Molding SMD Power Inductor LanTu Micro SMS0518-R56M Ultra High Current Thin Profile High Reliability
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Product Description
Molding SMD Power Inductors - SMS0518 Series
Product Overview
The SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. SMS0518 Series offers ultra-high current SMD power inductors designed for high-density installations. These inductors feature a thin profile with low DC resistance and ultra-high current capability. Their magnetic shielding provides strong anti-electromagnetic interference, while the integral construction ensures high reliability and excellent vibration resistance. The composite structure minimizes buzz noise, and the use of low-loss alloy powder in a die-casting process results in low impedance and small parasitic capacitance, leading to high efficiency. These inductors are suitable for frequencies up to 3MHz and have an absolute maximum voltage of 30VDC. They are RoHS, Halogen Free, and REACH compliant.
Product Attributes
- Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
- Series: SMS0518
- Type: Molding SMD Power Inductor
- Certifications: RoHS, Halogen Free, REACH Compliance
- Origin: Shenzhen, China (implied by company name and location)
Technical Specifications
| Item | Specification |
|---|---|
| Product Series | SMS0518 |
| Features | Low RDC, Ultra-high current, Thin design, Magnetic shielding, High reliability, High vibration resistance, Ultra-low buzz noise, Low impedance, Small parasitic capacitance, High efficiency, Frequency up to 3MHz |
| Absolute Maximum Voltage | 30VDC |
| Operating Temperature | -55 to +125 (Including coils self-temperature rise) |
| Applications | PDA, notebook, desktop, server applications, High current POL converters, Battery powered devices, DC/DC converters in distributed power systems |
| External Dimensions (LWH) | 5.55.21.8 mm (for SMS0518 series) |
| Inductance Tolerance | J: 5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30% |
| Packaging | Bulk Package (B), Tape & Reel (T) |
| Test Equipment - L | WK3260B LCR meter or equivalent |
| Test Equipment - Isat & Irms | WK3260B+WK3265B or equivalent |
| Test Equipment - DCR | Chroma 16502 or equivalent |
| Recommended Reflow Soldering Curve | Refer to provided graph (User adjustment recommended based on environment/equipment) |
| Storage Period | Within 12 months (Conditions: 5~40C, 35~65% RH) |
Specifications Table
| Part No | Inductance (H) | Inductance Tolerance | DCR (m) Typical | DCR (m) Max | Saturation Current (A) Typical | Heat Rating Current (A) Typical |
|---|---|---|---|---|---|---|
| SMS0518-R33M | 0.33 | 20% | 6.0 | 7.0 | 17.0 | 12.0 |
| SMS0518-R47M | 0.47 | 20% | 7.7 | 9.0 | 15.5 | 10.5 |
| SMS0518-R56M | 0.56 | 20% | 8.0 | 10.0 | 15.0 | 9.5 |
| SMS0518-R68M | 0.68 | 20% | 10.0 | 12.0 | 12.0 | 9.0 |
| SMS0518-1R0M | 1.00 | 20% | 15.0 | 17.0 | 9.0 | 8.0 |
| SMS0518-1R5M | 1.50 | 20% | 21.0 | 26.0 | 9.0 | 7.5 |
| SMS0518-2R2M | 2.20 | 20% | 30.0 | 35.0 | 6.5 | 5.0 |
| SMS0518-3R3M | 3.30 | 20% | 52.0 | 58.0 | 5.0 | 4.5 |
| SMS0518-4R7M | 4.70 | 20% | 78.0 | 85.0 | 4.0 | 3.5 |
| SMS0518-6R8M | 6.80 | 20% | 107.0 | 120.0 | 3.4 | 2.8 |
| SMS0518-100M | 10.00 | 20% | 140.0 | 155.0 | 3.0 | 2.5 |
| SMS0518-150M | 15.00 | 20% | 240.0 | 260.0 | 2.2 | 1.8 |
Shape and Dimensions (mm)
| Part No | A | B | C | D (Typ) | E (Typ) | F | G | H |
|---|---|---|---|---|---|---|---|---|
| SMS0518 | 5.500.30 | 5.200.20 | 1.80Max | 2.30 | 1.20 | 3.00 | 7.00 | 2.50 |
Packaging Specifications
