Beijing Silk Road Enterprise Management Services Co., Ltd.
                                                                                                           
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Axial fixed inductor LanTu Micro AL0307-680K featuring epoxy coating and high Q for RF choke applications

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Product Description

Product Overview

The AL0307 Series Axial Fixed Inductors from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are designed for RF choke applications. These compact, lightweight inductors feature epoxy resin coating for humidity resistance and long life. They offer a wide inductance range, high Q, and self-resonant frequencies, making them suitable for automated insertion processes. Compliant with RoHS, Halogen Free, and REACH standards, these inductors are ideal for various electronic products including televisions, personal computers, radios, telephones, and chargers.

Product Attributes

  • Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
  • Product Series: AL0307 Series
  • Product Type: Leaded RF Chokes / Axial Fixed Inductors
  • Coating: Epoxy resin
  • Certifications: RoHS, Halogen Free, REACH Compliance
  • Packaging Options: Bulk Package (B), Tape Packaging (TF)

Technical Specifications

Part No Inductance (H) Tolerance Test Freq. (MHz) Q Min L/Q Max () SRF Typ (MHz) DCR Max () Rated Current Max (mA)
AL0307-1R0M 1.0 20% 25.2 40 150 740 0.15 740
AL0307-1R2M 1.2 20% 7.96 40 150 0.18 740 740
AL0307-1R5M 1.5 20% 7.96 40 150 0.20 700 700
AL0307-1R8M 1.8 20% 7.96 50 125 0.23 655 655
AL0307-2R2M 2.2 20% 7.96 50 110 0.27 630 630
AL0307-2R7M 2.7 20% 7.96 50 95 0.28 595 595
AL0307-3R3M 3.3 20% 7.96 50 70 0.30 575 575
AL0307-3R9M 3.9 20% 7.96 50 65 0.32 555 555
AL0307-4R7M 4.7 20% 7.96 50 36 0.35 530 530
AL0307-5R6M 5.6 20% 7.96 50 32 0.40 500 500
AL0307-6R8M 6.8 20% 7.96 50 28 0.48 470 470
AL0307-8R2M 8.2 20% 7.96 50 23 0.56 425 425
AL0307-100K 10 10% 7.96 50 18 0.75 370 370
AL0307-120K 12 10% 2.52 50 17 0.80 350 350
AL0307-150K 15 10% 2.52 50 16 0.93 335 335
AL0307-180K 18 10% 2.52 50 15 1.00 315 315
AL0307-220K 22 10% 2.52 50 13 1.20 285 285
AL0307-270K 27 10% 2.52 50 11 1.80 270 270
AL0307-330K 33 10% 2.52 50 10 2.20 255 255
AL0307-390K 39 10% 2.52 50 9.5 2.30 240 240
AL0307-470K 47 10% 2.52 50 8.5 2.60 205 205
AL0307-560K 56 10% 2.52 50 7.5 2.90 195 195
AL0307-680K 68 10% 2.52 50 6.5 3.30 185 185
AL0307-820K 82 10% 2.52 50 6.0 3.80 175 175
AL0307-101K 100 10% 2.52 50 5.5 4.20 165 165
AL0307-121K 120 10% 0.796 50 5.4 4.70 160 160
AL0307-151K 150 10% 0.796 50 4.7 5.40 150 150
AL0307-181K 180 10% 0.796 50 4.3 6.00 140 140
AL0307-221K 220 10% 0.796 60 4.0 7.00 130 130
AL0307-271K 270 10% 0.796 60 3.7 7.70 120 120
AL0307-331K 330 10% 0.796 60 3.4 11.1 100 100
AL0307-391K 390 10% 0.796 60 2.8 12.6 95 95
AL0307-471K 470 10% 0.796 60 2.5 14.0 90 90
AL0307-561K 560 10% 0.796 60 2.3 15.5 85 85
AL0307-681K 680 10% 0.796 60 2.0 25.3 75 75
AL0307-821K 820 10% 0.796 60 1.5 27.5 65 65
AL0307-102K 1000 10% 0.796 50 1.2 31.4 60 60
Dimensions (mm)
Part No A Max B Max C Max (mm)
AL0307 7.62 3.2 - 3.0 / 3.2
Environmental Data
Parameter Value Notes
Operating Temperature -25 to +85 Including coils self-temperature rise
Test Equipment
Parameter Equipment
Inductance (L) HP4284A, HP4285A LCR meter or equivalent
Saturation Current (Isat) & Temperature Rise Current (Irms) HP4284+42841A
Self-Resonant Frequency (SRF) HM 9461
Quality Factor (Q) HP4285A
DC Resistance (DCR) Chroma 16502 or equivalent
Packaging
Series Type Quantity (pcs) Carton Size (mm) L x W x H Parts/Box Parts/Reel Parts/Carton
AL0307 T5A 3000 440 x 275 x 392 - - 72,000
Reliability Testing
Item Requirements Test Methods and Remarks
