Molding SMD power inductor LanTu Micro SMS1360 4R7MT with strong vibration resistance and EMI protection
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Product Description
Molding SMD Power Inductors - SMS1360 Series
Product Overview
The SMS1360 Series by SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. offers ultra-high current SMD power inductors with a thin design, low DC resistance, and magnetic shielding for strong anti-electromagnetic interference. These inductors are built with an integral construction for high reliability and excellent vibration resistance, featuring a composite structure that minimizes buzz noise. They are designed for high efficiency with low loss alloy powder die-casting, resulting in low impedance and small parasitic capacitance, suitable for frequencies up to 3MHz. Ideal for demanding applications such as PDAs, notebooks, desktop and server applications, high current POL converters, battery-powered devices, and DC/DC converters in distributed power systems.
Product Attributes
- Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
- Product Type: Molding SMD Power Inductor
- Series: SMS1360
- Certifications: RoHS, Halogen Free, REACH Compliance
- Origin: China
Technical Specifications
| Item | Specification | Details | ||||
|---|---|---|---|---|---|---|
| General Features | Design | Thin design, ultra-high current, magnetic shielding | ||||
| EMI Resistance | Strong anti-electromagnetic Interference | |||||
| Construction | Integral construction for high reliability and vibration resistance | |||||
| Noise | Ultra Low buzz noise due to composite construction | |||||
| Losses | Low loss alloy powder die-casting, low impedance, small parasitic capacitance, high efficiency | |||||
| Frequency Capability | Up to 3MHz | |||||
| Electrical Ratings | Absolute Maximum Voltage | 30VDC | ||||
| Operating Temperature | -55 to +125 (Including coils self-temperature rise) | |||||
| Test Equipment | Inductance (L) | WK3260B LCR meter or equivalent | ||||
| Saturation Current (Isat) & Heat Rating Current (Irms) | WK3260B+WK3265B or equivalent | |||||
| Test Equipment | DC Resistance (DCR) | Chroma 16502 or equivalent | ||||
| Product Identification | Type | SMS (Molding SMD Power Inductor) | ||||
| Series/Dimensions | 1360 (13.812.67.0 mm) | |||||
| Inductance Value | e.g., 100 (100 uH) | |||||
| Inductance Tolerance Codes | J: 5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30% | (M typically 20% for standard parts) | ||||
| Packaging Codes | B: Bulk Package, T: Tape & Reel | |||||
| Dimensions (mm) | Overall (LWH) | 13.812.67.0 | ||||
| Land Pattern (A, B, C, D, E, F, G, H) | 13.80.50, 12.600.20, 7.00Max, 3.70 Typ, 2.50 Typ, 8.00, 14.60, 5.00 | |||||
| Electrical Characteristics (SMS1360 Series at 25) | Part No. | Inductance (L) (H) | Tol. | DCR (m) Typical | Saturation Current (Isat) Typical (A) | Heat Rating Current (Irms) Typical (A) |
| SMS1360-R68M | 0.68 | 20% | 1.4 | 1.6 | 55.00 | 33.00 |
| SMS1360-1R0M | 1.0 | 20% | 1.7 | 2.0 | 35.00 | 30.00 |
| SMS1360-2R2M | 2.2 | 20% | 3.5 | 4.2 | 25.00 | 20.00 |
| SMS1360-3R3M | 3.3 | 20% | 5.5 | 6.8 | 22.00 | 16.00 |
| SMS1360-4R7M | 4.7 | 20% | 8.0 | 9.0 | 18.00 | 13.00 |
| SMS1360-6R8M | 6.8 | 20% | 10.0 | 14.0 | 15.00 | 12.00 |
| SMS1360-8R2M | 8.2 | 20% | 13.5 | 16.0 | 14.00 | 11.00 |
| SMS1360-100M | 10 | 20% | 18.0 | 21.0 | 12.50 | 10.00 |
| SMS1360-220M | 22 | 20% | 34.0 | 38.0 | 8.00 | 6.00 |
| SMS1360-270M | 27 | 20% | 45.0 | 56.0 | 7.00 | 5.00 |
| SMS1360-330M | 33 | 20% | 56.0 | 70.0 | 6.50 | 4.50 |
| SMS1360-470M | 47 | 20% | 70.0 | 90.0 | 6.00 | 4.00 |
| SMS1360-680M | 68 | 20% | 105.0 | 125.0 | 5.00 | 3.50 |
| SMS1360-820M | 82 | 20% | 115.0 | 140.0 | 4.00 | 3.00 |
| SMS1360-101M | 100 | 20% | 130.0 | 200.0 | 3.00 | 2.50 |
| Definitions | Saturation Current | DC current at which inductance drops 30% from its value without current. | ||||
