Shielded SMD Power Inductors LanTu Micro SMRH4D28-100NT Designed for Portable Devices and OA Equipment

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Product Description

Product Overview

The SMRH4D28 Series Shielded SMD Power Inductors from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are designed for surface mounting applications. These inductors feature a closed magnetic circuit design to minimize leakage flux, high saturation current, and low DC resistance. They are available in various package sizes and a wide inductance range, making them suitable for power supplies in VTRs, OA equipment, notebook PCs, portable communication devices, and DC/DC converters.

Product Attributes

Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
Series: SMRH4D28
Type: Shielded SMD Power Inductors
Certifications: RoHS, Halogen Free, REACH Compliance
Origin: Shenzhen, China (implied by company name and location)

Technical Specifications

Part No.	Inductance (H)	Tolerance	Test Freq.	DCR Max ()	Saturation Current Max (A)	Temperature Rise Current Max (A)	Dimensions (LWH mm)
SMRH4D28-1R5N	1.5	30%	100KHz	0.023	2.56	2.56	5.05.03.0
SMRH4D28-2R2N	2.2	30%	100KHz	0.031	2.04	2.04	5.05.03.0
SMRH4D28-3R3N	3.3	30%	100KHz	0.049	1.57	1.57	5.05.03.0
SMRH4D28-3R9N	3.9	30%	100KHz	0.064	1.44	1.44	5.05.03.0
SMRH4D28-4R7N	4.7	30%	100KHz	0.072	1.32	1.32	5.05.03.0
SMRH4D28-6R8N	6.8	30%	100KHz	0.441	1.12	1.12	5.05.03.0
SMRH4D28-8R2N	8.2	30%	100KHz	0.694	1.04	1.04	5.05.03.0
SMRH4D28-100N	10	30%	100KHz	0.709	1.00	1.00	5.05.03.0
SMRH4D28-120M	12	20%	100KHz	0.131	0.84	0.84	5.05.03.0
SMRH4D28-150M	15	20%	100KHz	0.149	0.76	0.76	5.05.03.0
SMRH4D28-180M	18	20%	100KHz	0.166	0.72	0.72	5.05.03.0
SMRH4D28-220M	22	20%	100KHz	0.235	0.70	0.70	5.05.03.0
SMRH4D28-270M	27	20%	100KHz	0.261	0.58	0.58	5.05.03.0
SMRH4D28-330M	33	20%	100KHz	0.378	0.56	0.56	5.05.03.0
SMRH4D28-390M	39	20%	100KHz	0.383	0.50	0.50	5.05.03.0
SMRH4D28-470M	47	20%	100KHz	0.587	0.48	0.48	5.05.03.0
SMRH4D28-560M	56	20%	100KHz	0.624	0.41	0.41	5.05.03.0
SMRH4D28-680M	68	20%	100KHz	0.699	0.35	0.35	5.05.03.0
SMRH4D28-820M	82	20%	100KHz	0.914	0.32	0.32	5.05.03.0
SMRH4D28-101M	100	20%	100KHz	1.102	0.29	0.29	5.05.03.0
SMRH4D28-121M	120	20%	100KHz	1.127	0.27	0.27	5.05.03.0
SMRH4D28-151M	150	20%	100KHz	1.135	0.24	0.24	5.05.03.0
SMRH4D28-181M	180	20%	100KHz	1.154	0.22	0.22	5.05.03.0
Environmental Data:
Operating Temperature: -40 to +125 (Including coils self-temperature rise)
Dimensions (mm):
Part No. \| A (Max) \| B (Max) \| C (Max) \| D (Max) \| E \| F \| G \| H \| J
SMRH4D28	5.0	5.0	3.0	6.9	4.5	1.5	5.3	1.9	1.5
Product Identification: SMRH 4D28 [Inductance] [Tolerance] [Packing]
Tolerance Codes: J:5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30%
Packing Codes: T: Tape & Reel, B: Bulk Package
Test Equipment: LCR Meter (HP4284A, HP4285A or equivalent), Current Meter (HP4284+42841A or equivalent), DCR Meter (Chroma 16502 or equivalent)
Definitions:
Saturation Current: DC current at which inductance drops 35% from its value without current.
Temperature Rise Current: The actual value of DC current when the temperature rise is T 40 (Ta=25).
Rated DC Current: The lesser value of Isat or Irms.

Packaging Specifications

Part No.	Tape Dimension W (mm)	Tape Dimension P (mm)	Tape Dimension W1 (mm)	Reel Dimensions A (mm)	Reel Dimensions B (mm)	Reel Dimensions C (mm)	Reel Dimensions D (mm)	Reel (PCS)	Inside Box (PCS)	Outside Carton (PCS)
SMRH4D28	12	8	5.5	12.4	100	13	330	2000	8,000	32,000

Tape and Reel Specifications:

Cover tape peel force: 10 to 120g
Noodle strip peeling angle: 165 to 180

Reliability Testing

Item	Requirements	Test Methods and Remarks
Terminal Strength (SMT)	Meet requirements without any loose terminal.	Pulling test based on sectional area of terminal (GB/T 2423.60-2008). Solder paste thickness: 0.12mm. Keep time: 101s, Speed: 1.0mm/s.
Terminal Strength (DIP)	Meet requirements without any loose terminal.	Applied force based on terminal diameter (GB/T 2423.60-2008). Keep time: 10 sec.
Resistance to Flexure	No visible mechanical damage.	Flexure: 2mm. Pressurizing Speed: 0.5mm/sec. Keep time: 30 sec (JIS C 5321:1997).
Dropping	No case deformation or change in appearance. No short and no open.	Drop packaged products from 1m high in 1 angle, 3 ridges and 6 surfaces, twice in each direction (GB/T 2423.7-2018).
Solderability	Wetting shall exceed 75% coverage. Terminals must have 95% minimum solder coverage.	Solder temperature: 2402. Duration: 3 sec. Solder: Sn/3.0Ag/0.5Cu. Flux: 25% Resin and 75% ethanol (GB/T 2423.28-2005).
Vibration	No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%.	Simple harmonic motion, 10 to 55 Hz, 1.5mm amplitude, 2 hours in each of 3 mutually perpendicular directions (GB/T 2423.10-2019).
Thermal Shock	No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%.	100 cycles of temperature shock between -55~40 and 85~125. Transforming interval: Max. 20 sec (GB/T 2423.22-2012 Method Na).
Low temperature Storage	No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%.	Temperature: -55~-402. Duration: 962 hours (GB/T 2423.1-2008 Method Ab).
High temperature Storage	No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%.	Temperature: 125~852. Duration: 962 hours (GB/T 2423.2-2008 Method Bb).
Damp Heat (Steady States)	No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%.	Temperature: 602. Humidity: 90% to 95% RH. Duration: 962 hours (GB/T 2423.3-2016).
Heat endurance of Reflow soldering	No significant defects in appearance. L/L10% (Mn-Zn: L/L30%). Q/Q30% (SMD series only). DCR/DCR10%.	Reflow twice. Peak temperature: 260+0/-5 (GJB 360B-2009).
Resistance to solvent test	No case deformation or change in appearance or obliteration of marking.	Dip into IPA solvent for 50.5Min, dry for 5Min, then brush 10 times (IEC 68-2-45:1993).
Overload test	During test: no smoke, no peculiar smell, no fire. Characteristics normal after test.	Apply twice rated current for 5 minutes (JIS C5311-6.13).
Voltage resistance test	During test: no breakdown. Characteristics normal after test.	DC1000V, Current: 1mA, Time: 1Min (MIL-STD-202G Method 301).

Usage Reminders

Storage: Within 12 months, at 5~40C and 35~65% RH. Soldering of terminal electrodes may deteriorate if storage period elapses.
Environment: Do not use or store in gas corrosive environments (salt, acid, alkali, etc.).
Handling: Avoid direct contact with terminals using bare hands due to oil secretions. Handle products carefully to prevent damage from dropping or improper removal.
Terminal Bending: Do not bend terminals with excessive stress to avoid wire fracture.
Cleaning: Do not rinse coils. Contact the manufacturer if cleaning is necessary.
Magnetic Fields: Do not expose products to magnets or magnetic fields.
Preheating: Preheat components before soldering. The temperature difference between solder and chip temperature should not exceed 150C.
Soldering Corrections: Corrections after mounting should be within specification conditions. Overheating may cause short circuits, performance degradation, or reduced lifespan.
Thermal Design: Self-heating occurs when power is ON; ensure sufficient thermal design tolerance.
Non-Magnetic Shield Type: Carefully lay out coils on the circuit board to prevent malfunctions due to magnetic interference.