Beijing Silk Road Enterprise Management Services Co., Ltd.
                                                                                                           
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LanTu Micro SMS1770 100MT molding SMD power inductors with RoHS Halogen Free and REACH certifications

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Product Description

Molding SMD Power Inductors - SMS1770 Series

Product Overview

The SMS1770 Series by SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. offers ultra-high current SMD power inductors featuring a thin design with low DC resistance and superior current handling capabilities. These magnetically shielded inductors provide strong anti-electromagnetic interference, making them ideal for high-density installations. Their integrated construction ensures high reliability and excellent vibration resistance, while the composite structure minimizes buzz noise. Designed for high efficiency, these inductors utilize low-loss alloy powder for die-casting, resulting in low impedance, small parasitic capacitance, and reduced eddy-current loss. They are suitable for frequencies up to 3MHz and have an absolute maximum voltage of 30VDC. The series is RoHS, Halogen Free, and REACH compliant.

Applications

  • PDA, notebook, desktop, server applications
  • High current POL converters
  • Battery powered devices
  • DC/DC converters in distributed power systems

Product Attributes

  • Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
  • Series: SMS1770
  • Type: Molding SMD Power Inductor
  • Certifications: RoHS, Halogen Free, REACH Compliance

Technical Specifications

Part No. Inductance (H) @0A Tolerance DCR (m) Typical DCR (m) Max Saturation Current (A) Typical Heat Rating Current (A) Typical Dimensions (LWH) (mm) Operating Temperature (C) Absolute Maximum Voltage (VDC)
SMS1770-R22M 0.22 20% 0.63 0.75 75.00 57.00 17.5017.157.50 -55 to +125 30
SMS1770-R47M 0.47 20% 0.90 1.03 72.00 55.00 17.5017.157.50 -55 to +125 30
SMS1770-1R0M 1.0 20% 1.60 2.30 55.00 32.00 17.5017.157.50 -55 to +125 30
SMS1770-1R5M 1.5 20% 1.78 2.50 48.00 31.00 17.5017.157.50 -55 to +125 30
SMS1770-2R2M 2.2 20% 2.40 2.70 34.00 29.00 17.5017.157.50 -55 to +125 30
SMS1770-3R3M 3.3 20% 3.68 4.20 30.00 24.00 17.5017.157.50 -55 to +125 30
SMS1770-4R7M 4.7 20% 4.84 5.50 24.00 21.00 17.5017.157.50 -55 to +125 30
SMS1770-5R6M 5.6 20% 6.68 7.60 23.00 20.00 17.5017.157.50 -55 to +125 30
SMS1770-6R8M 6.8 20% 8.40 9.20 22.00 17.00 17.5017.157.50 -55 to +125 30
SMS1770-8R2M 8.2 20% 10.10 11.60 20.00 13.00 17.5017.157.50 -55 to +125 30
SMS1770-100M 10 20% 11.60 13.00 19.00 12.00 17.5017.157.50 -55 to +125 30
SMS1770-150M 15 20% 18.80 20.50 14.50 11.00 17.5017.157.50 -55 to +125 30
SMS1770-220M 22 20% 25.10 26.50 11.50 8.50 17.5017.157.50 -55 to +125 30
SMS1770-330M 33 20% 38.00 44.00 10.00 8.00 17.5017.157.50 -55 to +125 30
SMS1770-470M 47 20% 48.00 55.00 7.50 6.00 17.5017.157.50 -55 to +125 30
SMS1770-560M 56 20% 54.00 62.00 7.00 5.50 17.5017.157.50 -55 to +125 30
SMS1770-680M 68 20% 68.00 80.00 6.50 5.20 17.5017.157.50 -55 to +125 30
SMS1770-101M 100 20% 110.00 118.00 5.00 3.70 17.5017.157.50 -55 to +125 30

Note on Current Ratings:

  • Saturation Current: DC current at which inductance drops 30% from its value without current.
  • Heat Rating Current: The actual value of DC current when the temperature rise is T 40 (Ta=25).
  • Rated DC Current: The lesser value between Isat or Irms.
  • Special Remind: Circuit design, component, PCB trace size and thickness, airflow, and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.

Packaging

Available in Bulk Package (B) and Tape & Reel (TF).

Reliability Testing

The SMS1770 Series undergoes rigorous testing including Terminal Strength, Resistance to Flexure, Dropping, Solderability, Vibration, Thermal Shock, Low Temperature Storage, High Temperature Storage, Damp Heat (Steady States), Heat endurance of Reflow soldering, Resistance to solvent test, Overload test, and Voltage resistance test, adhering to various international standards.

Recommended Reflow Soldering Curve

Refer to the provided graph for recommended reflow conditions. Adjustments may be necessary based on specific user environments and equipment.

Reminders for Using These Products

  • Storage: Within 12 months, under conditions of 5~40C and 35~65% RH.
  • Environment: Avoid use and storage in gas corrosive environments (salt, acid, alkali, etc.).
  • Handling: Avoid direct contact with terminals to prevent reduced solderability due to hand oils. Handle with care to prevent damage.
  • Bending: Do not excessively bend terminals to avoid wire fracture.
  • Cleaning: Do not rinse coils; contact the manufacturer if cleaning is necessary.
  • Magnetism: Keep away from magnets or magnetic objects.
  • Preheating: Ensure preheating before soldering, with a temperature difference not exceeding 150C between solder and chip temperature.
  • Corrections: Soldering corrections after mounting should be within specified conditions to avoid performance degradation.
  • Thermal Design: Account for self-heating when power is on.
  • Layout: For non-magnetic shield types, careful coil placement on the PCB is necessary to prevent malfunctions due to magnetic interference.

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Beijing Silk Road Enterprise Management Services Co., Ltd.
Location 16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person Sellina

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