| Part No | Tape Dimension W (mm) | Tape Dimension P (mm) | Tape Dimension W1 (mm) | Reel Dimensions A (mm) | Reel Dimensions B (mm) | Reel Dimensions C (mm) | Reel Dimensions D (mm) | REEL (PCS) | Inside Box (PCS) | Outside Carton (PCS) |
|---|---|---|---|---|---|---|---|---|---|---|
| SMS0518 | 12.0 | 8.0 | 5.5 | 12.4 | 100 | 13 | 330 | 2000 | 8000 | 32,000 |
Reliability Testing Summary
| Test Item | Requirements | Test Method Summary |
|---|---|---|
| Terminal Strength | Meet specified force and duration requirements without loose terminal. | Pulling test (SMT/DIP), Solder paste thickness check. |
| Resistance to Flexure | No visible mechanical damage. | Apply specified flexure force and speed to soldered inductor. |
| Dropping | No case deformation, change in appearance, short, or open circuit. | Drop packaged products from 1m height in specified angles/surfaces. |
| Solderability | Minimum 75% wetting coverage, 95% minimum solder coverage on terminals. | Dip in specified solder at 2402 for 3 sec. |
| Vibration | No visible mechanical damage. Inductance change within 10%, Q factor change within 20%. | Subject to simple harmonic motion (10-55 Hz) for 2 hours in 3 directions. |
| Thermal Shock | No visible mechanical damage. Inductance change within 10% (Mn-Zn: 30%), Q factor change within 20%. | 100 cycles of temperature extremes (-55~40 to 85~125). |
| Low Temperature Storage | No visible mechanical damage. Inductance change within 10% (Mn-Zn: 30%), Q factor change within 20%. | Store at -55~-402 for 962 hours. |
| High Temperature Storage | No visible mechanical damage. Inductance change within 10% (Mn-Zn: 30%), Q factor change within 20%. | Store at 85~1252 for 962 hours. |
| Damp Heat (Steady States) | No visible mechanical damage. Inductance change within 10% (Mn-Zn: 30%), Q factor change within 20%. | 602, 90-95% RH for 962 hours. |
| Heat endurance of Reflow soldering | No significant defects. L/L 10% (Mn-Zn: 30%), Q/Q 30%, DCR/DCR 10%. | Subject to reflow soldering twice (peak temp 260+0/-5). |
| Resistance to solvent test | No case deformation, change in appearance, or obliteration of marking. | Dip in IPA solvent for 5 min, dry for 5 min, brush 10 times. |
| Overload test | No smoke, peculiar smell, or fire during test. Characteristics normal after test. | Apply twice rated current for 5 minutes. |
| Voltage resistance test | No breakdown during test. Characteristics normal after test. | DC1000V, Current: 1mA, Time: 1Min. |
Reminders for Using These Products
- Storage: Within 12 months, under 5~40C and 35~65% RH. Solderability may deteriorate after storage period.
- Environment: Avoid use and storage in gas corrosive environments (salt, acid, alkali, etc.).
- Handling: Avoid direct contact with terminals due to hand oils affecting solderability. Handle products carefully to prevent damage.
- Terminal Bending: Do not bend terminals excessively to prevent wire fracture.
- Cleaning: Do not rinse coils; contact manufacturer if cleaning is necessary.
- Magnetic Fields: Do not expose products to magnets or magnetic fields.
- Preheating: Preheat components before soldering. Temperature difference between solder and chip should not exceed 150C.
- Soldering Corrections: Perform after mounting within specified conditions. Overheating may cause short circuits, performance degradation, or reduced lifespan.
- Thermal Design: Allow sufficient margin for self-heating (temperature increase) when power is ON.
- Layout (Non-magnetic Shield Type): Careful coil placement on the PCB is required to prevent malfunctions due to magnetic interference.
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina