Magnetic Resin Shielded SMD Power Inductors Featuring LanTu Micro SNR4012-100MT for Low Noise Applications
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Product Description
Magnetic Resin Shielded SMD Power Inductors - SNR4012 Series
The SNR4012 Series is an automatically assembled, magnetic resin shielded SMD power inductor designed to minimize buzz noise to ultra-low levels. It features a closed magnetic circuit design that reduces leakage flux and enhances EMI resistance, while offering large current handling capabilities and low DC resistance. These space-saving and power-efficient inductors are suitable for a wide range of applications including LED backlights, flat-screen TVs, notebooks, servers, automotive systems, and DC-DC converters.
Product Attributes
- Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
- Series: SNR4012
- Construction: Magnetic-resin shielded, automatic assembly
- Certifications: RoHS, Halogen Free, REACH Compliance
Technical Specifications
| Part No. | Inductance (H) | Tolerance | Test Frequency (kHz) | Test Voltage (V) | DCR () Typical | DCR () Max | Saturation Current (A) Max | Temperature Rise Current (A) Max | Dimensions (LWH mm) | Packing |
|---|---|---|---|---|---|---|---|---|---|---|
| SNR4012-1R0M | 1.0 | 20% | 100 | 1.0 | 0.050 | 0.065 | 2.61 | 1.65 | 4.04.01.2 | Tape & Reel (T) |
| SNR4012-1R5M | 1.5 | 20% | 100 | 1.0 | 0.065 | 0.094 | 2.50 | 1.46 | 4.04.01.2 | Tape & Reel (T) |
| SNR4012-2R2M | 2.2 | 20% | 100 | 1.0 | 0.080 | 0.104 | 1.76 | 1.32 | 4.04.01.2 | Tape & Reel (T) |
| SNR4012-3R3M | 3.3 | 20% | 100 | 1.0 | 0.110 | 0.143 | 1.72 | 1.12 | 4.04.01.2 | Tape & Reel (T) |
| SNR4012-4R7M | 4.7 | 20% | 100 | 1.0 | 0.125 | 0.163 | 1.15 | 1.05 | 4.04.01.2 | Tape & Reel (T) |
| SNR4012-6R8M | 6.8 | 20% | 100 | 1.0 | 0.198 | 0.257 | 0.85 | 0.84 | 4.04.01.2 | Tape & Reel (T) |
| SNR4012-100M | 10 | 20% | 100 | 1.0 | 0.265 | 0.345 | 0.80 | 0.77 | 4.04.01.2 | Tape & Reel (T) |
| SNR4012-150M | 15 | 20% | 100 | 1.0 | 0.340 | 0.442 | 0.56 | 0.64 | 4.04.01.2 | Tape & Reel (T) |
| SNR4012-220M | 22 | 20% | 100 | 1.0 | 0.587 | 0.763 | 0.46 | 0.49 | 4.04.01.2 | Tape & Reel (T) |
| SNR4012-330M | 33 | 20% | 100 | 1.0 | 0.810 | 1.053 | 0.42 | 0.42 | 4.04.01.2 | Tape & Reel (T) |
| SNR4012-470M | 47 | 20% | 100 | 1.0 | 1.100 | 1.430 | 0.35 | 0.37 | 4.04.01.2 | Tape & Reel (T) |
Key Features & Benefits
- Magnetic-resin shielded construction reduces buzz noise to ultra-low levels.
- Large current handling and low DC resistance.
- Metallization on ferrite core provides excellent shock resistance and damage-free durability.
- Closed magnetic circuit design minimizes leakage flux and enhances EMI resistance.
- Compact size reduces PCB real estate and saves power.
- Small parasitic capacitance.
