Product Overview

The STC303020 series T-core molding structure power inductors from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are designed for high-density installation applications. They feature a thin profile with low DC resistance and ultra-high current capability, along with magnetic shielding for strong anti-electromagnetic interference. These inductors offer high reliability and excellent vibration resistance due to their T-core molding structure, and boast extremely low DCR and ultra-low AC losses, making them suitable for high switching frequencies. They are compliant with RoHS, Halogen Free, and REACH standards.

Product Attributes

• Brand: LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
• Product Type: T-core molding Structure Power Inductors
• Certifications: RoHS, Halogen Free, REACH Compliance
• Origin: Shenzhen, China (implied by company location)

Technical Specifications

Applications

• DC/DC converter for CPU in Notebook PC
• Phones, tablets, HDDs, DVCs, PDAs, 5G modules
• Server, base station, etc.
• Various DC-DC conversion power modules

Environmental Data

• Operating Temperature: -40 to +125 (Including coils self-temperature rise)

Dimensions (STC303020)

Packaging Information

• Packing Types: Bulk Package (B), Tape & Reel (T)
• Tape & Reel Dimensions: Refer to provided diagrams for specific dimensions.
• Packing Quantity (STC303020): 3000 PCS per Reel, 9000 PCS per Inside Box, 36,000 PCS per Outside Carton.

Reliability Testing Summary

• Terminal Strength: Tested according to GB/T 2423.60-2008 standards for SMT and DIP.
• Resistance to Flexure: Tested according to JIS C 5321:1997 standards.
• Dropping Test: Tested according to GB/T 2423.7-2018 standards.
• Solderability: Tested according to GB/T 2423.28-2005 standards.
• Vibration Test: Tested according to GB/T 2423.10-2019 standards.
• Thermal Shock: Tested according to GB/T 2423.22-2012 Method Na.
• Low Temperature Storage: Tested according to GB/T 2423.1-2008 Method Ab.
• High Temperature Storage: Tested according to GB/T 2423.2-2008 Method Bb.
• Damp Heat (Steady States): Tested according to GB/T 2423.3-2016 standards.
• Heat endurance of Reflow soldering: Tested according to GJB 360B-2009 standards.
• Resistance to solvent test: Tested according to IEC 68-2-45:1993 standards.
• Overload test: Tested according to JIS C5311-6.13 standards.
• Voltage resistance test: Tested according to MIL-STD-202G Method 301 standards.

Recommended Reflow Soldering Curve

The recommended reflow conditions are provided in the datasheet. Users should adjust and confirm these conditions based on their specific environment and equipment.

Reminders for Using These Products

• Storage: Within 12 months, at 5~40C and 35-65% RH.
• Environment: Avoid gas corrosive environments (salt, acid, alkali, etc.).
• Handling: Avoid direct contact with terminals due to hand oils. Handle with care to prevent damage.
• Terminal Bending: Do not excessively bend terminals to prevent wire fracture.
• Cleaning: Do not rinse coils; contact the manufacturer if cleaning is necessary.
• Magnetic Fields: Keep away from magnets or magnetic objects.
• Preheating: Preheat components before soldering; temperature difference should not exceed 150C.
• Soldering Corrections: Perform within specified conditions; overheating may cause issues.
• Thermal Design: Account for self-heating when power is on.
• Non-Magnetic Shield Type: Careful layout is needed to prevent malfunction due to magnetic interference.