Terminal Strength (SMT) Meet requirements without any loose terminal Pulling test based on terminal area; Solder paste thickness: 0.12mm; Force applied gradually for 101s at 1.0mm/s speed.
Terminal Strength (DIP) Meet requirements without any loose terminal Applied force based on terminal diameter (5N to 40N) for 10s.
Resistance to Flexure No visible mechanical damage Flexure: 2mm; Speed: 0.5mm/s; Keep time: 30s.
Dropping No case deformation or change in appearance; No short and no open. Drop packaged products from 1m high in 1 angle, 3 ridges and 6 surfaces, twice in each direction.
Solderability Terminals must have 95% minimum solder coverage; Wetting shall exceed 75% coverage. Solder temperature: 2402; Duration: 3s; Solder: Sn/3.0Ag/0.5Cu; Flux: 25% Resin and 75% ethanol.
Vibration Inductance change: Within 10%; Q factor change: Within 20%. Frequency 10-55 Hz, amplitude 1.5mm, 2 hours in each of 3 mutually perpendicular directions.
Thermal Shock Inductance change: Within 10%; Q factor change: Within 20%. 100 cycles of temperature transition between (85~125) and (-55~40), max transforming interval 20s.
Low temperature Storage Inductance change: Within 10%; Q factor change: Within 20%. Temperature: -55~-402; Duration: 962 hours.
High temperature Storage Inductance change: Within 10%; Q factor change: Within 20%. Temperature: 125~852; Duration: 962 hours.
Damp Heat (Steady States) Inductance change: Within 10%; Q factor change: Within 20%. Temperature: 602; Humidity: 90% to 95% RH; Duration: 962 hours.
Heat endurance of Reflow soldering L/L10%; Q/Q30% (SMD series only); DCR/DCR10%. Refer to reflow curve, twice. Peak temperature: 260+0/-5.
Resistance to solvent test No case deformation or change in appearance or obliteration of marking Dip in IPA solvent for 50.5Min, dry for 5Min, brush 10 times.
Overload test During the test no smoke, no peculiar smell, no fire; The characteristic is normal after test. Apply twice the rated current for 5 minutes.
Voltage resistance test During the test no breakdown; The characteristic is normal after test. DC1000V, Current: 1mA, Time: 1Min.
Recommended Lead-free Wave Soldering Curve (DIP-Type)
Stage Temperature Range () Time (sec)
Preheat 150 to 200 60 to 120
Soak 200 to 230 30 to 60
Wave Soldering 240 to 250 5 to 10

Reminders for Using These Products

  • Storage: Within 12 months, under conditions of 5~40C and 35~65% RH. Terminal solderability may deteriorate beyond this period.
  • Environment: Avoid use and storage in corrosive gas environments (salt, acid, alkali, etc.).
  • Handling: Avoid direct contact with terminals by bare hands due to oil secretions that can inhibit soldering. Handle products carefully to prevent damage from dropping or improper removal.
  • Terminal Bending: Do not bend terminals with excessive stress to prevent wire fracture.
  • Cleaning: Do not rinse coils. Contact the manufacturer if cleaning is necessary.
  • Magnetic Fields: Do not expose products to magnets or magnetic fields.
  • Preheating: Always preheat components before soldering. The temperature difference between solder and chip should not exceed 150C.
  • Soldering Correction: Soldering corrections after mounting should be within specified conditions. Overheating may cause short circuits, performance degradation, or reduced lifespan.
  • Self-Heating: Account for self-heating when power is applied; ensure sufficient thermal design margin.
  • Non-Magnetic Shield Type: Carefully lay out coils on the circuit board to prevent malfunctions due to magnetic interference.

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Beijing Silk Road Enterprise Management Services Co., Ltd.
Location 16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person Sellina

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