| Definitions | Heat Rating Current | The actual value of DC current when the temperature rise is T 40 (Ta=25). | ||||
| Definitions | Rated DC Current | The lesser value of Isat or Irms. | ||||
| Note on Heat | Part temperature is affected by circuit design, component, PCB trace size/thickness, airflow, and other cooling provisions. Verification in the end application is recommended. | |||||
| Packaging | Tape & Reel Specifications | Dimensions provided in mm for tape width (W), pitch (P), etc. | ||||
| Reel Dimensions | Dimensions provided in mm (A, B, C, D). | |||||
| Packing Quantity | Quantities for Reel, Inside Box, and Outside Carton specified (e.g., REEL: 500 PCS, Inside Box: 1000 PCS, Outside Carton: 4000 PCS). | |||||
| Reliability Testing | Terminal Strength | Tests for SMT and DIP terminals with specified force and duration based on terminal dimensions. | ||||
| Resistance to Flexure | Test with 2mm flexure, 0.5mm/sec speed, 30 sec hold time. No visible mechanical damage. | |||||
| Dropping | Packaged products dropped from 1m height, 1 angle, 3 ridges, 6 surfaces, twice each. No case deformation or short/open. | |||||
| Solderability | Solder temperature 2402 for 3 sec. Wetting shall exceed 75% coverage, terminals must have 95% minimum solder coverage. | |||||
| Vibration | Harmonic motion 10-55Hz, 1.5mm amplitude for 2 hours in 3 perpendicular directions. Inductance change within 10%, Q factor change within 20%. | |||||
| Thermal Shock | 100 cycles of temperature shock between specified high and low temperatures. Inductance change within 10% (Mn-Zn: 30%), Q factor change within 20%. | |||||
| Low Temperature Storage | 962 hours at -402. Inductance change within 10% (Mn-Zn: 30%), Q factor change within 20%. | |||||
| High Temperature Storage | 962 hours at 852. Inductance change within 10% (Mn-Zn: 30%), Q factor change within 20%. | |||||
| Damp Heat (Steady States) | 962 hours at 602 and 90%-95% RH. Inductance change within 10% (Mn-Zn: 30%), Q factor change within 20%. | |||||
| Heat endurance of Reflow soldering | Peak temperature 260+0/-5, tested twice. L/L 10% (Mn-Zn: 30%), Q/Q 30%, DCR/DCR 10%. | |||||
| Resistance to solvent test | Dipped in IPA solvent, dried, then brushed 10 times. No case deformation or appearance change. | |||||
| Overload test | Apply twice rated current for 5 minutes. No smoke, smell, or fire. Characteristics normal after test. | |||||
| Voltage resistance test | DC1000V, Current: 1mA, Time: 1Min. No breakdown. Characteristics normal after test. | |||||
| Recommended Reflow Soldering Curve | Provided graph shows recommended conditions; users should adjust based on their equipment and process. | |||||
| Reminders for Using Products | Storage Period & Conditions | Within 12 months, 5~40C, 35~65% RH. Solderability may deteriorate after storage period. | ||||
| Environmental Conditions | Avoid use/storage in gas corrosive environments (salt, acid, alkali). | |||||
| Handling Electrodes | Avoid direct contact with bare hands to prevent solderability issues. | |||||
| Handling Products | Handle carefully to prevent damage from dropping or improper removal. | |||||
| Terminal Bending | Do not bend terminals excessively to avoid wire fracture. | |||||
| Cleaning | Do not rinse coils; contact manufacturer if cleaning is necessary. | |||||
| Magnetic Fields | Do not expose products to magnets or magnetic fields. | |||||
| Preheating | Ensure preheating before soldering; temperature difference between solder and chip should not exceed 150C. | |||||
| Soldering Corrections | Corrections after mounting should be within specified conditions. Overheating may cause issues. | |||||
| Self Heating | Device self-heats when powered on; ensure sufficient thermal design margin. | |||||
| Non-Magnetic Shield Type Layout | Careful coil layout is needed to prevent malfunction due to magnetic interference. |
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina