.3 |
| STC201612-3R3M | STC (T-CORE) | 3.3 | 20% | 2.01.61.2 | 52 | 63 | 5.9 | 5.4 | 4.5 | 4.0 |
| STC201612-4R7M | STC (T-CORE) | 4.7 | 20% | 2.01.61.2 | 60 | 73 | 4.8 | 4.0 | 4.2 | 3.8 |
| STC201612-6R8M | STC (T-CORE) | 6.8 | 20% | 2.01.61.2 | 107 | 135 | 4.5 | 3.8 | 3.2 | 3.0 |
| STC201612-100M | STC (T-CORE) | 10 | 20% | 2.01.61.2 | 135 | 160 | 3.8 | 3.3 | 2.5 | 2.2 |
Applications
- DC/DC converter for CPU in Notebook PC
- Phones, tablets, HDDs, DVCs, PDAs, 5G modules
- Server, base station, etc.
- Various DC-DC conversion power modules
Environmental Data
- Operating Temperature: -40 to +125 (Including coils self-temperature rise)
Product Identification
Example: STC303020 1R0 M T
- Type: STC (T-CORE molding Structure Power Inductors)
- Inductance: e.g., 1.0 uH
- External Dimensions (LWH) (mm): e.g., 303020 (3.03.02.0)
- Inductance Tolerance: J:5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30%
- Packing: B (Bulk Package), T (Tape & Reel)
Recommended Land Pattern
Dimensions are in mm:
| Part No | A | B | C | D | E | F | H |
|---|---|---|---|---|---|---|---|
| STC303020 | 3.00.1 | 3.00.1 | 2.0Max | 1.00.2 | 3.0Typ | 0.8Typ | 3.0Typ |
Packaging Information
Tape and Reel Specifications:
| Part No. | Tape Dimension W (mm) | Tape Dimension P (mm) | Tape Dimension W1 (mm) | Reel Dimensions A (mm) | Reel Dimensions B (mm) | Reel Dimensions C (mm) | Reel Dimensions D (mm) | REEL (PCS) | Inside Box (PCS) | Outside Carton (PCS) |
|---|---|---|---|---|---|---|---|---|---|---|
| STC303020 | 12 | 8 | 5.5 | 12.8 | 100 | 13 | 330 | 3000 | 9000 | 36,000 |
Cover tape peel off condition:
- Cover tape peel force: 10 to 120g
- Noodle strip peeling angle: 165 to 180
Reliability Testing
Key tests include Terminal Strength (SMT & DIP), Resistance to Flexure, Dropping, Solderability, Vibration, Thermal Shock, Low temperature Storage, High temperature Storage, Damp Heat (Steady States), Heat endurance of Reflow soldering, Resistance to solvent test, Overload test, and Voltage resistance test. Specific requirements and test methods are detailed in the original document.
Recommended Reflow Soldering Curve
The recommended reflow conditions are provided based on LANTU's soldering equipment. Users should adjust and confirm conditions according to their specific environment and equipment.
Reminders for Using These Products
- Storage period: within 12 months under conditions (5~40C, 35~66% RH).
- Avoid use and storage in corrosive environments (salt, acid, alkali, etc.).
- Avoid direct contact with terminals by bare hands to prevent solderability issues.
- Handle products carefully to prevent damage.
- Do not bend terminals excessively.
- Do not rinse coils; contact LANTU if cleaning is necessary.
- Keep away from magnets or magnetic fields.
- Preheat components before soldering; ensure the temperature difference between solder and chip does not exceed 150C.
- Soldering corrections after mounting should be within specified conditions to avoid performance degradation.
- Account for self-heating when designing for thermal management.
- For non-magnetic shield types, careful layout is required to prevent malfunction due to magnetic interference.
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.