Applications
- LED backlight
- Flat-screen TVs
- Blue-ray disc, Set-top boxes
- Notebooks, Desktop computers, Servers
- Graphic cards
- Portable gaming devices
- Personal navigation systems
- Personal multimedia devices
- Automotive systems
- Telecommunication base stations
- DC-DC Converters
Environmental Data
- Operating Temperature: -40 to +125 (Including coil self-temperature rise)
Product Identification
Model Structure: SNR 4012 - [Inductance Value][Tolerance Code] [Packing Code]
- Type: SNR (Shielded SMD Power Inductors)
- Dimensions: 4012 (4.04.01.2 mm)
- Inductance Tolerance Codes: J (5%), K (10%), L (15%), M (20%), P (25%), N (30%)
- Packing Codes: B (Bulk), T (Tape & Reel)
Reliability Testing
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Terminal Strength (SMT/DIP) | Meet specified force and duration requirements without loose terminals. | Refer to GB/T 2423.60-2008. |
| Resistance to Flexure | No visible mechanical damage. | JIS C 5321:1997. Flexure: 2mm. |
| Dropping Test | No case deformation, no short/open circuit. | GB/T 2423.7-2018. 1m drop height, 1 angle, 3 ridges, 6 surfaces, twice each direction. |
| Solderability | Wetting > 75% coverage, Terminals 95% minimum solder coverage. | GB/T 2423.28-2005. Solder temp: 2402, Duration: 3 sec. |
| Vibration Test | No visible mechanical damage, Inductance change: 10%, Q factor change: 20%. | GB/T 2423.10-2019. 1.5mm amplitude, 10-55 Hz, 2 hours per direction (3 directions). |
| Thermal Shock | No visible mechanical damage, Inductance change: 10% (Mn-Zn: 30%), Q factor change: 20%. | GB/T 2423.22-2012 Method Na. 100 cycles (-55~40 to 85~125). |
| Low Temperature Storage | No visible mechanical damage, Inductance change: 10% (Mn-Zn: 30%), Q factor change: 20%. | GB/T 2423.1-2008 Method Ab. Temperature: -55~-402, Duration: 962 hours. |
| High Temperature Storage | No visible mechanical damage, Inductance change: 10% (Mn-Zn: 30%), Q factor change: 20%. | GB/T 2423.2-2008 Method Bb. Temperature: 85~1252, Duration: 962 hours. |
| Damp Heat (Steady States) | No visible mechanical damage, Inductance change: 10% (Mn-Zn: 30%), Q factor change: 20%. | GB/T 2423.3-2016. Temperature: 602, Humidity: 90%-95% RH, Duration: 962 hours. |
| Heat endurance of Reflow soldering | No significant defects, L/L10% (Mn-Zn: 30%), Q/Q30%, DCR/DCR10%. | GJB 360B-2009. Twice reflow, Peak temp: 260+0/-5. |
| Resistance to solvent test | No case deformation or change in appearance. | IEC 68-2-45:1993. Dip in IPA solvent for 50.5Min, dry 5Min, brush 10 times. |
| Overload test | No smoke, smell, or fire during test. Characteristics normal after test. | JIS C5311-6.13. Apply twice rated current for 5 minutes. |
| Voltage resistance test | No breakdown during test. Characteristics normal after test. | MIL-STD-202G Method 301. DC1000V, Current: 1mA, Time: 1Min. |
Recommended Reflow Soldering Curve
Users should adjust and confirm reflow conditions based on their specific equipment and environment. The provided curve is a general guideline.
Reminders for Using These Products
- Storage: Within 12 months, at 5~40C and 35~65% RH.
- Environment: Avoid gas corrosive environments (salt, acid, alkali).
- Handling: Avoid direct contact with terminals to maintain solderability. Handle carefully to prevent damage.
- Terminals: Do not bend terminals excessively.
- Cleaning: Do not rinse coils; contact the manufacturer if cleaning is necessary.
- Magnetic Fields: Keep away from magnets or magnetic objects.
- Preheating: Ensure preheating before soldering; temperature difference between solder and chip should not exceed 150C.
- Soldering Corrections: Perform within specified conditions to avoid performance degradation.
- Thermal Design: Account for self-heating when the device is powered on.
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina