LanTu Micro STC303020 1R0MT magnetic shielding T core molding structure power inductors for low AC losses

T-core Molding Structure Power Inductors

Product Overview

The STC303020 series T-core molding structure power inductors from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are designed for high-density installation and offer a thin profile with low DC resistance and ultra-high current capabilities. Featuring magnetic shielding for strong anti-electromagnetic interference, these inductors provide high reliability and excellent vibration resistance due to their T-core molding structure. They are ideal for applications requiring extremely low DCR and ultra-low AC losses at high switching frequencies. These inductors comply with RoHS, Halogen Free, and REACH standards.

Product Attributes

• Brand: LANTU MICRO ELECTRIC TECHNOLOGY
• Origin: SHENZHEN, CHINA
• Certifications: RoHS, Halogen Free, REACH Compliance
• Structure: T-core molding structure
• Shielding: Magnetic shielding type

Applications

• DC/DC converters for CPU in Notebook PCs
• Mobile phones, tablets, HDDs, DVCs, PDAs, 5G modules
• Servers, base stations
• Various DC-DC conversion power modules

Environmental Data

• Operating Temperature: -40 to +125 (including coil self-temperature rise)

Technical Specifications

Product Identification

STC 303020 1R0 M T

• Type: STC (T-CORE molding Structure Power Inductors)
• Inductance: 1.0 uH
• External Dimensions (LWH): 303020 (3.03.02.0 mm)
• Inductance Tolerance: J:5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30%
• Packing: B (Bulk Package), T (Tape & Reel)

Specifications

Definitions:

• Saturation Current: DC current at which inductance drops 30% from its value without current.
• Heat Rating Current: The actual value of DC current when the temperature rise is T 40 (Ta=25).
• Rated DC Current: The lesser value of Isat or Irms.
• Note: Circuit design, component, PCB trace size and thickness, airflow, and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.

Shape and Dimensions

(Dimensions are in mm)

Reliability Testing

Terminal Strength: Meets specified force and duration requirements for SMT and DIP terminals without loose connections.

Resistance to Flexure: No visible mechanical damage after applying flexure of 2mm at 0.5mm/sec for 30 sec.

Dropping: No case deformation, change in appearance, short, or open circuit after dropping packaged products from 1m height.

Solderability: Wetting shall exceed 75% coverage, terminals must have 95% minimum solder coverage after immersion in solder at 2402 for 3 sec.

Vibration: No visible mechanical damage, inductance change within 10%, Q factor change within 20% after vibration testing.

Thermal Shock: No visible mechanical damage, inductance change within 10% (Mn-Zn: 30%), Q factor change within 20% after 100 cycles of thermal shock (-55~40 to 85~125).

Low Temperature Storage: No visible mechanical damage, inductance change within 10% (Mn-Zn: 30%), Q factor change within 20% after 962 hours at -55~-402.

High Temperature Storage: No visible mechanical damage, inductance change within 10% (Mn-Zn: 30%), Q factor change within 20% after 962 hours at 85~1252.

Damp Heat (Steady States): No visible mechanical damage, inductance change within 10% (Mn-Zn: 30%), Q factor change within 20% after 962 hours at 602 and 90% to 95% RH.

Heat endurance of Reflow soldering: No significant defects in appearance, L/L10% (Mn-Zn: L/L30%), Q/Q30% (SMD series only), DCR/DCR10% after reflow soldering twice with peak temperature 260+0/-5.

Resistance to solvent test: No case deformation, change in appearance, or obliteration of marking after dipping in IPA solvent and brushing.

Overload test: No smoke, peculiar smell, or fire during test; characteristics normal after test (applied twice rated current for 5 minutes).

Voltage resistance test: No breakdown during test; characteristics normal after test (DC1000V, Current: 1mA, Time: 1Min).

Recommended Reflow Soldering Curve

The recommended reflow conditions are provided as a guideline. Users should adjust and confirm according to their specific environment, equipment, and process conditions.

Reminders for Using These Products

• Storage: Within 12 months under conditions of 5~40C and 35~65% RH. Solderability may deteriorate beyond this period.
• Environment: Avoid use or storage in corrosive gas environments (salt, acid, alkali, etc.).
• Handling: Avoid direct contact with terminals by bare hands due to oil secretions. Handle products carefully to prevent damage from dropping or improper removal. Do not bend terminals excessively.
• Cleaning: Do not rinse coils. Contact the manufacturer if cleaning is necessary.
• Magnetism: Do not expose products to magnets or magnetic fields.
• Preheating: Preheat components before soldering. The temperature difference between solder and chip should not exceed 150C.
• Soldering Corrections: Perform corrections within specified conditions. Overheating may cause short circuits, performance degradation, or reduced lifespan.
• Thermal Design: Account for self-heating when power is on; ensure sufficient thermal design margins.
• Non-Magnetic Shield Type: Carefully lay out coils on the circuit board to prevent malfunctions due to magnetic interference.